Product overview
Description
The Teseo-LIV3F module is an easy to use Global Navigation Satellite System (GNSS) standalone module, embedding TeseoIII single die standalone positioning receiver IC working simultaneously on multiple constellations (GPS/Galileo/Glonass/BeiDou/QZSS). The Teseo-LIV3F modules bring the proven accuracy and robustness of Teseo chips to the reach of everyone: the embedded firmware and the complete evaluation environment save development time, while the compactness and cost-effectiveness of this solution make it ideal for several applications, such as insurance, goods tracking, drones, tolling, anti-theft systems, people and pet location, vehicle tracking, emergency calls, fleet management, vehicle sharing, diagnostics and public transportation.Within its 9.7x10.1 mm tiny size, Teseo-LIV3F is offerinDS12152g superior accuracy thanks to the on board 26 MHz Temperature Compensated Crystal Oscillator (TCXO) and a reduced Time To First Fix (TTFF) relying to its dedicated 32 KHz Real Time Clock (RTC) oscillator.
Thanks to the embedded 16 Mbit flash Teseo-LIV3F offers many extra features such as data logging, 7 days autonomous assisted GNSS, FW reconfigurability as well as FW upgrades.
Teseo-LIV3F provides also the Autonomous Assisted GNSS able to predict satellite data based on previous observation of satellite.
Teseo-LIV3F module, being a certified solution, optimizes the time to market of the final applications with a temperature operating range from -40°C to 85°C.
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All features
- Simultaneously multiconstellation
- -163 dBm navigation sensitivity
- 1.5 m CEP accuracy positioning
- 16 Mbit embedded Flash for data logging and FW upgrade
- 2.1 V to 4.3 V supply voltage range
- Tiny LCC 18 pin package (9.7x10.1)
- Operating temperature (-40°, 85°C)
- Free FW configuration
- 17 μW standby current and 75 mW tracking power consumption
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All tools & software
All resources
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Product Specifications (1)
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| 14 Oct 2019 | 14 Oct 2019 |
Application Notes (3)
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| 17 Mar 2021 | 17 Mar 2021 | |||
| 17 Mar 2021 | 17 Mar 2021 | |||
| 17 Mar 2021 | 17 Mar 2021 |
User Manuals (2)
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| 17 Mar 2021 | 17 Mar 2021 | |||
| 17 Mar 2021 | 17 Mar 2021 |
Application Notes for related Tools & Software (1)
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|---|---|---|---|---|
| 17 Dec 2019 | 17 Dec 2019 |
Presentations (5 of 6)
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| 17 Mar 2021 | 17 Mar 2021 | |||
| 14 Apr 2020 | 14 Apr 2020 | |||
| 14 Apr 2020 | 14 Apr 2020 | |||
| 14 Apr 2020 | 14 Apr 2020 | |||
| 17 Mar 2021 | 17 Mar 2021 | |||
| 11 Jun 2019 | 11 Jun 2019 |
Flyers (1)
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| 17 Mar 2021 | 17 Mar 2021 |
Product Certifications (1)
| Resource title | Latest update | |||
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| 17 Apr 2019 | 17 Apr 2019 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - Teseo-LIV3F
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
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3D models
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| TESEO-LIV3F | Active | RF MODULE | Industrial | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||
| TESEO-LIV3F | 6 distributors | Buy Direct | Active | 7A994 | NEC | Tape And Reel | RF MODULE | -40 | 85 | SOUTH KOREA | ||
(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
