The ASM330LHH is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope with an extended temperature range up to +105 °C and designed to address automotive non-safety applications.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes to serve both the automotive and consumer market. The ASM330LHH is AEC-Q100 compliant and industrialized through a dedicated MEMS production flow to meet automotive reliability standards. All the parts are fully tested with respect to temperature to ensure the highest quality level.
The sensing elements are manufactured using ST’s proprietary micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The ASM330LHH has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps that enables its usage in a broad range of automotive applications.
All the design aspects of the ASM330LHH have been optimized to reach superior output stability, extremely low noise and full data synchronization to the benefit of sensor-assisted applications like dead reckoning and sensor fusion.
The ASM330LHH is available in a 14-lead plastic land grid array (LGA) package.
|DS12374: Automotive 6-axis inertial module: 3D accelerometer and 3D gyroscope||3.0||1.92 MB|
|AN5296: ASM330LHH: Automotive inertial module digital 3D accelerometer and digital 3D gyroscope||1.0||1.32 MB|
|AEC-Q100-qualified for smart automotive sensors applications||01.2018||1.17 MB|
|MEMS and Sensors Smart Motion tracking, IoT and enhanced user experience||1.0||1.91 MB|
|MEMS sensors for automotive applications - brochure||1.0||2.66 MB|
|E-book about seat control systems||1.0||7.27 MB|
|AWS IoT Core||AWS||AWS IoT Core is a managed cloud platform that lets connected devices easily and securely interact with cloud applications and other devices.|
|AZURE Cloud||Microsoft||Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.|
|Watson IoT Platform||IBM||IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.|
|AndroidHAL-IIO||ST||Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)|
|C-Driver-MEMS||ST||Standard C platform-independent drivers for MEMS motion and environmental sensors|
|LinuxDriverIIO||ST||Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework)|
|Part Number||Package||Packing Type||Marketing Status||Unit Price (US$) *||Quantity||ECCN (US)||Country of Origin||More info||Order from ST||Order from Distributors|
|ASM330LHHTR||VFLGA2.5X3X.86 14L P.5 L.475X.25||Tape And Reel||Active : Product is in volume production||5||1000||EAR99||-||MORE INFO||No availability reported, please contact our Sales office|
|ASM330LHH||VFLGA2.5X3X.86 14L P.5 L.475X.25||Tray||Active : Product is in volume production||-||-||EAR99||-||MORE INFO||No availability reported, please contact our Sales office|
|Part Number||Marketing Status||Package||Grade||RoHS Compliance Grade||Material Declaration**|
|ASM330LHHTR||Active||VFLGA2.5X3X.86 14L P.5 L.475X.25||Automotive||Ecopack2|
|ASM330LHH||Active||VFLGA2.5X3X.86 14L P.5 L.475X.25||Automotive||Ecopack2|
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.