MEMS audio sensor omnidirectional digital microphone for industrial applications

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  • The IMP34DT05 is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC interface.

    The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to producing audio sensors.
    The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format.
    The IMP34DT05 is a low-distortion digital microphone with a 64 dB signal-to-noise ratio and –26 dBFS ±3 dB sensitivity.
    The IMP34DT05 is available in a top-port, SMD-compliant, EMI-shielded package and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.

    Key Features

    • Single supply voltage
    • Low power consumption
    • AOP = 122.5 dBSPL
    • 64 dB signal-to-noise ratio
    • Omnidirectional sensitivity
    • –26 dBFS ±3 dB sensitivity
    • PDM output
    • HCLGA package
      • Top-port design
      • SMD-compliant
      • EMI-shielded
      • ECOPACK, RoHS, and “Green” compliant

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IMP34DT05 HCLGA 4MM X 3 MM X 1.00 MM MICRO Tray
Preview
- - EAR99 - No availability of distributors reported, please contact our sales office
IMP34DT05TR HCLGA 4MM X 3 MM X 1.00 MM MICRO Tape And Reel
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1.4 1000 EAR99 - Check Availability

Distributor availability ofIMP34DT05TR

Distributor Name
Region Stock Min. Order Third party link
DIGIKEY WORLDWIDE 3256 1 Order Now
AVNET AMERICA 4000 0 Order Now
ARROW EUROPE 4000 0 Order Now
MOUSER WORLDWIDE 3579 1 Order Now
Farnell Element14 EUROPE 123 1 Order Now

Distributor reported inventory date: 2019-05-21

Distributor Name

DIGIKEY

Stock

3256

Min.Order

1

Region

WORLDWIDE Order Now

AVNET

Stock

4000

Min.Order

0

Region

AMERICA Order Now

ARROW

Stock

4000

Min.Order

0

Region

EUROPE Order Now

MOUSER

Stock

3579

Min.Order

1

Region

WORLDWIDE Order Now

Farnell Element14

Stock

123

Min.Order

1

Region

EUROPE Order Now

Distributor reported inventory date: 2019-05-21

Get sample

IMP34DT05

Package

HCLGA 4MM X 3 MM X 1.00 MM MICRO

Packing Type

Tray

Unit Price (US$)

*

Marketing Status

Preview

Unit Price (US$)

-

Quantity

-

ECCN (US)

EAR99

Country of Origin

-

IMP34DT05TR

Package

HCLGA 4MM X 3 MM X 1.00 MM MICRO

Packing Type

Tape And Reel

Unit Price (US$)

1.4*

Distributor availability ofIMP34DT05TR

Distributor Name
Region Stock Min. Order Third party link
DIGIKEY WORLDWIDE 3256 1 Order Now
AVNET AMERICA 4000 0 Order Now
ARROW EUROPE 4000 0 Order Now
MOUSER WORLDWIDE 3579 1 Order Now
Farnell Element14 EUROPE 123 1 Order Now

Distributor reported inventory date: 2019-05-21

Distributor Name

DIGIKEY

Stock

3256

Min.Order

1

Region

WORLDWIDE Order Now

AVNET

Stock

4000

Min.Order

0

Region

AMERICA Order Now

ARROW

Stock

4000

Min.Order

0

Region

EUROPE Order Now

MOUSER

Stock

3579

Min.Order

1

Region

WORLDWIDE Order Now

Farnell Element14

Stock

123

Min.Order

1

Region

EUROPE Order Now

Distributor reported inventory date: 2019-05-21

Marketing Status

Active

Unit Price (US$)

1.4

Quantity

1000

ECCN (US)

EAR99

Country of Origin

-

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

Education

Product included in our Longevity Program.

Ecosystems

    • Part Number

      AWS IoT Core is a managed cloud platform that lets connected devices easily and securely interact with cloud applications and other devices.

      Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.

      IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.

Evaluation Tools

    • Part Number

      Microphone coupon board based on the IMP34DT05 digital MEMS

Support and Applications

00 Files selected for download

Technical Documentation

    • Description Version Size Action
      DS12725
      MEMS audio sensor omnidirectional digital microphone for industrial applications
      3.0
      1.2 MB
      PDF
      DS12725

      MEMS audio sensor omnidirectional digital microphone for industrial applications

    • Description Version Size Action
      DT0117
      MIcrophone array beamforming in the PCM and PDM domain
      1.0
      3.17 MB
      PDF
      DT0117

      MIcrophone array beamforming in the PCM and PDM domain

Publications and Collaterals

    • Description Version Size Action
      APWorkbench software for audio ICs and MEMS microphones 1.0
      2.29 MB
      PDF
      MEMS analog and digital microphones
      989.69 KB
      PDF

      APWorkbench software for audio ICs and MEMS microphones

      MEMS analog and digital microphones

    • Description Version Size Action
      MEMS and Sensors Smart Motion tracking, IoT and enhanced user experience 1.0
      1.91 MB
      PDF
      Semiconductor solutions for healthcare applications 1.0
      665.18 KB
      PDF

      MEMS and Sensors Smart Motion tracking, IoT and enhanced user experience

      Semiconductor solutions for healthcare applications

Part Number Marketing Status Package RoHS Compliance Grade Material Declaration**
IMP34DT05
Preview
HCLGA 4MM X 3 MM X 1.00 MM MICRO Ecopack2
IMP34DT05TR
Active
HCLGA 4MM X 3 MM X 1.00 MM MICRO Ecopack2

IMP34DT05

Package:

HCLGA 4MM X 3 MM X 1.00 MM MICRO

Material Declaration**:

PDF XML

Marketing Status

Preview

Package

HCLGA 4MM X 3 MM X 1.00 MM MICRO

RoHS Compliance Grade

Ecopack2

IMP34DT05TR

Package:

HCLGA 4MM X 3 MM X 1.00 MM MICRO

Material Declaration**:

PDF XML

Marketing Status

Active

Package

HCLGA 4MM X 3 MM X 1.00 MM MICRO

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.