Product overview
Description
The STM32MP157D-DK1 and STM32MP157F-DK2 Discovery kits leverage the capabilities of the increased-frequency 800 MHz microprocessors in the STM32MP1 Series to allow users easily develop applications using STM32 MPU OpenSTLinux Distribution software for the main processor and STM32CubeMP1 software for the co-processor. They include an ST-LINK embedded debug tool, LEDs, push-buttons, one Ethernet 1-Gbps connector, one USB Type-C® OTG connector, four USB Type-A Host connectors, one HDMI® transceiver, one stereo headset jack with analog microphone, and one microSD™ connector.
To expand the functionality of the STM32MP157D-DK1 and STM32MP157F-DK2 Discovery kits, two GPIO expansion connectors are also available for ARDUINO® and Raspberry Pi® shields.
Additionally, the STM32MP157F-DK2 Discovery kit features an LCD display with a touch panel, and Wi-Fi® and Bluetooth® Low Energy capability.
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All features
- Common features
- STM32MP157 Arm®-based dual Cortex®-A7 800 MHz 32 bits + Cortex®-M4 32 bits MPU in TFBGA361 package
- ST PMIC STPMIC1
- 4-Gbit DDR3L, 16 bits, 533 MHz
- 1-Gbps Ethernet (RGMII) compliant with IEEE-802.3ab
- USB OTG HS
- Audio codec
- 4 user LEDs
- 2 user and reset push-buttons, 1 wake-up button
- 5 V / 3 A USB Type-C® power supply input (not provided)
- Board connectors:
Ethernet RJ45 4 × USB Host Type-A USB Type-C® DRP MIPI DSISM HDMI® Stereo headset jack including analog microphone input microSD™ card GPIO expansion connector (Raspberry Pi® shield capability) ARDUINO® Uno V3 expansion connectors - On-board ST-LINK/V2-1 debugger/programmer with USB re-enumeration capability: Virtual COM port and debug port
- STM32CubeMP1 and full mainline open-source Linux® STM32 MPU OpenSTLinux Distribution (such as STM32MP1Starter) software and examples
- Support of a wide choice of Integrated Development Environments (IDEs) including IAR Embedded Workbench®, MDK-ARM, and STM32CubeIDE
- Board-specific features
- 4" TFT 480×800 pixels with LED backlight, MIPI DSISM interface, and capacitive touch panel
- Wi-Fi® 802.11b/g/n
- Bluetooth® Low Energy 4.1
- Common features
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All tools & software
All resources
| Resource title | Version | Latest update |
|---|
Board Manufacturing Specifications (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 2.0 | 21 Sep 2021 | 21 Sep 2021 | |
| ZIP | 2.0 | 21 Sep 2021 | 21 Sep 2021 |
Bill of Materials (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 2.0 | 21 Sep 2021 | 21 Sep 2021 |
Schematic Pack (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 2.0 | 13 Sep 2021 | 13 Sep 2021 |
Quality and Reliability
| Part Number | Marketing Status | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|
| STM32MP157D-DK1 | Active | Ecopack1 | |
STM32MP157D-DK1
Package:
Ecopack1Material Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Core Product | Marketing Status | Supplier | ECCN (US) | ECCN (EU) | Specific features | Country of Origin | WEEE Compliant | Budgetary Price (US$)*/Qty | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| STM32MP157D-DK1 | 2 distributors | STM32MP157DAC1 | Active | ST | 3A991.a.2 | NEC | - | CHINA | true | 69.0 / 1 |
Core Product
STM32MP157DAC1Marketing Status
ActiveBudgetary Price (US$)*/Qty
69.0 / 1(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
