STM32F100VC

Active
Education

Mainstream value line, Arm Cortex-M3 MCU with 256 Kbytes of Flash memory, 24 MHz CPU, motor control and CEC functions

Download datasheet
Overview
Online design
Sample & Buy
Solutions
Documentation
CAD Resources
Tools & Software
Quality & Reliability
Partner products
Sales Briefcase

Product overview

Description

The STM32F100xx value line family incorporates the high-performance Arm® Cortex®-M3 32-bit RISC core operating at a 24 MHz frequency, high-speed embedded memories (Flash memory up to 512 Kbytes and SRAM up to 32 Kbytes), a flexible static memory control (FSMC) interface (for devices offered in packages of 100 pins and more) and an extensive range of enhanced peripherals and I/Os connected to two APB buses. All devices offer standard communication interfaces (up to two I2Cs, three SPIs, one HDMI CEC, up to three USARTs and 2 UARTS), one 12-bit ADC, two 12-bit DACs, up to 9 general-purpose 16-bit timers and an advanced-control PWM timer. The STM32F100xx high-density value line family operates in the –40 to +85 °C and –40 to +105 °C temperature ranges, from a 2.0 to 3.6 V power supply. A comprehensive set of power-saving mode allows the design of low-power applications.
The STM32F100xx value line family includes devices in three different packages ranging from 64 pins to 144 pins. Depending on the device chosen, different sets of peripherals are included, the description below gives an overview of the complete range of peripherals proposed in this family.
These features make the STM32F100xx value line microcontroller family suitable for a wide range of applications such as motor drives, application control, medical and handheld equipment, PC and gaming peripherals, GPS platforms, industrial applications, PLCs, inverters, printers, scanners, alarm systems, video intercoms, and HVACs.
  • All features

    • Core: Arm® 32-bit Cortex®-M3 CPU
      • 24 MHz maximum frequency, 1.25 DMIPS /MHz (Dhrystone 2.1) performance
      • Single-cycle multiplication and hardware division
    • Memories
      • 256 to 512 Kbytes of Flash memory
      • 24 to 32 Kbytes of SRAM
      • Flexible static memory controller with 4 Chip Selects. Supports SRAM, PSRAM and NOR memories
      • LCD parallel interface, 8080/6800 modes
    • Clock, reset and supply management
      • 2.0 to 3.6 V application supply and I/Os
      • POR, PDR and programmable voltage detector (PVD)
      • 4-to-24 MHz crystal oscillator
      • Internal 8 MHz factory-trimmed RC
      • Internal 40 kHz RC
      • PLL for CPU clock
      • 32 kHz oscillator for RTC with calibration
    • Low power
      • Sleep, Stop and Standby modes
      • VBAT supply for RTC and backup registers
    • Serial wire debug (SWD) and JTAG I/F
    • DMA
      • 12-channel DMA controller
      • Peripherals supported: timers, ADC, SPIs, I2Cs, USARTs and DACs
    • 1 × 12-bit, 1.2 μs A/D converter (up to 16 ch.)
      • Conversion range: 0 to 3.6 V
      • Temperature sensor
    • 2 × 12-bit D/A converters
    • Up to 112 fast I/O ports
      • 51/80/112 I/Os, all mappable on 16 external interrupt vectors and almost all 5 V-tolerant
    • Up to 16 timers
      • Up to seven 16-bit timers, each with up to 4 IC/OC/PWM or pulse counter
      • One 16-bit, 6-channel advanced-control timer: up to 6 channels for PWM output, dead time generation and emergency stop
      • One 16-bit timer, with 2 IC/OC, 1 OCN/PWM, dead-time generation and emergency stop
      • Two 16-bit timers, each with IC/OC/OCN/PWM, dead-time generation and emergency stop
      • Two watchdog timers
      • SysTick timer: 24-bit downcounter
      • Two 16-bit basic timers to drive the DAC
    • Up to 11 communications interfaces
      • Up to two I2C interfaces (SMBus/PMBus)
      • Up to 3 USARTs (ISO 7816 interface, LIN, IrDA capability, modem control)
      • Up to 2 UARTs
      • Up to 3 SPIs (12 Mbit/s)
      • Consumer electronics control (CEC) I/F
    • CRC calculation unit, 96-bit unique ID

Circuit Diagram

All tools & software

    • Part number
      Status
      Description
      Type
      Supplier

      Enhanced Carrier Connectivity Services

      Active

      Optimized regional cellular connectivity with one point of accountability & invoice for multiple Tier-1 carrier services

      Cloud Sierra Wireless
      Enhanced Carrier Connectivity Services

      Description:

      Optimized regional cellular connectivity with one point of accountability & invoice for multiple Tier-1 carrier services

      Global Smart Connectivity Services

      Active

      Smart Connectivity simplifies IoT deployments, eliminates coverage gaps with access to multiple networks, while reducing the total cost of opportunity

      Cloud Sierra Wireless
      Global Smart Connectivity Services

      Description:

      Smart Connectivity simplifies IoT deployments, eliminates coverage gaps with access to multiple networks, while reducing the total cost of opportunity

      Octave Services

      Active

      Octave all-in-one platform for connecting IoT assets and microcontrollers to the cloud

      Cloud Sierra Wireless
      Octave Services

      Description:

      Octave all-in-one platform for connecting IoT assets and microcontrollers to the cloud
    • Part number
      Status
      Description
      Type
      Supplier

      Enhanced Carrier Connectivity SIM

      Active

      Cellular connectivity that simplifies, optimizes regional deployments via 1 point of accountability and invoice for multiple Tier-1 carrier services

      Components and Modules Sierra Wireless
      Enhanced Carrier Connectivity SIM

      Description:

      Cellular connectivity that simplifies, optimizes regional deployments via 1 point of accountability and invoice for multiple Tier-1 carrier services

      Global Smart Connectivity SIM

      Active

      Sierra Wireless' Smart Connectivity provides resilient Global cellular coverage in a single SIM

      Components and Modules Sierra Wireless
      Global Smart Connectivity SIM

      Description:

      Sierra Wireless' Smart Connectivity provides resilient Global cellular coverage in a single SIM

      Octave Cellular Modules

      Active

      Octave enabled LPWA/LTE-M connectivity with 2G fallback for any cellular network in the world

      Components and Modules Sierra Wireless
      Octave Cellular Modules

      Description:

      Octave enabled LPWA/LTE-M connectivity with 2G fallback for any cellular network in the world

      RF Modules

      Active

      RF modules for Sub GigaHz and Bluetooth.

      Components and Modules DiZiC
      RF Modules

      Description:

      RF modules for Sub GigaHz and Bluetooth.

      SensorTile.box

      Active

      SensorTile.box is an evaluation kit IoT node made up of an electronics board, a lithium rechargeble battery, a plastic housing and APP.

      Components and Modules FAE Technology
      SensorTile.box

      Description:

      SensorTile.box is an evaluation kit IoT node made up of an electronics board, a lithium rechargeble battery, a plastic housing and APP.