BALF-NRF01E3

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50Ω nominal input / conjugate match balun to nRF51x22-QFAA, nRF51x22-QFAC, nRF51822-QFABBx and nRF51422-QFABAx with integrated filter

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  • STMicroelectronics BALF-NRF01E3 is an ultraminiature balun. The BALF-NRF01E3 integrates matching network in a monolithic glass substrate. Matching impedance has been customized for the nRF51822-QFAA/AB/AC and nRF51422-QFAA/AB/AC RF transceivers.

    It uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance.

    Key Features

    • Low insertion loss
    • Low amplitude imbalance
    • Low phase imbalance
    • Coated CSP on glass
    • Small footprint: < 1.5 mm2
    • Benefits
      • Very low profile
      • High RF performance
      • PCB space saving versus discrete solution
      • BOM count reduction
      • Efficient manufacturability

Recommended for you

00 Files selected for download

Technical Documentation

    • Description Version Size Action
      DS10702
      50 Ω nominal input / conjugate match balun to nRF51822-QFAA/AB/AC and nRF51422-QFAA/AB/AC with integrated filter
      3.0
      578.48 KB
      PDF
      DS10702

      50 Ω nominal input / conjugate match balun to nRF51822-QFAA/AB/AC and nRF51422-QFAA/AB/AC with integrated filter

    • Description Version Size Action
      AN4315
      BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers
      2.2
      687.23 KB
      PDF
      AN2348
      IPAD™ 400 µm Flip Chip: package description and recommendations for use
      5.0
      261.7 KB
      PDF
      AN1235
      IPAD™ 500 µm Flip Chip: package description and recommendations for use
      8.0
      251.82 KB
      PDF
      AN4315

      BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers

      AN2348

      IPAD™ 400 µm Flip Chip: package description and recommendations for use

      AN1235

      IPAD™ 500 µm Flip Chip: package description and recommendations for use

    • Description Version Size Action
      TN1173
      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches
      7.0
      433.12 KB
      PDF
      TN1173

      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches

HW Model, CAD Libraries & SVD

    • Description Version Size Action
      balf-nrf01e3 OrCad Symbol and Footprint files 1.2
      13.79 KB
      ZIP

      balf-nrf01e3 OrCad Symbol and Footprint files

Publications and Collaterals

    • Description Version Size Action
      Tiniest Matched Baluns for Wifi, Bluetooth & Sub-GHz 1.0
      951.55 KB
      PDF

      Tiniest Matched Baluns for Wifi, Bluetooth & Sub-GHz

    • Description Version Size Action
      Products and solutions for Smart industry 3.0
      2.99 MB
      PDF
      Semiconductor solutions for healthcare applications 1.0
      665.18 KB
      PDF

      Products and solutions for Smart industry

      Semiconductor solutions for healthcare applications

Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
BALF-NRF01E3
Active
FLIP CHIP BUMPLESS CSPG Industrial Ecopack2

BALF-NRF01E3

Package:

FLIP CHIP BUMPLESS CSPG

Material Declaration**:

PDF XML

Marketing Status

Active

Package

FLIP CHIP BUMPLESS CSPG

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

Part Number
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Marketing Status
ECCN (US)
ECCN (EU)
Packing Type
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Temperature (°C) Minimum Sellable Quantity
Budgetary Price (US$)*/Qty
More info
min
max
BALF-NRF01E3 Available at 5 distributors

Distributor availability ofBALF-NRF01E3

Distributor Name
Region Stock Min. Order Third party link
DIGIKEY WORLDWIDE 68242 1 Order Now
RS COMPONENTS EUROPE 10000 1 Order Now
ARROW AMERICA 3005 1 Order Now
MOUSER WORLDWIDE 19878 1 Order Now
ANGLIA Live EUROPE 50 5000 Order Now

Distributor reported inventory date: 2020-08-02

Distributor Name

DIGIKEY

Stock

68242

Min.Order

1

Region

WORLDWIDE Order Now

RS COMPONENTS

Stock

10000

Min.Order

1

Region

EUROPE Order Now

ARROW

Stock

3005

Min.Order

1

Region

AMERICA Order Now

MOUSER

Stock

19878

Min.Order

1

Region

WORLDWIDE Order Now

ANGLIA Live

Stock

50

Min.Order

5000

Region

EUROPE Order Now

Distributor reported inventory date: 2020-08-02

Buy now
Active
EAR99 NEC Tape And Reel FLIP CHIP BUMPLESS CSPG - - 5000
MORE INFO

Unit Price (US$):

-

Country of Origin:

FRANCE

BALF-NRF01E3

Marketing Status

Active

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

Distributor availability ofBALF-NRF01E3

Distributor Name
Region Stock Min. Order Third party link
DIGIKEY WORLDWIDE 68242 1 Order Now
RS COMPONENTS EUROPE 10000 1 Order Now
ARROW AMERICA 3005 1 Order Now
MOUSER WORLDWIDE 19878 1 Order Now
ANGLIA Live EUROPE 50 5000 Order Now

Distributor reported inventory date: 2020-08-02

Distributor Name

DIGIKEY

Stock

68242

Min.Order

1

Region

WORLDWIDE Order Now

RS COMPONENTS

Stock

10000

Min.Order

1

Region

EUROPE Order Now

ARROW

Stock

3005

Min.Order

1

Region

AMERICA Order Now

MOUSER

Stock

19878

Min.Order

1

Region

WORLDWIDE Order Now

ANGLIA Live

Stock

50

Min.Order

5000

Region

EUROPE Order Now

Distributor reported inventory date: 2020-08-02

ECCN (EU)

NEC

Packing Type

Tape And Reel

Package

FLIP CHIP BUMPLESS CSPG

Operating Temperature (°C)

(min)

-

(max)

-

Minimum Sellable Quantity

5000

Budgetary Price (US$)* / Qty

Country of Origin

FRANCE

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors