Product overview
Description
The STM32MP153C/F devices are based on the high-performance dual-core Arm® Cortex®-A7 32-bit RISC core operating at up to 800 MHz. The Cortex-A7 processor includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU and a 256-Kbyte level2 cache. The Cortex-A7 processor is a very energy-efficient application processor designed to provide rich performance in high-end wearables, and other low-power embedded and consumer applications. It provides up to 20% more single thread performance than the Cortex-A5 and provides similar performance than the Cortex-A9. The Cortex-A7 incorporates all features of the high-performance Cortex-A15 and Cortex-A17 processors, including virtualization support in hardware, NEON™, and 128-bit AMBA®4 AXI bus interface.The STM32MP153C/F devices also embed a Cortex® -M4 32-bit RISC core operating at up to 209 MHz frequency. Cortex-M4 core features a floating point unit (FPU) single precision which supports Arm® single-precision data-processing instructions and data types. The Cortex® -M4 supports a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
The STM32MP153C/F devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16 or 32-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz.
The STM32MP153C/F devices incorporate high-speed embedded memories with 708 Kbytes of Internal SRAM (including 256 Kbytes of AXI SYSRAM, 3 banks of 128 Kbytes each of AHB SRAM, 64 Kbytes of AHB SRAM in backup domain and 4 Kbytes of SRAM in backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, a 32-bit multi-AHB bus matrix and a 64-bit multi layer AXI interconnect supporting internal and external memories access.
All the devices offer two ADCs, two DACs, a low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG), and a cryptographic acceleration cell. The devices support six digital filters for external sigma delta modulators (DFSDM). They also feature standard and advanced communication interfaces.
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All features
- Includes ST state-of-the-art patented technology
- Core
- 32-bit dual-core Arm® Cortex®-A7
- L1 32-Kbyte I / 32-Kbyte D for each core
- 256-Kbyte unified level 2 cache
- Arm® NEON™ and Arm® TrustZone®
- 32-bit Arm® Cortex®-M4 with FPU/MPU
- Up to 209 MHz (Up to 703 CoreMark®)
- 32-bit dual-core Arm® Cortex®-A7
- Memories
- External DDR memory up to 1 Gbyte
- up to LPDDR2/LPDDR3-1066 16/32-bit
- up to DDR3/DDR3L-1066 16/32-bit
- 708 Kbytes of internal SRAM: 256 Kbytes of AXI SYSRAM + 384 Kbytes of AHB SRAM + 64 Kbytes of AHB SRAM in Backup domain and 4 Kbytes of SRAM in Backup domain
- Dual mode Quad-SPI memory interface
- Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs and SLC NAND memories with up to 8-bit ECC
- External DDR memory up to 1 Gbyte
- Security/safety
- Secure boot, TrustZone® peripherals, active tamper
- Cortex®-M4 resources isolation
- Reset and power management
- 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
- POR, PDR, PVD and BOR
- On-chip LDOs (RETRAM, BKPSRAM, USB 1.8 V, 1.1 V)
- Backup regulator (~0.9 V)
- Internal temperature sensors
- Low-power modes: Sleep, Stop and Standby
- DDR memory retention in Standby mode
- Controls for PMIC companion chip
- Low-power consumption
- Total current consumption down to 2 µA (Standby mode, no RTC, no LSE, no BKPSRAM, no RETRAM)
- Clock management
- Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator
- External oscillators: 8-48 MHz HSE oscillator, 32.768 kHz LSE oscillator
- 5 × PLLs with fractional mode
- General-purpose input/outputs
- Up to 176 I/O ports with interrupt capability
- Up to 8 secure I/Os
- Up to 6 Wakeup, 3 tampers, 1 active tamper
- Up to 176 I/O ports with interrupt capability
- Interconnect matrix
- 2 bus matrices
- 64-bit Arm® AMBA® AXI interconnect, up to 266 MHz
- 32-bit Arm® AMBA® AHB interconnect, up to 209 MHz
- 2 bus matrices
- 3 DMA controllers to unload the CPU
- 48 physical channels in total
- 1 × high-speed general-purpose master direct memory access controller (MDMA)
- 2 × dual-port DMAs with FIFO and request router capabilities for optimal peripheral management
- Up to 37 communication peripherals
- 6 × I2C FM+ (1 Mbit/s, SMBus/PMBus)
- 4 × UART + 4 × USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI slave)
- 6 × SPI (50 Mbit/s, including 3 with full duplex I2S audio class accuracy via internal audio PLL or external clock)
- 4 × SAI (stereo audio: I2S, PDM, SPDIF Tx)
- SPDIF Rx with 4 inputs
- HDMI-CEC interface
- MDIO Slave interface
- 3 × SDMMC up to 8-bit (SD / e•MMC™/ SDIO)
- 2 × CAN controllers supporting CAN FD protocol, out of which one supports time-triggered CAN (TTCAN)
- 2 × USB 2.0 high-speed Host+ 1 × USB 2.0 full-speed OTG simultaneously
- or 1 × USB 2.0 high-speed Host+ 1 × USB 2.0 high-speed OTG simultaneously
- 10/100M or Gigabit Ethernet GMAC
- IEEE 1588v2 hardware, MII/RMII/GMII/RGMII
- 8- to 14-bit camera interface up to 140 Mbyte/s
- 6 analog peripherals
- 2 × ADCs with 16-bit max. resolution (12 bits up to 4.5 Msps, 14 bits up to 4 Msps, 16 bits up to 3.6 Msps)
- 1 × temperature sensor
- 2 × 12-bit D/A converters (1 MHz)
- 1 × digital filters for sigma delta modulator (DFSDM) with 8 channels/6 filters
- Internal or external ADC/DAC reference VREF+
- Graphics
- LCD-TFT controller, up to 24-bit // RGB888
- up to WXGA (1366 × 768) @60 fps or up to Full HD (1920 × 1080) @30 fps
- Pixel clock up to 90 MHz
- Two layers with programmable colour LUT
- LCD-TFT controller, up to 24-bit // RGB888
- Up to 29 timers and 3 watchdogs
- 2 × 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
- 2 × 16-bit advanced motor control timers
- 10 × 16-bit general-purpose timers (including 2 basic timers without PWM)
- 5 × 16-bit low-power timers
- RTC with sub-second accuracy and hardware calendar
- 2 × 4 Cortex®-A7 system timers (secure, non-secure, virtual, hypervisor)
- 1 × SysTick M4 timer
- 3 × watchdogs (2 × independent and window)
- Hardware acceleration
- AES 128, 192, 256, TDES
- HASH (MD5, SHA-1, SHA224, SHA256), HMAC
- 2 × true random number generator (3 oscillators each)
- 2 × CRC calculation unit
- Debug mode
- Arm® CoreSight™ trace and debug: SWD and JTAG interfaces
- 8-Kbyte embedded trace buffer
- 3072-bit fuses including 96-bit unique ID, up to 1184-bit available for user
- All packages are ECOPACK2 compliant
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All tools & software
All resources
| Resource title | Version | Latest update |
|---|
Product Specifications (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 6.0 | 18 May 2021 | 18 May 2021 |
Application Notes (5 of 23)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 4.0 | 08 Jul 2020 | 08 Jul 2020 | ||
| 1.0 | 08 Feb 2019 | 08 Feb 2019 | ||
| 2.0 | 05 Jul 2021 | 05 Jul 2021 | ||
| 1.0 | 07 Oct 2019 | 07 Oct 2019 | ||
| 3.0 | 21 Jan 2021 | 21 Jan 2021 | ||
| 2.0 | 06 Sep 2019 | 06 Sep 2019 | ||
| 2.0 | 17 Jul 2019 | 17 Jul 2019 | ||
| 1.0 | 19 Feb 2019 | 19 Feb 2019 | ||
| 14.0 | 27 Jul 2021 | 27 Jul 2021 | ||
| 1.0 | 09 Sep 2020 | 09 Sep 2020 | ||
| 3.0 | 30 Apr 2020 | 30 Apr 2020 | ||
| 4.0 | 09 Jun 2020 | 09 Jun 2020 | ||
| 3.0 | 09 Feb 2019 | 09 Feb 2019 | ||
| 1.0 | 04 Sep 2020 | 04 Sep 2020 | ||
| 1.0 | 29 Jan 2020 | 29 Jan 2020 | ||
| 1.0 | 20 Mar 2019 | 20 Mar 2019 | ||
| 2.0 | 14 Feb 2020 | 14 Feb 2020 | ||
| 2.0 | 28 Jan 2021 | 28 Jan 2021 | ||
| 4.0 | 05 Nov 2020 | 05 Nov 2020 | ||
| 7.0 | 11 Oct 2019 | 11 Oct 2019 | ||
| 3.0 | 23 Apr 2019 | 23 Apr 2019 | ||
| 1.0 | 15 Oct 2019 | 15 Oct 2019 | ||
| 3.0 | 01 Sep 2020 | 01 Sep 2020 |
Reference Manuals (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 5.0 | 21 Jan 2021 | 21 Jan 2021 |
Programming Manuals (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 10.0 | 23 Mar 2020 | 23 Mar 2020 |
Errata Sheets (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 6.0 | 25 Feb 2021 | 25 Feb 2021 |
Application Notes for related Tools & Software (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 4.0 | 04 May 2021 | 04 May 2021 | ||
| 1.0 | 14 Jan 2020 | 14 Jan 2020 |
Presentations (3)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 01.21 | 30 Apr 2021 | 30 Apr 2021 | ||
| 1.1 | 14 Apr 2020 | 14 Apr 2020 | ||
| 1.0 | 23 Nov 2020 | 23 Nov 2020 |
Flyers (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| 19.5 | 14 Apr 2020 | 14 Apr 2020 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - STM32MP153F
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
All resources
| Resource title | Version | Latest update |
|---|
System View Description (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.0 | 19 Feb 2019 | 19 Feb 2019 | |
| ZIP | 1.0 | 05 Feb 2019 | 05 Feb 2019 |
BSDL files (2)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 2.0 | 31 Jan 2020 | 31 Jan 2020 | |
| ZIP | 2.0 | 07 Jan 2021 | 07 Jan 2021 |
Board Manufacturing Specifications (1)
| Resource title | Version | Latest update | ||
|---|---|---|---|---|
| ZIP | 3.0 | 11 Jun 2020 | 11 Jun 2020 |
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| STM32MP153FAA1 | Active | LFBGA 448 18x18x1.7 P 0.8 mm | Industrial | Ecopack2 | |
| STM32MP153FAB1 | Active | LFBGA 354 16x16x1.7 P 0.8 mm | Industrial | Ecopack2 | |
| STM32MP153FAC1 | Active | TFBGA 361 12x12x1.2 P 0.5 mm | Industrial | Ecopack2 | |
| STM32MP153FAD1 | Active | TFBGA 257 10x10x1.2 P 0.5 mm | Industrial | Ecopack2 | |
STM32MP153FAB1
Package:
LFBGA 354 16x16x1.7 P 0.8 mmMaterial Declaration**:
STM32MP153FAD1
Package:
TFBGA 257 10x10x1.2 P 0.5 mmMaterial Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Junction Temperature (°C) (min) | Junction Temperature (°C) (max) | Country of Origin | Budgetary Price (US$)*/Qty | More info | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | ||||||||||||||
| STM32MP153FAC1 | No availability of distributors reported, please contact our sales office | Active | 5A992C | 5A002A4 | Tray | TFBGA 361 12x12x1.2 P 0.5 mm | - | - | -20 | 105 | SOUTH KOREA | 9.284 / 10k | |||
| STM32MP153FAB1 | 2 distributors | Active | 5A992C | 5A002A4 | Tray | LFBGA 354 16x16x1.7 P 0.8 mm | - | - | -20 | 105 | SOUTH KOREA | 9.372 / 10k | |||
| STM32MP153FAA1 | No availability of distributors reported, please contact our sales office | Active | 5A992C | 5A002A4 | Tray | LFBGA 448 18x18x1.7 P 0.8 mm | - | - | -20 | 105 | SOUTH KOREA | 10.252 / 10k | |||
| STM32MP153FAD1 | No availability of distributors reported, please contact our sales office | Active | 5A992C | 5A002A4 | Tray | TFBGA 257 10x10x1.2 P 0.5 mm | - | - | -20 | 105 | SOUTH KOREA | 8.954 / 10k | |||
Marketing Status
ActiveECCN (US)
5A992CBudgetary Price (US$)*/Qty
9.284 / 10kMarketing Status
ActiveECCN (US)
5A992CBudgetary Price (US$)*/Qty
9.372 / 10kMarketing Status
ActiveECCN (US)
5A992CBudgetary Price (US$)*/Qty
10.252 / 10kMarketing Status
ActiveECCN (US)
5A992CBudgetary Price (US$)*/Qty
8.954 / 10k(*) Suggested Resale Price (USD) per defined quantity for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
