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  • The VD56G3 is a global shutter image sensor optimized for near infrared scenes. The sensor captures up to 98 frames per second in a 1124 x 1364 resolution format. The pixel construction of this device minimises crosstalk.

    Key Features

    • Global shutter technology, ST proprietary single layer
    • 3D stacked sensor 40 nm/65 nm
    • 2.61 µm x 2.61 µm BSI pixel with full DTI (deep trench isolation)
    • High-performance with excellent
      • QE (quantum efficiency)
      • MTF (modulation transfer function) up to near IR
      • Perfect PLS (shutter efficiency)
    • Smallest sensor on market with 1.5 Mpixel resolution
      • Compact die size: 3.6 mm x 4.3 mm
      • 1124 pixels x 1364 pixels
      • Very small pixel array, 2.9 mm x 3.6 mm
      • Optical format ¼ inch
    • Operating junction temperature: -30 °C to 85 °C
    • Dual lane transmitter MIPI CSI-2 (copyright© 2005-2010 MIPI Alliance, Inc. Standard for Camera Serial Interface 2 (CSI-2) version 1.0) version 1.3, 1.5 Gbps per lane
    • Fast mode+ I2C control interface
    • Integrated temperature sensor
    • Up to 98 fps (frames per second) at full resolution and 240 fps with VGA resolution
    • Programmable sequences of 4-frame contexts, including frame parameters
    • Automatic dark calibration
    • Dynamic and map-based defective correction
    • Embedded auto-exposure with 336 zone statistics
    • 8 multiple function IO, dynamically programmable with frame contexts (GPIO, strobe pulse, pulse-width modulation, V sync)
    • Up to 8 illumination control outputs synchronized with sensor integration periods and master/slave external frame start
    • Mirror/flip readout
    • Fully sequenceable with frame contexts
    • Crop
    • Binning (x2 and x4)
    • Sub sampling (x2 and x4)

Sample & Buy

Part Number
Package
Packing Type
Temperature (°C) Marketing Status
ECCN (US)
Country of Origin
Budgetary Price (US$)*/Qty
Order from ST
Order from Distributors
min
max
VD56G3CC/RW GOOD DIE Tape Mounted -30 85
Preview
EAR99 FRANCE No availability of distributors reported, please contact our sales office

VD56G3CC/RW

Package

GOOD DIE

Packing Type

Tape Mounted

Budgetary Price (US$)*/Qty

Operating Temperature (°C)

(min)

-30

(max)

85

Marketing Status

Preview

Budgetary Price (US$)* / Qty

ECCN (US)

EAR99

Country of Origin

FRANCE

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

Recommended for you

00 Files selected for download

Technical Documentation

    • Description Version Size Action
      DB4116
      Advanced 1.5 Mpixel, backside illuminated Global Shutter, ultra compact sensor, with high QE, high MTF, excellent PLS, and full-features
      4.0
      2.52 MB
      PDF
      DB4116

      Advanced 1.5 Mpixel, backside illuminated Global Shutter, ultra compact sensor, with high QE, high MTF, excellent PLS, and full-features

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
VD56G3CC/RW
Preview
GOOD DIE Industrial N/A

VD56G3CC/RW

Package:

GOOD DIE

Material Declaration**:

PDF XML

Marketing Status

Preview

Package

GOOD DIE

Grade

Industrial

RoHS Compliance Grade

N/A

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.