MPU with Arm Cortex-A7 650 MHz, Arm Cortex-M4 real-time coprocessor, TFT display, Secure boot and Cryptography

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  • The STM32MP151C devices are based on the high-performance Arm® Cortex®-A7 32-bit RISC core operating at up to 650 MHz. The Cortex-A7 processor includes a 32-Kbyte L1 instruction cache, a 32-Kbyte L1 data cache and a 256-Kbyte level2 cache. The Cortex-A7 processor is a very energy-efficient application processor designed to provide rich performance in high-end wearables, and other low-power embedded and consumer applications. It provides up to 20% more single thread performance than the Cortex-A5 and provides similar performance than the Cortex-A9.

    The Cortex-A7 incorporates all features of the high-performance Cortex-A15 and Cortex-A17 processors, including virtualization support in hardware, NEON™, and 128-bit AMBA®4 AXI bus interface.
    The STM32MP151C devices also embed a Cortex® -M4 32-bit RISC core operating at up to 209 MHz frequency. Cortex-M4 core features a floating point unit (FPU) single precision which supports Arm® single-precision data-processing instructions and data types. The Cortex® -M4 supports a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
    The STM32MP151C devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16 or 32-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz.
    The STM32MP151C devices incorporate high-speed embedded memories with 708 Kbytes of Internal SRAM (including 256 Kbytes of AXI SYSRAM, 3 banks of 128 Kbytes each of AHB SRAM, 64 Kbytes of AHB SRAM in backup domain and 4 Kbytes of SRAM in backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, a 32-bit multi-AHB bus matrix and a 64-bit multi layer AXI interconnect supporting internal and external memories access.
    All the devices offer two ADCs, two DACs, a low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG), and a cryptographic acceleration cell. The devices support six digital filters for external sigma delta modulators (DFSDM). They also feature standard and advanced communication interfaces.

    Key Features

    • Core
      • 32-bit Arm® Cortex®-A7
        • L1 32-Kbyte I / 32-Kbyte D
        • 256-Kbyte unified level 2 cache
        • Arm® NEON™ and Arm® TrustZone®
      • 32-bit Arm® Cortex®-M4 with FPU/MPU
        • Up to 209 MHz (Up to 703 CoreMark®)
    • Memories
      • External DDR memory up to 1 Gbyte
        • up to LPDDR2/LPDDR3-1066 16/32-bit
        • up to DDR3/DDR3L-1066 16/32-bit
      • 708 Kbytes of internal SRAM: 256 KB of AXI SYSRAM + 384 KB of AHB SRAM + 64 KB of AHB SRAM in backup domain and 4 KB of SRAM in backup domain
      • Dual mode Quad-SPI memory interface
      • Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs and SLC NAND memories with up to 8-bit ECC
    • Security/safety
      • Secure boot, TrustZone® peripherals, active tamper
      • Cortex®-M4 resources isolation
    • Reset and power management
      • 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
      • POR, PDR, PVD and BOR
      • On-chip LDOs (RETRAM, BKPSRAM, USB 1.8 V, 1.1 V)
      • Backup regulator (~0.9 V)
      • Internal temperature sensors
      • Low-power modes: Sleep, Stop and Standby
      • LPDDR2/3 retention in Standby mode
      • Controls for PMIC companion chip
    • Low-power consumption
      • Total current consumption down to 6 μA
    • Clock management
      • Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator
      • External oscillators: 8-48 MHz HSE oscillator, 32.768 kHz LSE oscillator
      • 5 × PLLs with fractional mode
    • General-purpose input/outputs
      • Up to 176 I/O ports with interrupt capability
        • Up to 8 secure I/Os
        • Up to 6 Wakeup, 3 Tamper, 1 Active-Tamper
    • Interconnect matrix
    • 3 DMA controllers to unload the CPU
    • Up to 35 communication peripherals
      • 6 × I2C FM+ (1 Mbit/s, SMBus/PMBus)
      • 4 × UART + 4 × USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI slave)
      • 6 × SPI (50 Mbit/s, including 3 with full duplex I2S audio class accuracy via internal audio PLL or external clock)
      • 4 × SAI (stereo audio: I2S, PDM, SPDIF Tx)
      • SPDIF Rx with 4 inputs
      • HDMI-CEC interface
      • MDIO Slave interface
      • 3 × SDMMC up to 8-bit (SD / e•MMC™ / SDIO)
      • 2 × USB 2.0 high-speed Host+ 1 × USB 2.0 full-speed OTG simultaneously
        • or 1 × USB 2.0 high-speed Host+ 1 × USB 2.0 high-speed OTG simultaneously
      • 10/100M or Gigabit Ethernet GMAC
        • IEEE 1588v2 hardware, MII/RMII/GMII/RGMII
      • 8- to 14-bit camera interface up to 140 Mbyte/s
    • 6 analog peripherals
      • 2 × ADCs with 16-bit max. resolution (12 bits 5 Msps, 14 bits 4.4 Msps, 16 bits 250 ksps)
      • 1 × temperature sensor
      • 2 × 12-bit D/A converters (1 MHz)
      • 1 × digital filters for sigma delta modulator (DFSDM) with 8 channels/6 filters
      • Internal or external ADC/DAC reference VREF+
    • Graphics
      • LCD-TFT controller, up to 24-bit // RGB888
        • up to WXGA (1366 × 768) @60 fps
        • Two layers with programmable colour LUT
    • Up to 25 timers and 3 watchdogs
      • 2 × 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
      • 2 × 16-bit advanced motor control timers
      • 10 × 16-bit general-purpose timers (including 2 basic timers without PWM)
      • 5 × 16-bit low-power timers
      • RTC with sub-second accuracy and hardware calendar
      • 4 Cortex®-A7 system timers (secure, non-secure, virtual, hypervisor)
      • 1 × SysTick M4 timer
      • 3 × watchdogs (2 × independent and window)
    • Hardware acceleration
      • AES 128, 192, 256, TDES
      • HASH (MD5, SHA-1, SHA224, SHA256), HMAC
      • 2 × true random number generator (3 oscillators each)
      • 2 × CRC calculation unit
    • Debug mode
      • Arm® CoreSight™ trace and debug: SWD and JTAG interfaces
      • 8-Kbyte embedded trace buffer
    • 3072-bit fuses including 96-bit unique ID, up to 1184-bit available for user

Circuit Diagram

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STM32MP151CAC3 TFBGA361 Tray
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-40 125 5.568 10000 5A992C
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STM32MP151CAA3 LFBGA448 Tray
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-40 125 6.288 10000 5A992C
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STM32MP151CAD3T TFBGA257 Tape And Reel
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-40 125 5.328 10000 5A992C
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STM32MP151CAD3 TFBGA257 Tray
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-40 125 5.328 10000 5A992C
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STM32MP151CAB3T LFBGA354 Tape And Reel
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-40 125 5.648 10000 5A992C
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-

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STM32MP151CAC3T TFBGA361 Tape And Reel
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-40 125 5.568 10000 5A992C
MORE INFO

Country of Origin:

-

No availability of distributors reported, please contact our sales office
STM32MP151CAB3 LFBGA354 Tray
Active
-40 125 5.648 10000 5A992C
MORE INFO

Country of Origin:

-

No availability of distributors reported, please contact our sales office
STM32MP151CAA3T LFBGA448 Tape And Reel
Active
-40 125 6.288 10000 5A992C
MORE INFO

Country of Origin:

-

No availability of distributors reported, please contact our sales office

STM32MP151CAC3

Package

TFBGA361

Packing Type

Tray

Unit Price (US$)

5.568*

Marketing Status

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

5.568

Quantity

10000

ECCN (US)

5A992C

Country of Origin

-

STM32MP151CAA3

Package

LFBGA448

Packing Type

Tray

Unit Price (US$)

6.288*

Marketing Status

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

6.288

Quantity

10000

ECCN (US)

5A992C

Country of Origin

-

STM32MP151CAD3T

Package

TFBGA257

Packing Type

Tape And Reel

Unit Price (US$)

5.328*

Marketing Status

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

5.328

Quantity

10000

ECCN (US)

5A992C

Country of Origin

-

STM32MP151CAD3

Package

TFBGA257

Packing Type

Tray

Unit Price (US$)

5.328*

Marketing Status

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

5.328

Quantity

10000

ECCN (US)

5A992C

Country of Origin

-

STM32MP151CAB3T

Package

LFBGA354

Packing Type

Tape And Reel

Unit Price (US$)

5.648*

Marketing Status

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

5.648

Quantity

10000

ECCN (US)

5A992C

Country of Origin

-

STM32MP151CAC3T

Package

TFBGA361

Packing Type

Tape And Reel

Unit Price (US$)

5.568*

Marketing Status

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

5.568

Quantity

10000

ECCN (US)

5A992C

Country of Origin

-

STM32MP151CAB3

Package

LFBGA354

Packing Type

Tray

Unit Price (US$)

5.648*

Marketing Status

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

5.648

Quantity

10000

ECCN (US)

5A992C

Country of Origin

-

STM32MP151CAA3T

Package

LFBGA448

Packing Type

Tape And Reel

Unit Price (US$)

6.288*

Marketing Status

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

6.288

Quantity

10000

ECCN (US)

5A992C

Country of Origin

-

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

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Support and Applications

00 Files selected for download

Technical Documentation

    • Description Version Size Action
      DS12501
      Arm® Cortex®-A7 650 MHz + Cortex®-M4 MPU, TFT, 35 comm. interfaces, 25 timers, adv. analog, crypto
      1.0
      3.08 MB
      PDF
      DS12501

      Arm® Cortex®-A7 650 MHz + Cortex®-M4 MPU, TFT, 35 comm. interfaces, 25 timers, adv. analog, crypto

    • Description Version Size Action
      AN5168
      DDR configuration on STM32MP1 Series MPUs
      1.0
      374.96 KB
      PDF
      AN5031
      Getting started with STM32MP1 Series hardware development
      1.0
      1.86 MB
      PDF
      AN5253
      Migrating from STM32F469/479 line to STM32MP151, STM32MP153 and STM32MP157 lines
      1.0
      206.89 KB
      PDF
      AN5122
      STM32MP1 Series DDR memory routing guidelines
      3.0
      734.71 KB
      PDF
      AN5284
      STM32MP1 Series system power consumption
      1.0
      223.69 KB
      PDF
      AN5109
      STM32MP1 Series using low-power modes
      3.0
      1.11 MB
      PDF
      AN5036
      Thermal management guidelines for STM32 applications
      3.0
      4.84 MB
      PDF
      AN5225
      USB Type-C™ Power Delivery using STM32xx Series MCUs and STM32xxx Series MPUs
      1.0
      1.42 MB
      PDF
      AN5168

      DDR configuration on STM32MP1 Series MPUs

      AN5031

      Getting started with STM32MP1 Series hardware development

      AN5253

      Migrating from STM32F469/479 line to STM32MP151, STM32MP153 and STM32MP157 lines

      AN5122

      STM32MP1 Series DDR memory routing guidelines

      AN5284

      STM32MP1 Series system power consumption

      AN5109

      STM32MP1 Series using low-power modes

      AN5036

      Thermal management guidelines for STM32 applications

      AN5225

      USB Type-C™ Power Delivery using STM32xx Series MCUs and STM32xxx Series MPUs

    • Description Version Size Action
      RM0441
      STM32MP151 advanced Arm®-based 32-bit MPUs
      2.0
      75.17 MB
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      RM0441

      STM32MP151 advanced Arm®-based 32-bit MPUs

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      PM0214
      STM32 Cortex®-M4 MCUs and MPUs programming manual
      8.0
      2.94 MB
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      PM0214

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      ES0438
      STM32MP151x/3x/7x device errata
      1.0
      341.5 KB
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      ES0438

      STM32MP151x/3x/7x device errata

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      STM32MP1 Microprocessor - Continuing the STM32 Success Story 1.1
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      STM32MP1 Microprocessor - Continuing the STM32 Success Story

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Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
STM32MP151CAA3
Active
LFBGA448 Industrial Ecopack2
STM32MP151CAA3T
Active
LFBGA448 Industrial Ecopack2
STM32MP151CAB3
Active
LFBGA354 Industrial Ecopack2
STM32MP151CAB3T
Active
LFBGA354 Industrial Ecopack2
STM32MP151CAC3
Active
TFBGA361 Industrial Ecopack2
STM32MP151CAC3T
Active
TFBGA361 Industrial Ecopack2
STM32MP151CAD3
Active
TFBGA257 Industrial Ecopack2
STM32MP151CAD3T
Active
TFBGA257 Industrial Ecopack2

STM32MP151CAA3

Package:

LFBGA448

Material Declaration**:

PDF XML

Marketing Status

Active

Package

LFBGA448

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP151CAA3T

Package:

LFBGA448

Material Declaration**:

PDF XML

Marketing Status

Active

Package

LFBGA448

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP151CAB3

Package:

LFBGA354

Material Declaration**:

PDF XML

Marketing Status

Active

Package

LFBGA354

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP151CAB3T

Package:

LFBGA354

Material Declaration**:

PDF XML

Marketing Status

Active

Package

LFBGA354

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP151CAC3

Package:

TFBGA361

Material Declaration**:

Marketing Status

Active

Package

TFBGA361

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP151CAC3T

Package:

TFBGA361

Material Declaration**:

Marketing Status

Active

Package

TFBGA361

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP151CAD3

Package:

TFBGA257

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TFBGA257

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP151CAD3T

Package:

TFBGA257

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TFBGA257

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.