Product overview
Description
The STM32MP157D-DK1 and STM32MP157F-DK2 Discovery kits leverage the capabilities of the increased-frequency 800 MHz microprocessors in the STM32MP157 product line to allow users to develop applications easily using STM32 MPU OpenSTLinux Distribution software for the main processor and STM32CubeMP1 software for the coprocessor.
They include an ST-LINK embedded debug tool, LEDs, push-buttons, one Ethernet 1-Gbit/s connector, one USB Type-C® OTG connector, four USB Host Type-A connectors, one HDMI® transceiver, one stereo headset jack with analog microphone, and one microSD™ connector.
To expand the functionality of the STM32MP157D-DK1 and STM32MP157F-DK2 Discovery kits, two GPIO expansion connectors are also available for ARDUINO® and Raspberry Pi® shields.
Additionally, the STM32MP157F-DK2 Discovery kit features an LCD display with a touch panel, and Wi‑Fi® and Bluetooth® Low Energy capability.
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All features
- Common features:
- STM32MP157 Arm®-based dual Cortex®‑A7 800 MHz 32 bits + Cortex®‑M4 32 bits MPU in a TFBGA361 package
- ST PMIC STPMIC1
- 4-Gbit DDR3L, 16 bits, 533 MHz
- 1-Gbit/s Ethernet (RGMII) compliant with IEEE-802.3ab
- USB OTG HS
- Audio codec
- 4 user LEDs
- 2 user and reset push-buttons, 1 wake-up button
- 5 V / 3 A USB Type-C® power supply input (not provided)
- Board connectors:
- Ethernet RJ45
- 4 × USB Host Type-A
- USB Type-C® DRP
- MIPI DSI®
- HDMI®
- Stereo headset jack including analog microphone input
- microSD™ card
- GPIO expansion connector (Raspberry Pi® shield capability)
- ARDUINO® Uno V3 expansion connectors
- On-board ST-LINK/V2-1 debugger/programmer with USB re-enumeration capability: Virtual COM port and debug port
- STM32CubeMP1 and full mainline open-source Linux® STM32 MPU OpenSTLinux Distribution (such as STM32MP1Starter) software and examples
- Support of a wide choice of Integrated Development Environments (IDEs) including IAR Embedded Workbench®, MDK-ARM, and STM32CubeIDE
- Board-specific features:
- 4" TFT 480×800 pixels with LED backlight, MIPI DSI® interface, and capacitive touch panel
- Wi‑Fi® 802.11b/g/n
- Bluetooth® Low Energy 4.1
- Common features:
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STM32MP157 running a QT graphics demo developed by KDAB on a 4” 800*480 MIPI-DSI display
STM32MP157C-DK2 running an Embedded Wizard Demo, at 800 x 480 in resolution.
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All resources
| Resource title | Version | Latest update |
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Board Manufacturing Specifications (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 3.0 | 14 Dec 2022 | 14 Dec 2022 | |
| ZIP | 2.1 | 14 Dec 2022 | 14 Dec 2022 |
Bill of Materials (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 3.0 | 14 Dec 2022 | 14 Dec 2022 |
Schematic Pack (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 1.0 | 30 Nov 2022 | 30 Nov 2022 | ||
| 1.0 | 30 Nov 2022 | 30 Nov 2022 |
Quality and Reliability
| Part Number | Marketing Status | RoHS Compliance Grade | Longevity Commitment | Longevity Starting Date | Material Declaration** |
|---|---|---|---|---|---|
| STM32MP157D-DK1 | Active | Ecopack1 | - | - | |
STM32MP157D-DK1
Package:
Ecopack1Material Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Marketing Status | Budgetary Price (US$)*/Qty | Order from ST | Order from distributors | Package | Packing Type | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | Supplier | Specific features | WEEE Compliant | Core Product | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| STM32MP157D-DK1 | | | distributors No availability of distributors reported, please contact our sales office |
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STM32MP157D-DK1 Active
(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors