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BALF-SPI2-01D3

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50 Ω nominal input / conjugate match balun to S2-LP,868 - 930 MHz with integrated harmonic filter

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Product overview

Description

This device is an ultra-miniature balun. The BALF-SPI2-01D3 integrates matching network and harmonics filter. Matching impedance has been customized for the ST S2-LP transceiver. The BALF-SPI2-01D3 uses STMicroelectronics IPD technology on non-conductive glass substrate which optimize RF performance.

  • All features

    • 50 Ω nominal input / conjugate matched to ST S2-LP for 860 - 930 MHz frequency operation
    • Low insertion loss
    • Low amplitude imbalance
    • Low phase imbalance
    • Small footprint
    • Very low profile < 620 μm after reflow
    • High RF performance
    • RF BOM and area reduction
    • ECOPACK®2 compliant component
    Read more Read less

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      Training on antennas for Sigfox and subGHz

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      The training gives a quick and substantial introduction into the features of frequently used antennas, their characteristics and their peculiarities.

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      The training gives a quick and substantial introduction into the features of frequently used antennas, their characteristics and their peculiarities.

All resources

Expand all categories
Resource title
Latest update

Product Specifications (1)

Resource title
Latest update
DS12249 50 Ω nominal input / conjugate matched balun to ST S2-LP, 860-930 MHz with integrated harmonic filter 2.1
20 Mar 2018
20 Mar 2018
DS12249 50 Ω nominal input / conjugate matched balun to ST S2-LP, 860-930 MHz with integrated harmonic filter 2.1

Application Notes (3)

Resource title
Latest update
AN4315 BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers 2.2
13 Sep 2018
13 Sep 2018
AN4315 BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers 2.2
AN2348 IPAD™ 400 µm Flip Chip: package description and recommendations for use 5.0
13 Sep 2018
13 Sep 2018
AN2348 IPAD™ 400 µm Flip Chip: package description and recommendations for use 5.0
AN1235 IPAD™ 500 µm Flip Chip: package description and recommendations for use 8.0
22 Sep 2015
22 Sep 2015
AN1235 IPAD™ 500 µm Flip Chip: package description and recommendations for use 8.0

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Resource title
Latest update
TN1173 Packing information for IPAD, protection, rectifiers, thyristors and AC Switches 9.0
24 May 2021
24 May 2021
TN1173 Packing information for IPAD, protection, rectifiers, thyristors and AC Switches 9.0

Flyers (2)

Resource title
Latest update
TINIEST MATCHED BALUNS for WiFi, Bluetooth & Sub-GHz 1.0
05 Nov 2020
05 Nov 2020
TINIEST MATCHED BALUNS for WiFi, Bluetooth & Sub-GHz 1.0
Tiniest Matched Baluns for Wifi, Bluetooth & Sub-GHz 1.0
25 Feb 2020
25 Feb 2020
Tiniest Matched Baluns for Wifi, Bluetooth & Sub-GHz 1.0

Brochures (2)

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30 Apr 2021
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Semiconductor solutions for healthcare applications 1.0
19 Sep 2019
19 Sep 2019
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EDA Symbols, Footprints and 3D Models

STMicroelectronics - BALF-SPI2-01D3

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

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Resource title
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CAD Symbol & Footprint models (2)

Resource title
Latest update
balf-spi2-01d3 Altium Symbol and Footprint files 1.0
08 Jun 2021
08 Jun 2021
balf-spi2-01d3 Altium Symbol and Footprint files 1.0
balf-spi2-01d3 OrCad Symbol and Footprint files 1.0
07 Jun 2021
07 Jun 2021
balf-spi2-01d3 OrCad Symbol and Footprint files 1.0

Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
BALF-SPI2-01D3
Active
Chip Scale Package 0.4mm pitch Industrial Ecopack2

BALF-SPI2-01D3

Package:

Chip Scale Package 0.4mm pitch

Material Declaration**:

PDF XML
More Info

Marketing Status

Active

Package

Chip Scale Package 0.4mm pitch

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

Part Number
Order from Distributors
Order from ST
Marketing Status
ECCN (US)
ECCN (EU)
Packing Type
Package
Temperature (°C) Minimum Sellable Quantity
Budgetary Price (US$)*/Qty
More info
min
max
BALF-SPI2-01D3 Available at 1 distributors

Distributor availability ofBALF-SPI2-01D3

Distributor Name
Region Stock Min. Order Third party link
Farnell Element14 EUROPE 5796 1 Order Now

Distributor reported inventory date: 2021-06-21

Distributor Name

Farnell Element14

Stock

5796

Min.Order

1

Region

EUROPE Order Now

Distributor reported inventory date: 2021-06-21

Active
EAR99 NEC Tape And Reel Chip Scale Package 0.4mm pitch - - 5000 0.19 / 500
MORE INFO

Unit Price (US$):

0.19

Country of Origin:

FRANCE

BALF-SPI2-01D3

Marketing Status

Active

ECCN (US)

EAR99
More Info

Budgetary Price (US$)*/Qty

0.19 / 500

Distributor availability ofBALF-SPI2-01D3

Distributor Name
Region Stock Min. Order Third party link
Farnell Element14 EUROPE 5796 1 Order Now

Distributor reported inventory date: 2021-06-21

Distributor Name

Farnell Element14

Stock

5796

Min.Order

1

Region

EUROPE Order Now

Distributor reported inventory date: 2021-06-21

ECCN (EU)

NEC

Packing Type

Tape And Reel

Package

Chip Scale Package 0.4mm pitch

Operating Temperature (°C)

(min)

-

(max)

-

Minimum Sellable Quantity

5000

Budgetary Price (US$)* / Qty

0.19 / 500

Country of Origin

FRANCE

(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

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