22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

DATE: April 19-20-21-22, 2021 – virtual event

Website: Click here

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 Listen to ST experts present our latest innovations on thermal Mechanical and Multi-physics simulation in microelectronics!

Date Time (CET) Title Speaker
19 April 9:00am KEYNOTE: Simulation, a reality for successfully IC packaging heterogenous integration Laurent Herard
April 21 13:00 Weibull Analysis of Failure Strength and Flexural Modulus in 4H-SiC Die
through a 3-PB test
Vincenzo Vinciguerra
April 21 15:30 Thermomechanical deformation characterization for full-molded sensor package Marco Del Sarto
On Demand
  Paralleling Silicon Carbide MOSFETs in Power Module for Traction Inverters: a Parametric Study Alessandro Sitta
On Demand
  Thermo-mechanical finite element simulation and visco-plastic solder fatigue for low voltage discrete package Alessandro Sitta
On demand program   On the Way to understand the Warpage in 8” Taiko Semiconductor Wafers for Power Electronics Applications (Si and SiC) Vincenzo Vinciguerra




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