STM32CubeIDE
Free STM32 development tool
The STM32Cube software ecosystem offers two powerful integrated development environments: STM32CubelDE and STM32CubelDE for Visual Studio Code. While both tools simplify development and enable robust debugging, they address different developer preferences and workflows.
Main features
STM32CubelDE and STM32CubelDE for Visual Studio Code are part of the STM32Cube ecosystem. They provide robust functionalities to streamline development, such as cross - platform compatibility, version control, and many more.
- Editor
- Build system
- Debugging
Code editor
The editor offers automated code completion, syntax and active code highlighting, call hierarchy, function/hover preview, and code templates.
User-friendly build tools
Intuitive graphical interfaces that streamline the configuration and analysis of build settings and results.
A comprehensive toolbox
Serial wire viewer (SWV) trace capabilities, statistical profiling, real-time operating system awareness for FreeRTOS and AzureRTOS/ThreadX, special function register (SFR) views. Traditional debugging capabilities are also available, such as code and data breakpoints, stepping, and code disassembling.
- Editor
- Build system
- Debugging
A powerful code and IP editor
High-end editing features, such as syntax highlighting, smart completion and hovers, thanks to IntelliSense and clangd.
Flexible build tools
The build system relies on the C/C++ industry standard CMake and Ninja tools. Developers can move existing CMake-driven code bases into STM32Cube for Visual Studio Code with close to zero porting effort. Leveraging CMake enables ACI integration, compiler freedom, and simplifies the integration of third-party test tools.
A flexible debugger
STM32Cube for Visual Studio Code includes its own debugging extension to enable single-click debug launches for ST-LINK and SEGGER J-LINK probes. Debug configurations are highly customisable and the debugger offers basic and advanced features.
What is the difference between STM32CubeIDE and STM32CubelDE for Visual Studio Code?
| Features | |  |
|---|---|---|
| STM32 device support | Full MCU and MPU portfolio | Full MCU portfolio |
| Target audience | Developers preferring an integrated GUI | Developers preferring modularity / flexibility |
| Development style | GUI-rich, all-in-one IDE | Lightweight, code-centric environment |
| Host OS support | Window® Linux®, macOS® | Window® Linux®, macOS® |
| Base framework | Eclipse®,CDT™ | Microsoft® Visual Studio Code® |
| Project creation | STM32CubeMX, Empty, CMake, Make | STM32CubeMX, Empty, CMake |
| Editor | EClipse/CDT | IntelliSense LSP-driven clangd |
| Build system | Integrated build system | CMake-based with Ninja support |
| Debugging | Advanced debugging with SWV, RTOS-aware | Basic debugging with RTOS-aware |
| Customization | Eclipse® add-ons | VS Code® marketplace |
Resources to start your project
STM32CubeIDE
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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This link will be valid for 24 hours.
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Please check your spam filters in case you did not receive the e-mail.
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Please log in to MyST or create an account to start the download.
Please create an account to start the download, or continue as a guest.
License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
The e-mail that you have entered during the download attempt has not yet been validated.
Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
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ST.com users may login at this time to begin download. Non-ST.com users may either create an account at this time or enter an email address to receive a download link to the software.
Please log in to MyST or create an account to start the download.
Please create an account to start the download, or continue as a guest.
License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
The e-mail that you have entered during the download attempt has not yet been validated.
Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
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ST.com users may login at this time to begin download. Non-ST.com users may either create an account at this time or enter an email address to receive a download link to the software.
Please log in to MyST or create an account to start the download.
Please create an account to start the download, or continue as a guest.
License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
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Please check your spam filters in case you did not receive the e-mail.
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Please check your inbox for the e-mail with the download link.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
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Please check your spam filters in case you did not receive the e-mail.
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Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
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Please create an account to start the download, or continue as a guest.
License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
Something went wrong with the server request. Please try again in a few moments.
If you don't want to login now, you can download the software by simply providing your name and e-mail address in the form below and validating it.
This allows us to stay in contact and inform you about updates of this software.
For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
The e-mail that you have entered during the download attempt has not yet been validated.
Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
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Please check your spam filters in case you did not receive the e-mail.
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Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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This allows us to stay in contact and inform you about updates of this software.
For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
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Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
For security / validation purposes, all software download requests must originate from a valid email address.
ST.com users may login at this time to begin download. Non-ST.com users may either create an account at this time or enter an email address to receive a download link to the software.
Please log in to MyST or create an account to start the download.
Please create an account to start the download, or continue as a guest.
License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
Something went wrong with the server request. Please try again in a few moments.
If you don't want to login now, you can download the software by simply providing your name and e-mail address in the form below and validating it.
This allows us to stay in contact and inform you about updates of this software.
For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
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Please check your spam filters in case you did not receive the e-mail.
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Please check your spam filters in case you did not receive the e-mail.
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In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
Something went wrong with the server request. Please try again in a few moments.
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This allows us to stay in contact and inform you about updates of this software.
For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
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Please check your spam filters in case you did not receive the e-mail.
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Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
Something went wrong with the server request. Please try again in a few moments.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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If you don't want to login now, you can download the software by simply providing your name and e-mail address in the form below and validating it.
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For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
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Please check your spam filters in case you did not receive the e-mail.
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Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
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Please log in to MyST or create an account to start the download.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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If you don't want to login now, you can download the software by simply providing your name and e-mail address in the form below and validating it.
This allows us to stay in contact and inform you about updates of this software.
For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
The e-mail that you have entered during the download attempt has not yet been validated.
Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
For security / validation purposes, all software download requests must originate from a valid email address.
ST.com users may login at this time to begin download. Non-ST.com users may either create an account at this time or enter an email address to receive a download link to the software.
Please log in to MyST or create an account to start the download.
Please create an account to start the download, or continue as a guest.
License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
Something went wrong with the server request. Please try again in a few moments.
If you don't want to login now, you can download the software by simply providing your name and e-mail address in the form below and validating it.
This allows us to stay in contact and inform you about updates of this software.
For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
The e-mail that you have entered during the download attempt has not yet been validated.
Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
For security / validation purposes, all software download requests must originate from a valid email address.
ST.com users may login at this time to begin download. Non-ST.com users may either create an account at this time or enter an email address to receive a download link to the software.
Please log in to MyST or create an account to start the download.
Please create an account to start the download, or continue as a guest.
License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
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Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
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Please log in to MyST or create an account to start the download.
Please create an account to start the download, or continue as a guest.
License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
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Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
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Please log in to MyST or create an account to start the download.
Please create an account to start the download, or continue as a guest.
License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
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Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
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ST.com users may login at this time to begin download. Non-ST.com users may either create an account at this time or enter an email address to receive a download link to the software.
Please log in to MyST or create an account to start the download.
Please create an account to start the download, or continue as a guest.
License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
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Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
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ST.com users may login at this time to begin download. Non-ST.com users may either create an account at this time or enter an email address to receive a download link to the software.
Please log in to MyST or create an account to start the download.
Please create an account to start the download, or continue as a guest.
License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
The e-mail that you have entered during the download attempt has not yet been validated.
Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
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Please check your spam filters in case you did not receive the e-mail.
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Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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This allows us to stay in contact and inform you about updates of this software.
For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
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Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
For security / validation purposes, all software download requests must originate from a valid email address.
ST.com users may login at this time to begin download. Non-ST.com users may either create an account at this time or enter an email address to receive a download link to the software.
Please log in to MyST or create an account to start the download.
Please create an account to start the download, or continue as a guest.
License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
Something went wrong with the server request. Please try again in a few moments.
If you don't want to login now, you can download the software by simply providing your name and e-mail address in the form below and validating it.
This allows us to stay in contact and inform you about updates of this software.
For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
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Please check your spam filters in case you did not receive the e-mail.
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Please check your spam filters in case you did not receive the e-mail.
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In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
Something went wrong with the server request. Please try again in a few moments.
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This allows us to stay in contact and inform you about updates of this software.
For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
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Please check your spam filters in case you did not receive the e-mail.
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Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
Something went wrong with the server request. Please try again in a few moments.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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If you don't want to login now, you can download the software by simply providing your name and e-mail address in the form below and validating it.
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For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
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Please check your spam filters in case you did not receive the e-mail.
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Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
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Please log in to MyST or create an account to start the download.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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If you don't want to login now, you can download the software by simply providing your name and e-mail address in the form below and validating it.
This allows us to stay in contact and inform you about updates of this software.
For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
The e-mail that you have entered during the download attempt has not yet been validated.
Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
For security / validation purposes, all software download requests must originate from a valid email address.
ST.com users may login at this time to begin download. Non-ST.com users may either create an account at this time or enter an email address to receive a download link to the software.
Please log in to MyST or create an account to start the download.
Please create an account to start the download, or continue as a guest.
License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
Something went wrong with the server request. Please try again in a few moments.
If you don't want to login now, you can download the software by simply providing your name and e-mail address in the form below and validating it.
This allows us to stay in contact and inform you about updates of this software.
For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
The e-mail that you have entered during the download attempt has not yet been validated.
Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
For security / validation purposes, all software download requests must originate from a valid email address.
ST.com users may login at this time to begin download. Non-ST.com users may either create an account at this time or enter an email address to receive a download link to the software.
Please log in to MyST or create an account to start the download.
Please create an account to start the download, or continue as a guest.
License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
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Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
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Please log in to MyST or create an account to start the download.
Please create an account to start the download, or continue as a guest.
License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
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Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
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Please log in to MyST or create an account to start the download.
Please create an account to start the download, or continue as a guest.
License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
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Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
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ST.com users may login at this time to begin download. Non-ST.com users may either create an account at this time or enter an email address to receive a download link to the software.
Please log in to MyST or create an account to start the download.
Please create an account to start the download, or continue as a guest.
License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
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Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
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ST.com users may login at this time to begin download. Non-ST.com users may either create an account at this time or enter an email address to receive a download link to the software.
Please log in to MyST or create an account to start the download.
Please create an account to start the download, or continue as a guest.
License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
The e-mail that you have entered during the download attempt has not yet been validated.
Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
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Please check your spam filters in case you did not receive the e-mail.
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Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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This allows us to stay in contact and inform you about updates of this software.
For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
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Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
For security / validation purposes, all software download requests must originate from a valid email address.
ST.com users may login at this time to begin download. Non-ST.com users may either create an account at this time or enter an email address to receive a download link to the software.
Please log in to MyST or create an account to start the download.
Please create an account to start the download, or continue as a guest.
License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
Something went wrong with the server request. Please try again in a few moments.
If you don't want to login now, you can download the software by simply providing your name and e-mail address in the form below and validating it.
This allows us to stay in contact and inform you about updates of this software.
For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
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Please check your spam filters in case you did not receive the e-mail.
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Please check your spam filters in case you did not receive the e-mail.
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In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
Something went wrong with the server request. Please try again in a few moments.
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This allows us to stay in contact and inform you about updates of this software.
For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
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Please check your spam filters in case you did not receive the e-mail.
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Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
Something went wrong with the server request. Please try again in a few moments.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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If you don't want to login now, you can download the software by simply providing your name and e-mail address in the form below and validating it.
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For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
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Please check your spam filters in case you did not receive the e-mail.
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Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
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Please log in to MyST or create an account to start the download.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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If you don't want to login now, you can download the software by simply providing your name and e-mail address in the form below and validating it.
This allows us to stay in contact and inform you about updates of this software.
For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
The e-mail that you have entered during the download attempt has not yet been validated.
Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
For security / validation purposes, all software download requests must originate from a valid email address.
ST.com users may login at this time to begin download. Non-ST.com users may either create an account at this time or enter an email address to receive a download link to the software.
Please log in to MyST or create an account to start the download.
Please create an account to start the download, or continue as a guest.
License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
Something went wrong with the server request. Please try again in a few moments.
If you don't want to login now, you can download the software by simply providing your name and e-mail address in the form below and validating it.
This allows us to stay in contact and inform you about updates of this software.
For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
The e-mail that you have entered during the download attempt has not yet been validated.
Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
For security / validation purposes, all software download requests must originate from a valid email address.
ST.com users may login at this time to begin download. Non-ST.com users may either create an account at this time or enter an email address to receive a download link to the software.
Please log in to MyST or create an account to start the download.
Please create an account to start the download, or continue as a guest.
License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
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Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
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Please log in to MyST or create an account to start the download.
Please create an account to start the download, or continue as a guest.
License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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For subsequent downloads this step will not be required for most of our software.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
You’ll receive a clickable email shortly to validate your email and start the download.
This link will be valid for 24 hours.
Please check your spam filters in case you did not receive the e-mail.
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Please check your inbox for the e-mail with the download link.
In case you did not receive the e-mail, or you entered a wrong e-mail address, you can start-over the process.
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Please log in to MyST or create an account to start the download.
Please create an account to start the download, or continue as a guest.
License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.
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You’ll receive a clickable email shortly to validate your email and start the download.
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Please check your spam filters in case you did not receive the e-mail.
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License Agreement
BY CLICKING ON THE "I ACCEPT" BUTTON OR BY UNZIPPING, INSTALLING, COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF, INCLUDING ANY RELATED DOCUMENTATION (collectively the “SOFTWARE PACKAGE”) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (collectively "STMICROELECTRONICS”), YOU (hereinafter referred also to as “THE RECIPIENT”), ON BEHALF OF YOURSELF, OR ON BEHALF OF ANY ENTITY BY WHICH YOU ARE EMPLOYED AND/OR ENGAGED, AGREE TO BE BOUND BY THIS AGREEMENT.
Under STMICROELECTRONICS’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in the SOFTWARE PACKAGE and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the SOFTWARE PACKAGE or any part thereof, with or without modification, are permitted provided that the following conditions are met:
- Redistribution of source code (modified or not) must retain any copyright notice accompanying the SOFTWARE PACKAGE, this list of conditions and the disclaimer below.
- Redistributions in binary form, except as embedded into a processing unit device manufactured by or for STMicroelectronics or a software update for any such device, must reproduce the accompanying copyright notice, this list of conditions and the below disclaimer in capital type, in the documentation and/or other materials provided with the distribution.
- Neither the name of STMicroelectronics nor the names of other contributors to the SOFTWARE PACKAGE may be used to endorse or promote products derived from the SOFTWARE PACKAGE or part thereof without specific written permission.
- The SOFTWARE PACKAGE or any part thereof, including modifications and/or derivative works of the SOFTWARE PACKAGE, must be used and execute solely and exclusively on or in combination with a processing unit device manufactured by or for STMicroelectronics.
- No use, reproduction or redistribution of the SOFTWARE PACKAGE partially or totally may be done in any manner that would subject the SOFTWARE PACKAGE to any Open Source Terms (as defined below).
- Some portion of the SOFTWARE PACKAGE may contain software subject to Open Source Terms (as defined below) applicable for each such portion (“Open Source Software”), as further specified in the SOFTWARE PACKAGE. Such Open Source Software is supplied under the applicable Open Source Terms and is not subject to the terms and conditions of this AGREEMENT. “Open Source Terms” shall mean any open source license which requires as part of distribution of software that the source code of such software is distributed therewith or otherwise made available, or open source license that substantially complies with the Open Source definition specified at www.opensource.org and any other comparable open source license such as for example GNU General Public License (GPL), Eclipse Public License (EPL), Apache Software License, BSD license and MIT license.
- The SOFTWARE PACKAGE may also include third party software as expressly specified in the SOFTWARE PACKAGE subject to specific license terms from such third parties. Such third-party software is supplied under such specific license terms and is not subject to the terms and conditions of this AGREEMENT. By installing copying, downloading, accessing or otherwise using the SOFTWARE PACKAGE, the RECIPIENT agrees to be bound by such license terms with regard to such third-party software.
- STMicroelectronics has no obligation to provide any maintenance, support or updates for the SOFTWARE PACKAGE.
- The SOFTWARE PACKAGE is and will remain the exclusive property of STMicroelectronics and its licensors. The RECIPIENT will not take any action that jeopardizes STMicroelectronics and its licensors' proprietary rights or acquire any rights in the SOFTWARE PACKAGE, except the limited rights specified hereunder.
- The RECIPIENT shall comply with all applicable laws and regulations affecting the use of the SOFTWARE PACKAGE or any part thereof including any applicable export control law or regulation.
- Redistribution and use of the SOFTWARE PACKAGE partially or any part thereof other than as permitted under this AGREEMENT is void and will automatically terminate RECIPIENT’s rights under this AGREEMENT.
- The RECIPIENT shall be solely liable to determine and verify that the SOFTWARE PACKAGE is fit for the RECIPIENT intended use, environment or application and comply with all regulatory, safety and security related requirements concerning any use.
THE SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THE SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.
EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY.