MPU with Arm Cortex-A7 650 MHz, Arm Cortex-M4 real-time coprocessor, TFT display

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  • Key Features

    • Core
      • 32-bit Arm® Cortex®-A7
        • L1 32-Kbyte I / 32-Kbyte D
        • 256-Kbyte unified level 2 cache
        • Arm® NEON™ and Arm® TrustZone®
      • 32-bit Arm® Cortex®-M4 with FPU/MPU
        • Up to 209 MHz (Up to 703 CoreMark®)
    • Memories
      • External DDR memory up to 1 Gbyte
        • up to LPDDR2/LPDDR3-1066 16/32-bit
        • up to DDR3/DDR3L-1066 16/32-bit
      • 708 Kbytes of internal SRAM: 256 Kbytes of AXI SYSRAM + 384 Kbytes of AHB SRAM + 64 Kbytes of AHB SRAM in Backup domain and 4 Kbytes of SRAM in Backup domain
      • Dual mode Quad-SPI memory interface
      • Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs and SLC NAND memories with up to 8-bit ECC
    • Security/safety
      • TrustZone® peripherals, active tamper
      • Cortex®-M4 resources isolation
    • Reset and power management
      • 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
      • POR, PDR, PVD and BOR
      • On-chip LDOs (RETRAM, BKPSRAM, USB 1.8 V, 1.1 V)
      • Backup regulator (~0.9 V)
      • Internal temperature sensors
      • Low-power modes: Sleep, Stop and Standby
      • LPDDR2/3 retention in Standby mode
      • Controls for PMIC companion chip
    • Low-power consumption
      • Total current consumption down to 2 µA (Standby mode, no RTC, no LSE, no BKPSRAM, no RETRAM)
    • Clock management
      • Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator
      • External oscillators: 8-48 MHz HSE oscillator, 32.768 kHz LSE oscillator
      • 5 × PLLs with fractional mode
    • General-purpose input/outputs
      • Up to 176 I/O ports with interrupt capability
        • Up to 8 secure I/Os
        • Up to 6 Wakeup, 3 tampers, 1 active tamper
    • Interconnect matrix
      • 2 bus matrices
        • 64-bit Arm® AMBA® AXI interconnect, up to 266 MHz
        • 32-bit Arm® AMBA® AHB interconnect, up to 209 MHz
    • 3 DMA controllers to unload the CPU
      • 48 physical channels in total
      • 1 × high-speed general-purpose master direct memory access controller (MDMA)
      • 2 × dual-port DMAs with FIFO and request router capabilities for optimal peripheral management
    • Up to 35 communication peripherals
      • 6 × I2C FM+ (1 Mbit/s, SMBus/PMBus)
      • 4 × UART + 4 × USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI slave)
      • 6 × SPI (50 Mbit/s, including 3 with full duplex I2S audio class accuracy via internal audio PLL or external clock)
      • 4 × SAI (stereo audio: I2S, PDM, SPDIF Tx)
      • SPDIF Rx with 4 inputs
      • HDMI-CEC interface
      • MDIO Slave interface
      • 3 × SDMMC up to 8-bit (SD / e•MMC™ / SDIO)
      • 2 × USB 2.0 high-speed Host+ 1 × USB 2.0 full-speed OTG simultaneously
        • or 1 × USB 2.0 high-speed Host+ 1 × USB 2.0 high-speed OTG simultaneously
      • 10/100M or Gigabit Ethernet GMAC
        • IEEE 1588v2 hardware, MII/RMII/GMII/RGMII
      • 8- to 14-bit camera interface up to 140 Mbyte/s
    • 6 analog peripherals
      • 2 × ADCs with 16-bit max. resolution (12 bits up to 4.5 Msps, 14 bits up to 4 Msps, 16 bits up to 3.6 Msps)
      • 1 × temperature sensor
      • 2 × 12-bit D/A converters (1 MHz)
      • 1 × digital filters for sigma delta modulator (DFSDM) with 8 channels/6 filters
      • Internal or external ADC/DAC reference VREF+
    • Graphics
      • LCD-TFT controller, up to 24-bit // RGB888
        • up to WXGA (1366 × 768) @60 fps
        • Two layers with programmable colour LUT
    • Up to 25 timers and 3 watchdogs
      • 2 × 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
      • 2 × 16-bit advanced motor control timers
      • 10 × 16-bit general-purpose timers (including 2 basic timers without PWM)
      • 5 × 16-bit low-power timers
      • RTC with sub-second accuracy and hardware calendar
      • 4 Cortex®-A7 system timers (secure, non-secure, virtual, hypervisor)
      • 1 × SysTick M4 timer
      • 3 × watchdogs (2 × independent and window)
    • Hardware acceleration
      • HASH (MD5, SHA-1, SHA224, SHA256), HMAC
      • 2 × true random number generator (3 oscillators each)
      • 2 × CRC calculation unit
    • Debug mode
      • Arm® CoreSight™ trace and debug: SWD and JTAG interfaces
      • 8-Kbyte embedded trace buffer
    • 3072-bit fuses including 96-bit unique ID, up to 1184-bit available for user
    • All packages are ECOPACK2 compliant

Circuit Diagram

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STM32MP151AAD3

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Junction Temperature (°C) (min)

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Junction Temperature (°C) (max)

125

Unit Price (US$)

4.848

Quantity

10000

ECCN (US)

3A991A2

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STM32MP151AAA3

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LFBGA448

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Unit Price (US$)

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Distributor reported inventory date: 2019-10-18

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Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

5.808

Quantity

10000

ECCN (US)

3A991A2

Country of Origin

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STM32MP151AAB3

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LFBGA354

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Unit Price (US$)

5.168*

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Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

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5.168

Quantity

10000

ECCN (US)

3A991A2

Country of Origin

-

STM32MP151AAC3T

Package

TFBGA361

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Tape And Reel

Unit Price (US$)

5.088*

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Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

5.088

Quantity

10000

ECCN (US)

3A991A2

Country of Origin

-

STM32MP151AAA3T

Package

LFBGA448

Packing Type

Tape And Reel

Unit Price (US$)

5.808*

Marketing Status

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

5.808

Quantity

10000

ECCN (US)

3A991A2

Country of Origin

-

STM32MP151AAB3T

Package

LFBGA354

Packing Type

Tape And Reel

Unit Price (US$)

5.168*

Marketing Status

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

5.168

Quantity

10000

ECCN (US)

3A991A2

Country of Origin

-

STM32MP151AAD3T

Package

TFBGA257

Packing Type

Tape And Reel

Unit Price (US$)

4.848*

Marketing Status

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

4.848

Quantity

10000

ECCN (US)

3A991A2

Country of Origin

-

STM32MP151AAC3

Package

TFBGA361

Packing Type

Tray

Unit Price (US$)

5.088*

Distributor availability ofSTM32MP151AAC3

Distributor Name
Region Stock Min. Order Third party link
DIGIKEY WORLDWIDE 95 1 Order Now
MOUSER WORLDWIDE 100 1 Order Now
Farnell Element14 EUROPE 200 1 Order Now

Distributor reported inventory date: 2019-10-18

Distributor Name

DIGIKEY

Stock

95

Min.Order

1

Region

WORLDWIDE Order Now

MOUSER

Stock

100

Min.Order

1

Region

WORLDWIDE Order Now

Farnell Element14

Stock

200

Min.Order

1

Region

EUROPE Order Now

Distributor reported inventory date: 2019-10-18

Marketing Status

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

5.088

Quantity

10000

ECCN (US)

3A991A2

Country of Origin

-

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

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Technical Documentation

    • Description Version Size Action
      DS12500
      Arm® Cortex®-A7 650 MHz + Cortex®-M4 MPU, TFT, 35 comm. interfaces, 25 timers, adv. analog
      2.0
      3.5 MB
      PDF
      DS12500

      Arm® Cortex®-A7 650 MHz + Cortex®-M4 MPU, TFT, 35 comm. interfaces, 25 timers, adv. analog

    • Description Version Size Action
      AN5168
      DDR configuration on STM32MP1 Series MPUs
      1.0
      374.96 KB
      PDF
      AN5348
      FDCAN peripheral on STM32 devices
      1.0
      365.06 KB
      PDF
      AN5031
      Getting started with STM32MP1 Series hardware development
      1.0
      1.86 MB
      PDF
      AN4803
      High-speed SI simulations using IBIS and board-level simulations using HyperLynx® SI on STM32 MCUs and MPUs
      2.0
      2.1 MB
      PDF
      AN5027
      Interfacing PDM digital microphones using STM32 MCUs and MPUs
      2.0
      1.83 MB
      PDF
      AN5253
      Migrating from STM32F469/479 line to STM32MP151, STM32MP153 and STM32MP157 lines
      1.0
      206.89 KB
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      AN5122
      STM32MP1 Series DDR memory routing guidelines
      3.0
      734.71 KB
      PDF
      AN5284
      STM32MP1 Series system power consumption
      1.0
      223.69 KB
      PDF
      AN5109
      STM32MP1 Series using low-power modes
      3.0
      1.11 MB
      PDF
      AN5256
      STM32MP151, STM32MP153 and STM32MP157 discrete power supply hardware integration
      1.0
      700.33 KB
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      AN2639
      Soldering recommendations and package information for Lead-free ECOPACK MCUs and MPUs
      7.0
      333.18 KB
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      AN5036
      Thermal management guidelines for STM32 applications
      3.0
      4.84 MB
      PDF
      AN5275
      USB DFU/USART protocols used in STM32MP1 Series bootloaders
      1.0
      512.28 KB
      PDF
      AN5225
      USB Type-C™ Power Delivery using STM32xx Series MCUs and STM32xxx Series MPUs
      2.0
      1.84 MB
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      AN5168

      DDR configuration on STM32MP1 Series MPUs

      AN5348

      FDCAN peripheral on STM32 devices

      AN5031

      Getting started with STM32MP1 Series hardware development

      AN4803

      High-speed SI simulations using IBIS and board-level simulations using HyperLynx® SI on STM32 MCUs and MPUs

      AN5027

      Interfacing PDM digital microphones using STM32 MCUs and MPUs

      AN5253

      Migrating from STM32F469/479 line to STM32MP151, STM32MP153 and STM32MP157 lines

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      STM32MP1 Series using low-power modes

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      USB Type-C™ Power Delivery using STM32xx Series MCUs and STM32xxx Series MPUs

    • Description Version Size Action
      RM0441
      STM32MP151 advanced Arm®-based 32-bit MPUs
      3.0
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      PM0214
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      8.0
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      STM32MP1 CAD Symbol and Footprint files 1.3
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Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
STM32MP151AAA3
Active
LFBGA448 Industrial Ecopack2
STM32MP151AAA3T
Active
LFBGA448 Industrial Ecopack2
STM32MP151AAB3
Active
LFBGA354 Industrial Ecopack2
STM32MP151AAB3T
Active
LFBGA354 Industrial Ecopack2
STM32MP151AAC3
Active
TFBGA361 Industrial Ecopack2
STM32MP151AAC3T
Active
TFBGA361 Industrial Ecopack2
STM32MP151AAD3
Active
TFBGA257 Industrial Ecopack2
STM32MP151AAD3T
Active
TFBGA257 Industrial Ecopack2

STM32MP151AAA3

Package:

LFBGA448

Material Declaration**:

PDF XML

Marketing Status

Active

Package

LFBGA448

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP151AAA3T

Package:

LFBGA448

Material Declaration**:

PDF XML

Marketing Status

Active

Package

LFBGA448

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP151AAB3

Package:

LFBGA354

Material Declaration**:

PDF XML

Marketing Status

Active

Package

LFBGA354

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP151AAB3T

Package:

LFBGA354

Material Declaration**:

PDF XML

Marketing Status

Active

Package

LFBGA354

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP151AAC3

Package:

TFBGA361

Material Declaration**:

Marketing Status

Active

Package

TFBGA361

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP151AAC3T

Package:

TFBGA361

Material Declaration**:

Marketing Status

Active

Package

TFBGA361

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP151AAD3

Package:

TFBGA257

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TFBGA257

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP151AAD3T

Package:

TFBGA257

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TFBGA257

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.