-
This device is an ultra-miniature balun. The BALF-SPI2-01D3 integrates matching network and harmonics filter. Matching impedance has been customized for the ST S2-LP transceiver. The BALF-SPI2-01D3 uses STMicroelectronics IPD technology on non-conductive glass substrate which optimize RF performance.
Key Features
- 50 Ω nominal input / conjugate matched to ST S2-LP for 860 - 930 MHz frequency operation
- Low insertion loss
- Low amplitude imbalance
- Low phase imbalance
- Small footprint
- Very low profile < 620 μm after reflow
- High RF performance
- RF BOM and area reduction
- ECOPACK®2 compliant component
Featured Videos
Smart Antenna Tuning with STMicroelectronics (all LTE bands)
Antenna desense medication with ECMF™ common-mode filters integrating ESD protection
STHVDAC, STPTIC: better sensitivity and longer battery life
All tools & software
All resources
Product Specifications (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 25 Sep 2020 |
25 Sep 2020
|
Application Notes (3)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 28 Sep 2015 |
28 Sep 2015
|
|||
| 13 Sep 2018 |
13 Sep 2018
|
|||
| 11 Jan 2016 |
11 Jan 2016
|
Technical Notes & Articles (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 08 Sep 2015 |
08 Sep 2015
|
Flyers (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 25 Feb 2020 |
25 Feb 2020
|
Brochures (2)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 27 Mar 2020 |
27 Mar 2020
|
|||
| 19 Sep 2019 |
19 Sep 2019
|
EDA Symbols, Footprints and 3D Models
STMicroelectronics - BALF-SPI2-01D3
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| BALF-SPI2-01D3 |
Active
|
Chip Scale Package 0.4mm pitch | Industrial | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Minimum Sellable Quantity | Country of Origin | Budgetary Price (US$)*/Qty | More info | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||||
| BALF-SPI2-01D3 | 6 distributors |
Active
|
EAR99 | NEC | Tape And Reel | Chip Scale Package 0.4mm pitch | - | - | 5000 | FRANCE | ||||
Marketing Status
ActiveECCN (US)
EAR99Budgetary Price (US$)*/Qty
(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
