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STMicroelectronics BALF-NRF01E3 is an ultraminiature balun. The BALF-NRF01E3 integrates matching network in a monolithic glass substrate. Matching impedance has been customized for the nRF51822-QFAA/AB/AC and nRF51422-QFAA/AB/AC RF transceivers.
It uses STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance.
Key Features
- Low insertion loss
- Low amplitude imbalance
- Low phase imbalance
- Coated CSP on glass
- Small footprint: < 1.5 mm2
- Benefits
- Very low profile
- High RF performance
- PCB space saving versus discrete solution
- BOM count reduction
- Efficient manufacturability
Sample & Buy
| Part Number | Package | Packing Type | Minimum Sellable Quantity | Marketing Status | Budgetary Price (US$)* | Quantity | ECCN (US) | Country of Origin | Order from Distributors | Order from ST |
|---|---|---|---|---|---|---|---|---|---|---|
| BALF-NRF01E3 | FLIP CHIP BUMPLESS CSPG | Tape And Reel | 5000 | Active | - | - | EAR99 | CHINA | Check Availability |
BALF-NRF01E3
Package
FLIP CHIP BUMPLESS CSPGPacking Type
Tape And ReelUnit Price (US$)
*(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
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| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| BALF-NRF01E3 | Active | FLIP CHIP BUMPLESS CSPG | Industrial | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
