50Ω to 100Ω balun for UWB 3GHz to 8GHz

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  • The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 GHz.

    This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.

    Key Features

    • Very low profile
    • High RF performance
    • PCB space saving
    • Efficient manufacturability
    • LGA footprint compatible
    • Low thickness ≤ 450 µm

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Part Number
Package
Packing Type
Minimum Sellable Quantity
Marketing Status
Budgetary Price (US$)*
Quantity
ECCN (US)
Country of Origin
Order from Distributors
Order from ST
BAL-UWB-01E3 FLIP CHIP BUMPLESS CSPG Tape And Reel 5000
Active
0.2135 500 EAR99 CHINA Check Availability

Distributor availability ofBAL-UWB-01E3

Distributor Name
Region Stock Min. Order Third party link
DIGIKEY WORLDWIDE 4971 1 Order Now
AVNET AMERICA 5000 0 Order Now
MOUSER WORLDWIDE 4989 1 Order Now

Distributor reported inventory date: 2019-08-08

Distributor Name

DIGIKEY

Stock

4971

Min.Order

1

Region

WORLDWIDE Order Now

AVNET

Stock

5000

Min.Order

0

Region

AMERICA Order Now

MOUSER

Stock

4989

Min.Order

1

Region

WORLDWIDE Order Now

Distributor reported inventory date: 2019-08-08

Buy now

BAL-UWB-01E3

Package

FLIP CHIP BUMPLESS CSPG

Packing Type

Tape And Reel

Unit Price (US$)

0.2135*

Distributor availability ofBAL-UWB-01E3

Distributor Name
Region Stock Min. Order Third party link
DIGIKEY WORLDWIDE 4971 1 Order Now
AVNET AMERICA 5000 0 Order Now
MOUSER WORLDWIDE 4989 1 Order Now

Distributor reported inventory date: 2019-08-08

Distributor Name

DIGIKEY

Stock

4971

Min.Order

1

Region

WORLDWIDE Order Now

AVNET

Stock

5000

Min.Order

0

Region

AMERICA Order Now

MOUSER

Stock

4989

Min.Order

1

Region

WORLDWIDE Order Now

Distributor reported inventory date: 2019-08-08

Minimum Sellable Quantity

5000

Marketing Status

Active

Unit Price (US$)

0.2135

Quantity

500

ECCN (US)

EAR99

Country of Origin

CHINA

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

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00 Files selected for download

Technical Documentation

    • Description Version Size Action
      DS12796
      50 Ω to 100 Ω balun for UWB 3 GHz to 8 GHz
      1.0
      757.93 KB
      PDF
      DS12796

      50 Ω to 100 Ω balun for UWB 3 GHz to 8 GHz

    • Description Version Size Action
      AN4315
      BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers
      2.2
      687.23 KB
      PDF
      AN2348
      IPAD™ 400 µm Flip Chip: package description and recommendations for use
      5.0
      261.7 KB
      PDF
      AN1235
      IPAD™ 500 µm Flip Chip: package description and recommendations for use
      8.0
      251.82 KB
      PDF
      AN4315

      BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers

      AN2348

      IPAD™ 400 µm Flip Chip: package description and recommendations for use

      AN1235

      IPAD™ 500 µm Flip Chip: package description and recommendations for use

    • Description Version Size Action
      TN1173
      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches
      6.0
      444.57 KB
      PDF
      TN1173

      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches

Publications and Collaterals

    • Description Version Size Action
      Tiniest Matched Baluns for Wifi, Bluetooth & Sub-GHz 1.0
      951.55 KB
      PDF

      Tiniest Matched Baluns for Wifi, Bluetooth & Sub-GHz

    • Description Version Size Action
      Products and solutions for Smart industry 3.0
      2.99 MB
      PDF
      Semiconductor solutions for healthcare applications 1.0
      665.18 KB
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      Products and solutions for Smart industry

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Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
BAL-UWB-01E3
Active
FLIP CHIP BUMPLESS CSPG Industrial Ecopack2

BAL-UWB-01E3

Package:

FLIP CHIP BUMPLESS CSPG

Material Declaration**:

Marketing Status

Active

Package

FLIP CHIP BUMPLESS CSPG

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.