Solution Description
This Condition Monitoring and Predictive Maintenance framework combines smart sensor nodes that collect vibration, ultrasound and environmental data with Wi-Fi or cellular connectivity to a central data lake such as a Cloud service.
Critical vibration data is processed locally on an STM32L4+ microcontroller by combining 3-axis acceleration data from a 6kHz IIS3DWB vibration sensor and ultrasound data up to 80kHz from a MP23ABS1 microphone sensor, in order to generate frequency and time domain analyses such as FFT, RMS, and Peak Acceleration. Environmental pressure, temperature and humidity data is also collected by the LPS22HB and HTS221 sensors embedded on the node.
The very low power requirements of the MCU and the sensors allow for compact, battery-operated nodes driven by the STBC02 battery charger.
The STM32L4+ microcontroller supports wireless data transmission through an additional Wi-Fi module such as the Inventek ISM43362.M3G-L44, or via a cellular modem such as the Quectel BG96, which supports LTE Cat M1 and NB-IoT connectivity with a plastic Micro-SIM (3FF).
ST provides a Predictive Maintenance Dashboard application based on AWS IoT core and other AWS services to provision nodes, plot data, and configure triggers as part of an end-to-end solution
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Key Product Benefits
STM32L4R9ZI - Ultra-low power MCU plus high speed EEPROM
Ultra-low-power microcontroller based on ultra-low power Arm Cortex-M4 32-bit RISC core with single-precision floating-point unit (FPU), digital signal processing (DSP) and memory protection (MPU) unit. This MCU allows high speed sensor data streaming at the maximum ODR, and the 2MB Flash can host machine learning algorithms for anomaly detection
IIS3DWB - Ultra-wide band vibration sensor
Ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration sensor is highly suited to applications involving vibration analysis up to 6kHz, both in terms of performance and cost.
LPS22HB and HTS221 - High accuracy environmental sensors
The LPSSHB digital pressure and HTS221 relative humidity and temperature sensors complete the data requirements for a comprehensive condition monitoring scenario.
MP23ABS1 - Wideband MEMS microphone
The wideband analog MEMS microphone up to 80kHz allows vibration data collection and analysis well into the ultrasound frequency range.
The proposed architecture is based on the SensorTile Wireless Industrial Node (STEVAL-STWINKT1), with Wi-Fi and cellular connectivity provided by the STEVAL-STWINWFV1 and STMod+ (from P-L496G-CELL02 kit) expansion boards, respectively.
These boards combine to form a smart sensor node with a core STM32L4+ that is able to transmit:
- time and frequency domain vibration data from the embedded accelerometer IIS3DWB up to 6kHz
- ultrasound detection with frequency analysis up to 80kHz from MP231ABS
- environmental pressure, humidity, and temperature data
The environmental data and processed FFT data from the accelerometer and ultrasound microphone is then sent via MQTT over Wi-Fi or Cellular to the DSH-PREDMNT dashboard based on the AWS IoT Cloud infrastructure.
The DSH-PREDMNT dashboard is a web-based tool to manage device provisioning, configuration, data injection and analysis, and simple thresholds for anomaly detection from a centralized Cloud service. The shadow devices on the Cloud are automatically synchronized with the smart sensor nodes as soon as connection is established.
The dashboard is accessible after signing a licence agreement with limited free usage and registration of up to 5 devices. Additional restrictions may be applied as described in the licence agreement.
Estimated cost
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Part Number | General Description | Marketing Status | Download | Previous versions |
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FP-IND-PREDMNT1 | STM32Cube function pack for multi sensors node with signal processing to enable predictive maintenance | Active |
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This Agreement may not be modified or any right of You or ST waived, except by means of an amendment which expressly references this Agreement and is duly executed by duly authorised representatives of You, ST and its Affiliates. The waiver by either party of any breach of any provisions of this Agreement shall not operate or be construed as a waiver of any other or a subsequent breach of the same or a different provision. This Agreement may not be assigned by You, nor any of Your rights or obligations hereunder, to any third party without prior written consent of ST (which shall not be unreasonably withheld). In the event that this Agreement is assigned effectively to a third party, this Agreement shall bind upon successors and assigns of the parties hereto. Notwithstanding the foregoing, ST may assign this Agreement as well as its rights and obligations in whole or in part to any of its Affiliates as well as to any person or entity, in connection with any transfer of any ST business or part of business to which this Agreement pertains, by merger, consolidation, reorganization or otherwise. Nothing in this Agreement shall create, or be deemed to create, a partnership or the relationship of principal and agent or employer and employee between the Parties. Neither Party has the authority or power to bind, to contract in the name of or to create a liability for the other in any way or for any purpose. |
STSW-STWINCELL | Cellular to cloud connectivity software package for STEVAL-STWINKT1 evaluation kit for industrial IoT applications | Active |
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However the right to use the Licensed Materials incorporated in a Licensee Product as per Article 1 will survive with respect to Licensee Products sold, licensed or distributed before the termination of this PLLA. If a court or agency of competent jurisdiction holds any term of this PLLA invalid, illegal, or unenforceable for any reason, the remainder of this PLLA shall be valid and enforceable and You and ST shall discuss in good faith a substitute, valid, enforceable provision which most nearly effects the parties intent in entering into this PLLA. The failure by ST to enforce any provisions of this PLLA or to exercise any right in respect thereto shall not be construed as constituting a waiver of its rights thereof. No agency, joint venture, partnership or other business organisation shall be created or be construed as being created by reason of this PLLA. 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DSH-PREDMNT | Cloud based web application for condition monitoring and predictive maintenance | Active | Go to site |
All Evaluation Features
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- STEVAL-STWINKT1
- Multi-sensing wireless platform implementing vibration monitoring and ultrasound detection
- Built around STWIN core system board with processing, sensing, connectivity and expansion capabilities
- Micro SD Card slot for standalone data logging applications
- Wireless BLE4.2 (on-board) and Wi-Fi (with STEVAL-STWINWFV1 expansion board), and wired RS485 and USB OTG connectivity
- Option to implement Authentication and Brand protection secure solution with STSAFE-A100 (footprint)
- Wide range of industrial IoT sensors:
- ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration sensor (IIS3DWB)
- 3D accelerometer + 3D Gyro iNEMO inertial measurement unit (ISM330DHCX) with machine learning core
- ultra-low-power high performance MEMS motion sensor (IIS2DH)
- ultra-low-power 3-axis magnetometer (IIS2MDC)
- digital absolute pressure sensor (LPS22HH)
- relative humidity and temperature sensor (HTS221)
- low-voltage digital local temperature sensor (STTS751)
- industrial grade digital MEMS microphone (IMP34DT05)
- wideband analog MEMS microphone (MP23ABS1)
- Modular architecture, expandable via on-board connectors:
- STMOD+ and 40-pin flex general purpose expansions
- 12-pin male plug for connectivity expansions
- 12-pin female plug for sensing expansions
- Other kit components:
- Li-Po battery 480 mAh
- STLINK-V3MINI debugger with programming cable
- Plastic box
- STEVAL-STWINWFV1
- Plugs into STWIN core system board through dedicated 12-pin connector
- Single 3.3 V power supply input
- ISM43362-M3G-L44-E Wi-Fi module:
- 802.11 b/g/n Compatible based on Broadcom MAC/Baseband/Radio device
- Fully contained TCP/IP stack
- Host interface: SPI up to 25 MHz
- Network features ICMP ( Ping), ARP, DHCP,TCP, UDP
- Low power operation (3.3 V supply) with built-in low power modes
- Secure Wi-Fi authentication WEP-128, WPA-PSK (TKIP), WPA2-PSK
- CE certified
- FCC certified
- IC certified
- RoHS and China RoHS compliant
- WEEE compliant
- P-L496G-CELL02 STMod+ cellular expansion board with antenna
- Quectel BG96 worldwide cellular modem LTE Cat M1/Cat NB1/EGPRS module 300 kbps downlink, 375 kbps uplink
- Modem reset red LED and modem signaling green LED
- ST Incard™ eSIM based on ST33
- Switchable SIM interface, eSIM and MicroSIM
- Pulse SMA antenna for frequency ranges: 824 / 900 / 1800 / 1900 / 2100 MHz
- STEVAL-STWINKT1
MEMS and Sensors
Part number | Description |
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HTS221 | Capacitive digital sensor for relative humidity and temperature |
IIS3DWB | Ultra-wide bandwidth, low-noise, 3-axis digital vibration sensor |
LPS22HB | MEMS nano pressure sensor: 260-1260 hPa absolute digital output barometer |
MP23ABS1 | High performance MEMS audio sensor single ended analog bottom-port microphone |
Microcontrollers & Microprocessors
Part number | Description |
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STM32L4R9ZI | Ultra-low-power with FPU Arm Cortex-M4 MCU 120 MHz with 2048 kbytes of Flash memory, USB OTG, DFSDM, LCD-TFT, MIPI DSI |
All resources
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User Manuals (1)
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14 Dec 2020 |
14 Dec 2020
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Presentations (3)
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12 Jun 2020 |
12 Jun 2020
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14 Dec 2020 |
14 Dec 2020
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12 Jun 2020 |
12 Jun 2020
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EDA Symbols, Footprints and 3D Models
STMicroelectronics - SL-PREDMNT-S2C
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