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	<title>STMicroelectronics News Release</title>
	<link>https://www.st.com/content/st_com/ja/press-rss.html</link>
	<description>A Collection of STMicroelectronics News Release</description>
	<language>ja</language>
	<lastBuildDate>Wed, 22 Jul 2026 05:40:00 +0200</lastBuildDate>
<item>
	<title><![CDATA[STマイクロエレクトロニクス、2026年第2四半期の業績発表とコンファレンス･コールの日程を発表]]></title>
	<description><![CDATA[多種多様な電子機器に半導体を提供する世界的半導体メーカーのSTマイクロエレクトロニクス（NYSE:STM、以下ST）は、2026年第2四半期の業績を2026年7月23日木曜日（ヨーロッパの証券取引所の取引時間開始前）に発表します。 また、STマイクロエレクトロニクスは、アナリスト、投資家および報道関係者などを対象に、2026年第2四半期の業績結果ならびに現時点での見通しに関するコンファレンス･コールを、2026年7月23日 木曜日 日本時間16時30分（中央ヨーロッパ標準時9時30分 / 米国東部標準時3時30分）より行う予定です。 このコンファレンス･コールは、STのウェブサイト（https://investors.st.com）でライブ配信（視聴専用モード）され、2026年8月7日（金）まで聴くことが可能です。 2026年第2四半期の業績発表プレスリリースは、発表後、STのウェブサイト（http://www.st.com/jp）にてご覧いただけます。 STマイクロエレクトロニクスについて STは、約49,000名の従業員を擁し、包括的なサプライ・チェーンと最先端の製造設備を有する世界的な総合半導体メーカーです。約20万社を超えるお客様や数千社のパートナー企業と協力しながら、お客様のビジネス創出や持続可能な社会をサポートする半導体ソリューションの開発ならびにエコシステムの構築に取り組んでいます。STのテクノロジーは、スマート・モビリティ、電力エネルギー管理の効率化、クラウド接続型自律デバイスの普及を可能にします。STは、すべての直接・間接排出（スコープ1および2）、ならびに製品輸送、従業員の出張･通勤による排出（スコープ3の注力分野）におけるカーボンニュートラル達成に向けた取り組みを進めており、2027年末までに再生可能エネルギーの使用率を100％にする計画です。さらに詳しい情報はSTのウェブサイト（http://www.st.com）をご覧ください。]]></description>
	<link>https://newsroom.st.com/ja/media-center/press-item.html/c3399.html</link>
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	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Tue, 14 Jul 2026 08:31:48 +0200</pubDate>

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	<title><![CDATA[Turning light into trusted data: how STMicroelectronics is reinventing Imaging for the AI era]]></title>
	<description><![CDATA[In this Q&A, Alexandre BALMEFREZOL, Executive Vice President of ST’s Imaging subgroup, explains how IMG is evolving beyond traditional imaging and why the future of sensors is about perception, not just capturing images. To start, who is ST’s Imaging subgroup and how is imaging evolving in the AI era? IMG is a long-established organization inside STMicroelectronics, with more than 25 years of expertise in optical sensing. Our technologies are already deployed at scale, embedded in billions of devices across multiple markets. We started with camera image sensors and expanded step by step. Today, our mission is much broader: we enable what we call “physical AI”: systems that can sense, interpret, and respond to their environment. That means going beyond conventional imaging to combine vision, depth, and contextual sensing into true machine perception. The industry is moving from imaging designed for human interpretation to sensing designed for machine perception. That shift has two major implications. First, sensors must go beyond visible light to capture additional dimensions of information, such as depth or infrared signals. Second, they must be highly efficient, because much of this data will be processed locally, often under tight power and latency constraints. What does this mean in practice for sensor design, and what is ST’s role in this transformation? It changes the design priorities. Rather than optimizing only for resolution or image quality, we optimize for system-level performance: power consumption, latency, integration complexity and the ease with which the sensor’s output can be used by AI. Our technologies are therefore designed to provide context, not just pixels. They are conceived as elements of a broader system that includes computing, software and algorithms — all co-designed to enable perception. Our role is to make this transition possible with integrated sensing systems. We bring together vision, depth and processing in coherent, optimized solutions. That is why we say imaging is no longer just about cameras; it is about converting light into usable data that powers intelligent behavior at the edge. This is what unlocks the next wave of AI applications in real-world environments. How would you describe IMG’s strategy and positioning today? The industry is shifting from imaging for people to sensing for machines, and our strategy reflects that evolution. With over 3 billion ToF sensors shipped, ST is moving beyond components to deliver integrated sensing systems that combine depth, vision, and AI-ready processing for real-world applications. Our core ambition is to transform light into trusted data that AI can consume directly to understand a scene and support decisions. Instead of following the entire imaging market, we concentrate on domains where sensing truly drives system value: depth sensing, AI-driven vision and highly integrated solutions. This focus positions us not as a commodity camera supplier, but as a partner for advanced perception in fast-growing areas such as industrial automation, robotics and edge intelligence. HOW IS ST DIFFERENTIATED What makes this position credible in the market and where does ST differentiate? There are three main pillars: innovation over the long term, industrial scale, and our portfolio structured around two core platforms: FlightSense for depth sensing and BrightSense for AI vision; forming a complete perception stack for edge AI Over the last decade, we have shipped billions of sensors, notably in Time of Flight (ToF) and global shutter families. That volume confirms our technologies are not only advanced, but also robust and proven in the field. At the same time, because we focus on differentiated sensing, we can sustain strong positions in the segments we target and keep investing in what sets us apart. Our differentiation rests on focus and integration in high-value sensing technologies where perception, performance and system-level integration matter most. A crucial asset is our Integrated Device Manufacturer model along with what we describe as a “pixel to system” approach. We master every step, from pixel architecture and process technology to manufacturing, packaging and system integration. That gives us speed in innovation and the ability to deliver complete sensing solutions rather than standalone parts. How important are your footprint and the IDM model, and what are the practical benefits? It is central to our value proposition. We control the end-to-end chain thanks to our IDM model: sensor design, process development, front-end manufacturing in Europe and back-end operations in Asia, supported by a global network of partners and customers. This structure lets us industrialize innovations quickly, guarantee quality and reliability at scale, and tailor solutions to demanding markets such as automotive and industrial. Customers see three main advantages. First, speed: fully owning the stack means we can shorten development and bring new technologies to market faster. Second, differentiation: we can combine sensing, optics, processing and software into pre-integrated subsystems that simplify our customers’ designs. Third, scalability and robustness: our products are designed for high-volume, consistent manufacturing, which is critical for long-life, safety-critical or mission-critical applications. What role do people play in IMG’s success? They are the decisive factor. More than 800 specialists work in IMG across 13 countries, and a large share of them are dedicated to R&D. That level of commitment to innovation is essential in a domain where technology is both complex and fast-evolving. Our teams combine expertise in semiconductors, optics, photonics, signal processing, software, and systems. This breadth allows us to think in terms of complete solutions rather than isolated components, and to co optimize everything from pixels to algorithms. How does IMG sustain innovation over time? We rely on both strong internal capabilities and a rich external ecosystem. Internally, process technology, product design, and system engineering are closely aligned, enabling a fast and efficient path from research ideas to industrial products. Externally, we work with leading research institutes, as well as universities and industry partners. These collaborations help us explore technologies several years ahead of market demand and secure a continuous innovation pipeline. The balance between internal integration and external partnerships is what allows us to maintain an ambitious roadmap and deliver at scale. WHICH TECHNOLOGIES ENABLE ST’S STRATEGY What are the key technologies behind this strategy? Two pillars stand out: Time of Flight (ToF) depth sensing and AI driven vision technologies such as global shutter and RGB IR imaging. We complement these with advanced capabilities like 3D stacking, metasurface optics, and embedded processing. The goal is for the sensor not only to capture data, but to pre process and structure it so it is directly usable by AI. The real differentiation appears when all these elements are integrated into systems that are smarter, more compact, and more energy efficient. Time-of-Flight has been around for a while. How mature is this technology today, and what is new with FlightSense? It is highly mature. We have been developing ToF for more than 10 years and have shipped over 3 billion ToF sensors. What is evolving now is not the core technology itself, but the breadth of its deployment. ToF is moving well beyond smartphones into a wide range of systems that need reliable depth information. It is becoming a mainstream building block for perception. Our latest flagship is the VL53L9, a fully integrated 3D LiDAR module. It combines the emitter, receiver, processing, and power management into a compact, calibration free device. It offers more than 2,000 sensing zones, up to 100 frames per second, and a range of up to 9 meters, with a wide field of view. Beyond the raw specifications, it is designed for easy integration and reliable operation, from bright outdoor light to complete darkness. On the vision side, what is the role of BrightSense and why is RGB and Near-Infrared combination important? BrightSense is our family of vision sensors designed specifically for machines. The latest 5 megapixel devices combine innovations such as 3D stacking, 2.25 micron pixels, and a hybrid global/rolling shutter architecture. A single sensor can therefore deliver high image quality and accurate motion capture, functions that used to require different technologies. Integrating RGB and Near Infrared (NIR) in one sensor is crucial for real world operation. It allows systems to operate in both day and night conditions without mechanical filters. This simplifies system design, reduces cost and complexity, and improves robustness, especially for applications that must work reliably around the clock. How are you addressing power consumption, and how do FlightSense and BrightSense work together? Power is a critical design parameter, particularly for always on and battery powered systems. We have developed ultra low power sensors that operate at around 1–2 milliwatts in auto wake up mode. This allows devices such as wearables and smart home products to perform continuous sensing within very tight energy budgets, making always on AI practical in new form factors. Flightsense and Brightsense are complementary pillars of perception. FlightSense provides depth and spatial awareness; BrightSense delivers visual and contextual information. Together, they enable systems that can both map their surroundings and recognize what is happening. In other words, systems that can see, understand, and act. That is the foundation of a real world AI at the edge. HOW THOSE TECHNOLOGIES TRANSLATE INTO USE CASES AND WHAT DOES THIS MEAN FOR CUSTOMERS AND THE MARKET How does this translate into real-world applications and what kind of applications are driving demand? The VL53L9 opens up a wide set of use cases, including robotics, industrial automation, smart buildings, and healthcare. For example, analytics such as people detection or safety monitoring can run directly on a microcontroller. In some scenarios, applications can operate at 30 frames per second while using only about 13% of RAM and 6% of Flash. That level of efficiency is a key enabler for edge AI. We also see strong traction in smart cities, industrial automation, robotics, and security. Across these domains, the requirement is the same: devices must understand their environment, not just record it. That is why we emphasize perception rather than traditional imaging. What is the big takeaway for customers and the market? We are moving beyond individual sensors to complete perception platforms that integrate sensing, processing, and software. This helps customers build smarter, more efficient products faster, with lower power consumption, reduced system complexity, and higher performance. Sensing is becoming a system level capability and by turning light into trusted data, ST’s Imaging division is helping bring AI out of the cloud and into the physical world.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/imaging-sensing-ai-f0023.html</link>
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	<mainCategory><![CDATA[Feature]]></mainCategory>
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	<pubDate>Mon, 6 Jul 2026 07:00:26 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics announces status of common share repurchase program]]></title>
	<description><![CDATA[Disclosure of Transactions in Own Shares – Period from June 29, 2026 to July 03, 2026 STMicroelectronics N.V. (the “Company” or “STMicroelectronics”), a global semiconductor leader serving customers across the spectrum of electronics applications, announces full details of its common share repurchase program (the “Program”) disclosed via a press release dated June 21, 2024. The Program was approved by a shareholder resolution dated May 22, 2024 and by the supervisory board. STMicroelectronics N.V. (registered with the trade register under number 33194537) (LEI: 213800Z8NOHIKRI42W10) announces the repurchase (by a broker acting for the Company) on the regulated market of Euronext Paris, in the period between June 29, 2026 to July 03, 2026 (the “Period”), of 145,390 ordinary shares (equal to 0.02% of its issued share capital) at the weighted average purchase price per share of EUR 63.5445 and for an overall price of EUR 9,238,728.20. The purpose of these transactions under article 5(2) of Regulation (EU) 596/2014 (the Market Abuse Regulation) was to meet obligations arising from share option programmes, or other allocations of shares, to employees or to members of the administrative, management or supervisory bodies of the issuer or of an associate company. The shares may be held in treasury prior to being used for such purpose and, to the extent that they are not ultimately needed for such purpose, they may be used for any other lawful purpose under article 5(2) of the Market Abuse Regulation. Below is a summary of the repurchase transactions made in the course of the Period in relation to the ordinary shares of STMicroelectronics (ISIN: NL0000226223), in detailed form. Transactions in Period Dates of transaction Number of shares purchased Weighted average purchase price per share (EUR) Total amount paid (EUR) Market on which the shares were bought (MIC code) 29-Jun-26 30,390 63.9364 1,943,027.20 XPAR 30-Jun-26 30,000 64.8891 1,946,673.00 XPAR 1-Jul-26 30,000 63.8800 1,916,400.00 XPAR 2-Jul-26 30,000 62.3511 1,870,533.00 XPAR 3-Jul-26 25,000 62.4838 1,562,095.00 XPAR Total for Period 145,390 63.5445 9,238,728.20 Following the share buybacks detailed above, the Company holds in total 18,882,103 treasury shares, which represents approximately 2.1% of the Company’s issued share capital. In accordance with Article 5(1)(b) of the Market Abuse Regulation and Article 2(3) of Commission Delegated Regulation (EU) 2016/1052, a full breakdown of the individual trades in the Program are disclosed on the ST website (https://investors.st.com/stock-and-bond-information/share-buyback). About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-announces-status-of-common-share-repurchase-program-2.html</link>
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	<mainCategory><![CDATA[Share Repurchase]]></mainCategory>
	<postType><![CDATA[newsbite]]></postType>
	<pubDate>Mon, 6 Jul 2026 01:00:51 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics and the infrastructure of Cloud AI]]></title>
	<description><![CDATA[By Remi El-Ouazzane, President, Microcontrollers, Digital ICs and RF products Group, STMicroelectronics. By Marco Cassis, President, President, Analog, Power & Discrete, MEMS and Sensors Group, Head of STMicroelectronics’ Strategy, System Research and Applications, Innovation Office. Cloud AI is redefining computing at extraordinary speed. As the world\'s largest technology companies race to build AI at scale, the data center from the software and silicon to its power architecture, its networking fabric, and the fundamental physics of how information moves is being reimagined from the ground up. The shift toward accelerated workloads is a structural transformation, and it demands an entirely new generation of infrastructure. Behind every model training run and inference cluster is a fundamental question: how do you deliver enough power, move enough data, and maintain efficiency and reliability as you scale from kilowatts to megawatts, and from megawatts to gigawatts? STMicroelectronics does not design GPUs or AI models. But we play a decisive role in answering that question providing the semiconductor technologies that make AI factories possible, linking the grid to the core through advanced power conversion, high-speed connectivity, and integrated optical interconnects. The data center under pressure The numbers define the challenge. Global data center capacity is projected to nearly double, from around 103 GW in 2025 to 200 GW by 2030, with annual infrastructure spending expected to exceed $1 trillion by the end of the decade. A few years ago, a powerful server rack drew 10 to 15 kW, roughly the load of several household ovens. In the AI era, operators are planning for 500 kW to more than 1 MW per rack: enough to power hundreds of homes. Meanwhile, the data traffic between accelerators is growing in proportion, as training and serving large models requires billions of data points to move between chips every second. Legacy infrastructure was not built for this. Copper interconnects, once the backbone of data center networking, increasingly cannot meet the speed, reach, and energy-per-bit requirements of modern AI clusters. Traditional power architectures struggle with efficiency, thermal management, and physical footprint at megawatt densities. The result is rising costs, mounting complexity, and an industry-wide imperative to rethink how data centers are powered and connected. From copper to light: silicon photonics in the AI fabric The communication demands of large AI clusters have made traditional copper-based networking unsustainable at scale. Copper links struggle with attenuation and crosstalk at high speeds and across the distances needed to connect racks and rows. They also consume too much power per bit, a constraint that becomes critical when a single training cluster may contain tens of thousands of accelerators, all exchanging data continuously. Optical interconnects are becoming the backbone of Cloud AI networks. Light carries more data with lower loss, over longer distances, and with better energy efficiency. For AI training and inference workloads, where job completion time and cluster utilisation depend directly on interconnect performance, this transition is transformational. ST has invested deeply in silicon photonics to enable this shift. The PIC100 silicon photonics platform delivers high-speed, low-loss optical links for intra- and inter-data center applications. Produced on 300 mm wafers and already in high-volume production for leading hyperscalers, PIC100 gives operators a proven, scalable path to optical fabrics in AI deployments. Capacity for this platform is set to quadruple by 2027 and further expand in 2027, a reflection of the pace at which cloud providers are moving toward optical-first network architectures. This fast expansion is fully underpinned by customers’ long-term capacity reservation commitments. Photonic integrated circuits are combined with custom electronics to create optical engines suited to the full range of deployment models: traditional pluggable modules, near-packaged optics positioned close to the switch or accelerator ASIC, and co-packaged optics where electro-optical integration is deepest. ST is developing PIC100 TSV, an architecture that increases connectivity density and improves thermal performance at the module and system level, targeting the near-packaged and co-packaged optics deployments that will define the next generation of AI switches and accelerator packages. Industry forecasts project silicon photonics growing from roughly a third to nearly two-thirds of all optical technologies used in AI clusters by 2030. ST is positioning to be at the center of that growth. Intelligence at the edge of power and light As AI clusters shift to optical connectivity, they also need an intelligent control layer to configure, monitor, and protect these systems in real time. Advanced power chains and optical fabrics are only as reliable as the intelligence managing them. Optical fibres cannot monitor their own signal integrity; power systems do not self-optimise across thousands of modules without intervention. Microcontrollers and mixed-signal ICs provide the control layer that makes large-scale infrastructure dependable. Inside optical modules, STM32 high-performance microcontrollers act as local orchestrators configuring lasers and detectors, measuring temperature and voltage, exposing telemetry to host systems, and enabling modules to adapt in real time and protect against degradation. High-speed electronics built on ST\'s BiCMOS B55X process technology sit alongside photonic waveguides, driving lasers and amplifying received signals at 100 Gbps, 200 Gbps, and beyond per lane, while remaining power-efficient enough for deployment in thermally constrained AI racks. In the power path, intelligent controllers coordinate conversion stages, implement protection mechanisms, and optimise load sharing under varying operating conditions. Across a hyperscale data center, thousands of such devices collectively provide the visibility and control that Cloud AI infrastructure demands and that operators increasingly cannot do without. From grid-to-core ST supplies the critical semiconductors that power, cool, and connect AI data centers – supporting grid to core, and the core to the user addressing every major node in the Cloud AI chain: Grid → solid-state transformer → 800 VDC distribution → power racks → core power stages → xPU/GPU → optical network At each step, ST contributes specific, differentiated technology: wide-bandgap power devices and high-efficiency converters to move energy from the grid to the core; silicon photonics, BiCMOS electronics, and integrated optical engines to move data faster at lower power; and microcontrollers and mixed-signal ICs to manage, monitor, and orchestrate these systems in real time. Powering the AI factory: SiC, GaN, and 800 VDC AI workloads are fundamentally changing the power profile of data centers. Goldman Sachs estimates that total data center power demand will increase by around 165% between 2023 and 2030. To meet this demand efficiently, operators are migrating from traditional AC distribution and lower-voltage DC schemes to high-voltage DC topologies, with 800 VDC distribution emerging as the architecture of choice for next-generation AI campuses. ST\'s power technologies are designed for this reality. Silicon carbide devices address the high-voltage, high-efficiency conversion stages at the front end: grid interfaces, solid-state transformers, and HVDC distribution. Gallium nitride takes over closer to the load, where high-frequency, compact conversion enables dense power shelves and point-of-load regulators for GPUs, CPUs, and custom accelerators. Advanced controllers and low-voltage devices coordinate the full power path from 800 V down to 50 V, 12 V, 6 V, and below where modern chips operate. Working with partners including NVIDIA, ST has developed a suite of 800 VDC power-conversion architectures aligned with NVIDIA\'s reference designs for next-generation AI data centers. By reducing conversion stages and copper usage, and optimising efficiency across the chain, these solutions help hyperscalers deliver more usable power to more accelerators within the same physical footprint turning the 1 MW rack from an engineering challenge into an operational reality. Building with the hyperscalers Cloud AI is an ecosystem. A multiyear collaboration with Amazon Web Services sees ST supplying advanced connectivity ICs, mixed-signal devices, microcontrollers, and analog and power ICs integrated directly into AWS\'s compute infrastructure. It is a model of deep, long-term engagement. ST\'s work in high-voltage DC power architectures follows the same logic. By co-creating reference designs and validated solutions for 800 VDC distribution and conversion, ST helps accelerate the adoption of efficient, scalable power topologies across the industry not just for a single customer, but as a contribution to where the broader ecosystem is heading. Beyond these anchor partnerships, ST engineers work with original design manufacturers, module vendors, and research institutions to help define the standards and implementation practices that will govern how these building blocks are deployed at scale. Scaling the manufacturing engine Technology leadership is only valuable when it can be delivered in volume. With AI capacity expanding rapidly across regions, ST\'s manufacturing footprint is designed for the scale, resilience, and geographic proximity that hyperscalers require. In Italy, high-volume 200 mm silicon carbide lines supply the high-voltage, high-efficiency devices at the heart of advanced power conversion. In France, our 300 mm fabs produce digital, mixed-signal, and silicon photonics technologies including the PIC100 platform — with a committed roadmap to quadruple photonics capacity by 2027. In China, a joint venture with Sanan Optoelectronics provides 200 mm SiC device manufacturing, securing local supply in one of the world\'s fastest-growing data center markets. This distributed model ensures that as Cloud AI deployment accelerates across geographies, the critical components SiC and GaN power devices, photonic ICs, BiCMOS drivers, microcontrollers are available where and when they are needed. A long-term structural shift The AI buildout is a structural shift in how computing is delivered and where value is created. Data centers are transitioning from megawatts to gigawatts, from AC to high-voltage DC, from copper to optical interconnects. Each of these inflections maps directly onto ST\'s core competencies in connectivity, power, and control. As Cloud AI deployments scale, this segment is expected to become a significant growth engine for ST with cloud AI infrastructure revenue projected to be nicely above $500 million in 2026 and well above $1 billion in 2027. But beyond the financial trajectory, the significance is structural: ST is helping to build a new layer of critical infrastructure for the digital world. Powerful GPUs and sophisticated AI models may capture the headlines. But their performance and the economic value they generate depends on a less visible foundation of optical connectivity, power conversion, and real-time control. ST is building that foundation, systematically, from the grid to the core, so that the next generation of AI factories can operate at the efficiency, density, and scale that the world\'s demand for intelligence requires. Presentation: ST Cloud AI update]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/f0022.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/06/PR2605Servers-s.jpg]]></contentImage>
	<mainCategory><![CDATA[Feature]]></mainCategory>
	<postType><![CDATA[product press]]></postType>
	<pubDate>Fri, 26 Jun 2026 15:20:57 +0200</pubDate>

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<item>
	<title><![CDATA[STマイクロエレクトロニクス、次世代コネクテッドサービス向け耐量子コンピュータ暗号に対応した世界初のセキュア・モバイルチップST54Mを発表]]></title>
	<description><![CDATA[多種多様な電子機器に半導体を提供する世界的半導体メーカーのSTマイクロエレクトロニクスは、コネクテッドサービス間でシームレスなユーザー体験を実現すると同時に、モバイル端末や電子機器メーカーが将来の量子耐性セキュリティ要件を満たすST54Mセキュア・モバイルチップを発表しました。 ST54Mは耐量子コンピュータ暗号を処理する革新的なハードウェア回路を搭載し、NFCコントローラ、セキュア・エレメントICとeSIM機能を集積したシングルデバイスで、セキュアなモバイル接続性とサービスに向けて将来の量子耐性セキュリティ要件に対応した強力なソリューションを提供します。このソリューションは、非接触型決済、交通機関での電子チケット、入退出管理、デジタル身分証明書、運転免許証、様々なコネクテッドサービス、デジタルカーキーを含む、幅広いユースケースに対応します。 拡大するモバイルのユースケースに対応した、将来を見据えた保護対策 モバイル端末がますます信頼されるプラットフォームとして機能することに伴い、金融取引、本人確認情報、通信事業者サービス、および安全なアクセスのために、製品開発者はセキュリティ、パフォーマンス、そして利便性を損なうことなく複数の機能を統合するソリューションを必要としています。 ST54Mは、移動体通信事業者、金融機関、行政、交通機関、自動車メーカー、デジタルウォレット、サービスプロバイダなどが関わる個人の電子機器のエコシステムにわたって使用できるように開発されました。各メーカーがより強化された長期的なセキュリティ要件を満たしつつ、安定した使い慣れたユーザーエクスペリエンスを維持するデバイスの開発に貢献します。 間もなく市場に投入されるST54Mは、顧客やパートナー企業が2030年頃までに義務化される見込みの要求が厳しい業界主導型の市場展開要件に対応するのに十分な時間を確保して、耐量子コンピュータ暗号処理の対応済み製品の市場投入を可能にします。 STマイクロエレクトロニクスのコネクテッド･セキュリティ･グループ バイスプレジデント 兼 製品事業部ジェネラル･マネージャーであるDavid Richettoは、「STはST54Mの市場投入で、ユーザーが求める多様なデバイス機能を維持しつつ、巧妙化するセキュリティ脅威への対応を支援するため当社のモバイル・コンバージェンス・プラットフォームを拡大していきます。」「耐量子コンピュータ暗号を処理するハードウェア回路を搭載し、NFCコントローラ、セキュア・エレメントICとeSIM機能を集積することで、ST54Mは端末メーカーに次世代モバイル体験に向けた準備を開始するための確実な道筋を提供します」と述べています。 セキュリティ、システム統合、そして無線通信性能を最適化するために設計 ST54Mは、NFCコントローラ、セキュアアプリケーションに対応したセキュア・エレメントIC、eSIM機能とNFC規格に準拠した製品を集積した最先端のシングルダイソリューションです。主な機能は耐量子コンピュータ暗号を処理するハードウェア回路で、PQCの一つであるML-KEMとデジタル署名アルゴリズムML-DSAを搭載し、ハイブリッド暗号アプローチから完全な耐量子コンピュータ暗号への導入と移行への過渡期をサポートします。ハードウェアエンジンは、新たなPQC要件に対応しつつ、サイドチャネル攻撃やフォールトインジェクション攻撃（故障注入攻撃）からの保護を支援するために設計されました。また、これはSTの長期的なコミットメントから生み出された最新の成果であり、そこには第三者機関等により安全性や信頼性が保証されたSTM32マイクロコントローラに内蔵されるソフトウエアライブラリのNesLib-PQMLとX-CUBE-PQCも含まれています。 セキュリティアーキテクチャに加えて、ST54Mは複数のアプリケーションをサポートするための大容量メモリを統合し、強化されたRFフロントエンドも搭載しています。これらの機能により、小型アンテナやシングルエンド構成でのRF性能の向上、より安定したリーダー・ライタ動作のサポート、ならびにモバイルPOS（mPOS）やワイヤレス充電のような高度なユースケースの実現が可能です。このプラットフォームは、国際規格Common Criteria 2022を基にした欧州連合が制定したICT製品向けの共通サイバーセキュリティ認証制度EUCCに準拠し、2026年7月にEMVCo認定取得予定であり、セキュリティに敏感なモバイルアプリに最適であることを示しています。 ST54Mは現在、顧客向けにサンプル提供中で、量産および認証取得は2026年7月を目標としています。価格情報およびサンプルのリクエストについては、STのセールス･オフィスまでお問い合わせください。 さらに詳しい技術情報については、ウェブサイトをご覧ください。 STマイクロエレクトロニクスについて STは、約49,000名の従業員を擁し、包括的なサプライ・チェーンと最先端の製造設備を有する世界的な総合半導体メーカーです。約20万社を超えるお客様や数千社のパートナー企業と協力しながら、お客様のビジネス創出や持続可能な社会をサポートする半導体ソリューションの開発ならびにエコシステムの構築に取り組んでいます。STのテクノロジーは、スマート・モビリティ、電力エネルギー管理の効率化、クラウド接続型自律デバイスの普及を可能にします。STは、すべての直接・間接排出（スコープ1および2）、ならびに製品輸送、従業員の出張･通勤による排出（スコープ3の注力分野）におけるカーボンニュートラル達成に向けた取り組みを進めており、2027年末までに再生可能エネルギーの使用率を100％にする計画です。さらに詳しい情報はSTのウェブサイト（http://www.st.com）をご覧ください。]]></description>
	<link>https://newsroom.st.com/ja/media-center/press-item.html/p4784.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/06/P4784S-June-24-2026-ST54M-secure-mobile-chip_PR-IMAGE-LO-RES.jpeg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[product press]]></postType>
	<pubDate>Thu, 25 Jun 2026 09:28:30 +0200</pubDate>

</item>
<item>
	<title><![CDATA[STマイクロエレクトロニクス、業界最高レベルの解像度･性能を持つ小型ダイレクトToF 3D LiDARモジュールを発表]]></title>
	<description><![CDATA[多種多様な電子機器に半導体を提供する世界的半導体メーカーのSTマイクロエレクトロニクス（NYSE：STM、以下ST）は、高解像度のセンシングにおいて新たな基準を確立する、オールインワンの小型dToF（ダイレクトTime-of-Flight）3D LiDARモジュール「VL53L9」を発表しました。VL53L9は、最新の機能をコンパクトでコスト効率に優れたパッケージに集積し、小型のマイクロコントローラ（マイコン）上で動作する演算量の少ないAIシステム向けに、AI処理にそのまま利用できる出力データを提供します。また、ロボットやファクトリ･オートメーション（FA）、スマート･ビル、AR/VR、ヘルスケアなど、幅広いアプリケーションで高性能なセンシングを実現します。 STのエグゼクティブ･バイスプレジデント 兼 イメージング･サブグループ･ジェネラル･マネージャーであるAlexandre Balmefrezolは、次のようにコメントしています。「VL53L9は、高解像度の深度データと最大100フレーム/秒の高速データ、完全集積アーキテクチャを小型の単一モジュールに集積し、ToF測距センサの飛躍的な進化を実証しています。システム統合を簡略化してシステムの複雑さを軽減することにより、ロボットやスマート･インフラ、ヘルスケア用モニタリングなどのアプリケーション機器の開発を加速させます。本製品の発表は、スタンドアローン型のセンサのみならず、実世界のエッジAIをサポートする統合型センシング･システムを提供していくというSTの戦略を反映しています。」 Yole Groupのマーケット & テクノロジー担当アナリストであるAnas Chalak氏は、次のようにコメントしています。「3Dセンシングのニーズは、ロボットやFA、XR、インテリジェントなコンスーマ機器において、ますます増加しています。ToF技術の採用は、スマートフォンの枠を超えて、ナビゲーションや人物の検知、ジェスチャ認識、セーフティなど、小型かつ低コスト、そして高精度の深度検出を必要とするさまざまなアプリケーションへと拡大しています。より高解像度のマルチゾーンにも対応するdToFモジュールは、次世代の3Dセンシング技術の普及を実現する重要な技術になってきています。(1)」 STのFlightSense™ VL53L9は、次のような多様な産業分野のユースケースに対応した設計になっています。 - ロボット ： 小さな物体の高精度検出、SLAM（自己位置推定と環境地図作成の同時実行）、および自律走行での障害物回避機能 - FA ： タンクや容器に含まれる内容物の高精度な体積測定により、作業効率と在庫管理を向上 - スマート･ビルおよびスマート･ホーム ： ユーザのプライバシーを保護しながら、信頼性に優れたユーザ検出および人数カウント - AR/VRおよびコンスーマ機器 ： 没入感のあるユーザ体験を実現する先進的なジェスチャ認識、ボディ･トラッキング、指のスケルトン検出など - ヘルスケア：高齢者介護および患者の安全性を確保するための転倒検知とモニタリングのソリューション 技術情報 高精度かつ高効率な3Dセンシング VL53L9は、54° x 42°の広い視野角で2,268（54 x 42）という卓越した解像度を提供し、小さな物体も詳細に3D深度マッピング化することで、その輪郭やエッジを含め、高精度の検出を可能にします。ST独自の積層型BSI（裏面照射）SPAD（単一フォトンアバランシェダイオード）センサ技術と、革新的なメタサーフェス光学素子（MOE）を活用することで、5cm未満から最大9mの範囲で高速かつ高精度の測距を実現し、誤差を1%以内まで抑制するほか、100フレーム/秒の高速フレーム･レートも提供します。 エッジAIおよび簡易な集積化に適したオールインワンのセンシング･データ VL53L9は、従来のドット･スキャン方式に代わるデュアル･スキャン・フラッド照明を組み込んでいるため、モーション・アーティファクトといったブレの低減や、デッド･ゾーンの解消に加え、小さな物体の検出精度を向上すると共に、2Dの赤外線情報と3Dの深度情報を相補的に取得することができます。これにより、競合製品と比べて後処理を大幅に簡略化でき、演算能力の低い小型マイコンでさえ、幅広いエッジAIの事例を効率的に実行できます。さらに、オールインワン･モジュールであるVL53L9は、オンチップのdToF処理機能と専用のパワー･マネージメントICを集積し、キャリブレーションも不要であるため、システムへの組み込みが簡略化され、コストと複雑さも低減します。 小型サイズ VL53L9は、わずか12.8 x 6.1 x 4.6mmのリフロー対応可能なパッケージで提供され、幅広いカバー･ガラス材料に対応したモジュールです。デュアル電源（1.2Vおよび3.3V）で動作し、MIPIやI3Cインタフェースでデータを出力できるため、多様なCPUプラットフォームと互換性があります。また、レーザー安全規格のクラス1に準拠しているため、信頼性と安全性に優れた動作をエンド･ユーザに提供します。 入手方法 STのFlightSense™ VL53L9は、2026年7月上旬に量産が開始され、サンプルおよび量産品が提供される予定です。 詳細については、ウェブサイトをご覧ください。 （1）2025年から2030年の期間。出典：3D Imaging & Sensing 2025 report, Yole Group STマイクロエレクトロニクスについて STは、約49,000名の従業員を擁し、包括的なサプライ・チェーンと最先端の製造設備を有する世界的な総合半導体メーカーです。約20万社を超えるお客様や数千社のパートナー企業と協力しながら、お客様のビジネス創出や持続可能な社会をサポートする半導体ソリューションの開発ならびにエコシステムの構築に取り組んでいます。STのテクノロジーは、スマート・モビリティ、電力エネルギー管理の効率化、クラウド接続型自律デバイスの普及を可能にします。STは、すべての直接・間接排出（スコープ1および2）、ならびに製品輸送、従業員の出張･通勤による排出（スコープ3の注力分野）におけるカーボンニュートラル達成に向けた取り組みを進めており、2027年末までに再生可能エネルギーの使用率を100％にする計画です。さらに詳しい情報はSTのウェブサイト（http://www.st.com）をご覧ください。]]></description>
	<link>https://newsroom.st.com/ja/media-center/press-item.html/p4783.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/06/P4783D-Jun-22-2026-VL53L9-ToF-3D-LiDAR-module_PR-IMAGE-LO-RES.jpg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[product press]]></postType>
	<pubDate>Mon, 22 Jun 2026 07:01:24 +0200</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics prices a US$1.5 billion dual-tranche offering of New Convertible Bonds]]></title>
	<description><![CDATA[Not for release, publication or distribution directly or indirectly, in whole or in part, in or into the United States, Australia, Canada, Japan or South Africa or in any other jurisdiction in which offers or sales would be prohibited by applicable law. This announcement is not an offer to sell or a solicitation to buy securities in any jurisdiction, including the United States, Australia, Canada, Japan or South Africa. Neither this announcement nor anything contained herein shall form the basis of, or be relied upon in connection with, any offer or commitment whatsoever in any jurisdiction. STMicroelectronics N.V. (the “Company” or “ST”) announces today the pricing of a US$1.5 billion offering of senior unsecured bonds convertible into new or existing ordinary shares of ST (the “Shares”) (the “New Convertible Bonds”). The New Convertible Bonds will be issued in two tranches, one of US$750 million with a maturity of 5 years (the “2031 Convertible Bonds”) and one of US$750 million with a maturity of 7 years (the “2033 Convertible Bonds”). The terms of the New Convertible Bonds contain customary provisions which will allow the Company to satisfy conversion rights on the New Convertible Bonds with a combination of cash and Shares, or cash or Shares only including, unless the Company elects otherwise, by way of net share settlement. The offering proceeds, net of costs, will be used by ST for general corporate purposes, including the early redemption of the outstanding US$750 million Zero Coupon Convertible Bonds due 2027 (ISIN: XS2211997239) announced earlier today. Offering of New Convertible Bonds The Company will issue the dual-tranche New Convertible Bonds as follows: The 2031 Convertible Bonds will not bear interest, will be issued at 100% of their principal amount and will be redeemed at 100% of their principal amount on June 23rd, 2031, unless previously redeemed, converted or purchased and cancelled; and The 2033 Convertible Bonds will bear interest at an annual rate of 0.625%, payable semi-annually in arrear. The 2033 Convertible Bonds will be issued at 100% of their principal amount and will be redeemed at 100% of their principal amount on June 23rd, 2033, unless previously redeemed, converted or purchased and cancelled. The initial conversion price for the New Convertible Bonds has been set: In relation to the 2031 Convertible Bonds, at US$ 119.9813, representing a premium of 55%; and In relation to the 2033 Convertible Bonds, at US$ 121.9165, representing a premium of 57.5%, in each case over the volume-weighted average price of a Share between opening of trading today and pricing of the offering on the Euronext Milan Market, organised and managed by Borsa Italiana S.p.A., converted into US dollars at the prevailing exchange rate at the time of pricing. Settlement of the New Convertible Bonds is expected to take place on or about June 23rd, 2026. Application will be made for the New Convertible Bonds to be admitted to trading on the Open Market (Freiverkehr) segment of the Frankfurt Stock Exchange within 90 days of settlement. In the context of the offering of the New Convertible Bonds, the Company has committed to a lock-up period from (and including) the pricing date to (and including) 90 days after closing in respect of the Shares and related securities. The issuance of the New Convertible Bonds has been approved by the managing board and the supervisory board of the Company. BNP PARIBAS and J.P. Morgan acted as Joint Global Coordinators and Joint Bookrunners and Citigroup, Goldman Sachs Bank Europe SE, Intesa Sanpaolo, Morgan Stanley Europe SE, Natixis, Société Générale and UniCredit acted as Joint Bookrunners in respect of the offering. About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com. * * * * * Issuer’s LEI: 213800Z8NOHIKRI42W10 * * * * * Inside information This press release relates to the disclosure of information that qualified, or may have qualified, as inside information within the meaning of Article 7(1) of the Market Abuse Regulation (EU) 596/2014 (“MAR”). * * * * * IMPORTANT NOTICE IN RELATION TO THE BONDS NO ACTION HAS BEEN TAKEN BY THE ISSUER, THE JOINT BOOKRUNNERS OR ANY OF THEIR RESPECTIVE AFFILIATES THAT WOULD PERMIT AN OFFERING OF THE BONDS OR POSSESSION OR DISTRIBUTION OF THIS PRESS RELEASE OR ANY OFFERING OR PUBLICITY MATERIAL RELATING TO THE BONDS IN ANY JURISDICTION WHERE ACTION FOR THAT PURPOSE IS REQUIRED. PERSONS INTO WHOSE POSSESSION THIS PRESS RELEASE COMES ARE REQUIRED BY THE ISSUER AND THE JOINT BOOKRUNNERS TO INFORM THEMSELVES ABOUT, AND TO OBSERVE, ANY SUCH RESTRICTIONS. THIS PRESS RELEASE IS NOT FOR DISTRIBUTION, DIRECTLY OR INDIRECTLY IN OR INTO THE UNITED STATES OR TO U.S. PERSONS (AS DEFINED IN REGULATION S UNDER THE U.S. SECURITIES ACT OF 1933, AS AMENDED) (THE “U.S. SECURITIES ACT”). THIS PRESS RELEASE IS NOT AN OFFER TO SELL SECURITIES OR THE SOLICITATION OF ANY OFFER TO BUY SECURITIES, NOR SHALL THERE BE ANY OFFER OF SECURITIES IN ANY JURISDICTION IN WHICH SUCH OFFER OR SALE WOULD BE UNLAWFUL. THE BONDS AND THE SHARES TO BE DELIVERED UPON CONVERSION OF THE BONDS AND NOTIONALLY UNDERLYING THE BONDS HAVE NOT BEEN AND WILL NOT BE REGISTERED UNDER THE U.S. SECURITIES ACT AND MAY NOT BE OFFERED, SOLD OR DELIVERED WITHIN THE UNITED STATES OR TO, OR FOR THE ACCOUNT OR BENEFIT OF, U.S. PERSONS (AS SUCH TERMS ARE DEFINED IN REGULATION S UNDER THE U.S. SECURITIES ACT) ABSENT REGISTRATION OR AN EXEMPTION FROM THE APPLICABLE REGISTRATION REQUIREMENTS UNDER THE U.S. SECURITIES ACT. THERE WILL BE NO PUBLIC OFFER OF THE BONDS IN THE UNITED STATES. THE OFFERING WHEN MADE, ANY OFFERING DOCUMENTATION RELATING TO THE OFFERING AND THIS PRESS RELEASE ARE ONLY ADDRESSED TO, AND DIRECTED IN THE UNITED KINGDOM (“UK”) AND MEMBER STATES OF THE EUROPEAN ECONOMIC AREA (THE “EEA”) AT PERSONS WHO ARE “QUALIFIED INVESTORS” WITHIN THE MEANING OF THE PROSPECTUS REGULATION IN RESPECT OF EACH MEMBER STATE OF THE EEA, AND THE POATRs IN RESPECT OF THE UNITED KINGDOM, RESPECTIVELY (“QUALIFIED INVESTORS”) AND HAVE BEEN PREPARED ON THE BASIS THAT (I) ANY OFFER OF NEW CONVERTIBLE BONDS IN ANY MEMBER STATE OF THE EEA WILL BE MADE PURSUANT TO AN EXEMPTION UNDER THE PROSPECTUS REGULATION FROM THE REQUIREMENT TO PUBLISH A PROSPECTUS FOR OFFERS OF BONDS AND (II) ANY OFFER OF NEW CONVERTIBLE BONDS IN THE UK WILL BE MADE PURSUANT TO AN EXEMPTION UNDER THE POATRs FROM THE REQUIREMENT TO PUBLISH A PROSPECTUS FOR OFFERS OF BONDS. THE EXPRESSION \"PROSPECTUS REGULATION\" MEANS REGULATION (EU) 2017/1129 (AS AMENDED OR SUPERSEDED) AND THE EXPRESSION “POATRs” MEANS THE PUBLIC OFFERS AND ADMISSIONS TO TRADING REGULATIONS 2024. SOLELY FOR THE PURPOSES OF THE PRODUCT GOVERNANCE REQUIREMENTS CONTAINED WITHIN: (A) EU DIRECTIVE 2014/65/EU ON MARKETS IN FINANCIAL INSTRUMENTS, AS AMENDED (“MIFID II”); (B) ARTICLES 9 AND 10 OF COMMISSION DELEGATED DIRECTIVE (EU) 2017/593 SUPPLEMENTING MIFID II; (C) LOCAL IMPLEMENTING MEASURES IN THE EEA; (D) REGULATION (EU) NO 600/2014 AS IT FORMS PART OF UNITED KINGDOM DOMESTIC LAW BY VIRTUE OF THE EUROPEAN UNION (WITHDRAWAL) ACT 2018 (“EUWA”) (“UK MIFIR”); AND (E) THE FCA HANDBOOK PRODUCT INTERVENTION AND PRODUCT GOVERNANCE SOURCEBOOK (TOGETHER, THE “PRODUCT GOVERNANCE REQUIREMENTS”), AND DISCLAIMING ALL AND ANY LIABILITY, WHETHER ARISING IN TORT, CONTRACT OR OTHERWISE, WHICH ANY “MANUFACTURER” (FOR THE PURPOSES OF THE RELEVANT PRODUCT GOVERNANCE REQUIREMENTS) MAY OTHERWISE HAVE WITH RESPECT THERETO, THE BONDS HAVE BEEN SUBJECT TO A PRODUCT APPROVAL PROCESS, WHICH HAS DETERMINED THAT: (I) THE TARGET MARKET FOR THE BONDS IS (A) IN THE EEA, ELIGIBLE COUNTERPARTIES AND PROFESSIONAL CLIENTS ONLY, EACH AS DEFINED IN MIFID II AND (B) IN THE UNITED KINGDOM, ELIGIBLE COUNTERPARTIES (AS DEFINED IN THE FCA HANDBOOK CONDUCT OF BUSINESS SOURCEBOOK) AND PROFESSIONAL CLIENTS (AS DEFINED IN UK MIFIR); AND/OR (II) ALL CHANNELS FOR DISTRIBUTION OF THE BONDS TO ELIGIBLE COUNTERPARTIES AND PROFESSIONAL CLIENTS ARE APPROPRIATE AS PERMITTED BY MIFID II (THE “TARGET MARKET ASSESSMENT”). ANY PERSON SUBSEQUENTLY OFFERING, SELLING OR RECOMMENDING THE BONDS (A \"DISTRIBUTOR\") SHOULD TAKE INTO CONSIDERATION THE MANUFACTURERS’ TARGET MARKET ASSESSMENT; HOWEVER, A DISTRIBUTOR SUBJECT TO THE RELEVANT PRODUCT GOVERNANCE REQUIREMENTS IS RESPONSIBLE FOR UNDERTAKING ITS OWN TARGET MARKET ASSESSMENT IN RESPECT OF THE BONDS (BY EITHER ADOPTING OR REFINING THE MANUFACTURERS’ TARGET MARKET ASSESSMENT) AND DETERMINING APPROPRIATE DISTRIBUTION CHANNELS. THE TARGET MARKET ASSESSMENT IS WITHOUT PREJUDICE TO THE REQUIREMENTS OF ANY CONTRACTUAL OR LEGAL SELLING RESTRICTIONS IN RELATION TO ANY OFFERING OF THE BONDS. FOR THE AVOIDANCE OF DOUBT, THE TARGET MARKET ASSESSMENT DOES NOT CONSTITUTE: (A) AN ASSESSMENT OF SUITABILITY OR APPROPRIATENESS FOR THE PURPOSES OF MIFID II OR UK MIFIR; OR (B) A RECOMMENDATION TO ANY INVESTOR OR GROUP OF INVESTORS TO INVEST IN, OR PURCHASE, OR TAKE ANY OTHER ACTION WHATSOEVER WITH RESPECT TO THE BONDS. THE BONDS ARE NOT INTENDED TO BE OFFERED, SOLD OR OTHERWISE MADE AVAILABLE TO AND SHOULD NOT BE OFFERED, SOLD OR OTHERWISE MADE AVAILABLE TO ANY RETAIL INVESTOR IN THE EEA OR THE UNITED KINGDOM. FOR THESE PURPOSES, A RETAIL INVESTOR (A) IN THE EEA, MEANS A PERSON WHO IS ONE (OR MORE) OF: (I) A RETAIL CLIENT AS DEFINED IN POINT (11) OF ARTICLE 4(1) OF MIFID II; OR (II) A CUSTOMER WITHIN THE MEANING OF DIRECTIVE (EU) 2016/97 (AS AMENDED), WHERE THAT CUSTOMER WOULD NOT QUALIFY AS A PROFESSIONAL CLIENT AS DEFINED IN POINT (10) OF ARTICLE 4(1) OF MIFID II AND (B) IN THE UK, MEANS A PERSON WHO IS NOT A PROFESSIONAL CLIENT, AS DEFINED IN POINT (8) OF ARTICLE 2(1) OF REGULATION (EU) NO 600/2014 AS IT FORMS PART OF DOMESTIC LAW BY VIRTUE OF THE EUWA. CONSEQUENTLY, (I) NO KEY INFORMATION DOCUMENT REQUIRED BY REGULATION (EU) NO 1286/2014, AS AMENDED (THE “PRIIPS REGULATION”) FOR OFFERING OR SELLING THE BONDS OR OTHERWISE MAKING THEM AVAILABLE TO RETAIL INVESTORS IN THE EEA HAS BEEN PREPARED AND THEREFORE OFFERING OR SELLING THE BONDS OR OTHERWISE MAKING THEM AVAILABLE TO ANY RETAIL INVESTOR IN THE EEA MAY BE UNLAWFUL UNDER THE PRIIPS REGULATION AND (II) NO DISCLOSURE DOCUMENT REQUIRED BY THE FCA PRODUCT DISCLOSURE SOURCEBOOK (“DISC”) FOR OFFERING, SELLING OR DISTRIBUTING THE BONDS OR OTHERWISE MAKING THEM AVAILABLE TO RETAIL INVESTORS IN THE UNITED KINGDOM HAS BEEN PREPARED AND THEREFORE OFFERING, SELLING OR DISTRIBUTING THE BONDS OR OTHERWISE MAKING THEM AVAILABLE TO ANY RETAIL INVESTOR IN THE UNITED KINGDOM MAY BE UNLAWFUL UNDER DISC AND THE CONSUMER COMPOSITE INVESTMENTS (DESIGNATED ACTIVITIES) REGULATIONS 2024. IN ADDITION, THIS PRESS RELEASE IS FOR DISTRIBUTION ONLY TO PERSONS WHO (I) HAVE PROFESSIONAL EXPERIENCE IN MATTERS RELATING TO INVESTMENTS FALLING WITHIN ARTICLE 19(5) OF THE FINANCIAL SERVICES AND MARKETS ACT 2000 (FINANCIAL PROMOTION) ORDER 2005 (AS AMENDED THE “FINANCIAL PROMOTION ORDER”), (II) ARE PERSONS FALLING WITHIN ARTICLE 49(2)(A) TO (D) (“HIGH NET WORTH COMPANIES, UNINCORPORATED ASSOCIATIONS ETC.\") OF THE FINANCIAL PROMOTION ORDER, (III) ARE OUTSIDE THE UNITED KINGDOM, OR (IV) ARE PERSONS TO WHOM AN INVITATION OR INDUCEMENT TO ENGAGE IN INVESTMENT ACTIVITY (WITHIN THE MEANING OF SECTION 21 OF THE FINANCIAL SERVICES AND MARKETS ACT 2000) IN CONNECTION WITH THE ISSUE OR SALE OF ANY SECURITIES MAY OTHERWISE LAWFULLY BE COMMUNICATED OR CAUSED TO BE COMMUNICATED (ALL SUCH PERSONS TOGETHER BEING REFERRED TO AS “RELEVANT PERSONS”). THIS PRESS RELEASE IS DIRECTED ONLY AT RELEVANT PERSONS AND MUST NOT BE ACTED ON OR RELIED ON BY PERSONS WHO ARE NOT RELEVANT PERSONS. ANY INVESTMENT OR INVESTMENT ACTIVITY TO WHICH THIS PRESS RELEASE RELATES IS AVAILABLE ONLY TO RELEVANT PERSONS AND WILL BE ENGAGED IN ONLY WITH RELEVANT PERSONS. ANY DECISION TO PURCHASE ANY OF THE BONDS SHOULD ONLY BE MADE ON THE BASIS OF AN INDEPENDENT REVIEW BY A PROSPECTIVE INVESTOR OF THE ISSUER’S PUBLICLY AVAILABLE INFORMATION. NEITHER THE JOINT BOOKRUNNERS NOR ANY OF THEIR RESPECTIVE AFFILIATES ACCEPT ANY LIABILITY ARISING FROM THE USE OF, OR MAKE ANY REPRESENTATION AS TO THE ACCURACY OR COMPLETENESS OF, THIS PRESS RELEASE OR THE ISSUER’S PUBLICLY AVAILABLE INFORMATION. THE INFORMATION CONTAINED IN THIS PRESS RELEASE IS SUBJECT TO CHANGE IN ITS ENTIRETY WITHOUT NOTICE UP TO THE SETTLEMENT DATE. EACH PROSPECTIVE INVESTOR SHOULD PROCEED ON THE ASSUMPTION THAT IT MUST BEAR THE ECONOMIC RISK OF AN INVESTMENT IN THE BONDS OR THE SHARES TO BE ISSUED OR TRANSFERRED AND DELIVERED UPON CONVERSION OF THE BONDS AND NOTIONALLY UNDERLYING THE BONDS (TOGETHER WITH THE BONDS, THE “SECURITIES”). NONE OF THE ISSUER OR THE JOINT BOOKRUNNERS MAKE ANY REPRESENTATION AS TO (I) THE SUITABILITY OF THE SECURITIES FOR ANY PARTICULAR INVESTOR, (II) THE APPROPRIATE ACCOUNTING TREATMENT AND POTENTIAL TAX CONSEQUENCES OF INVESTING IN THE SECURITIES OR (III) THE FUTURE PERFORMANCE OF THE SECURITIES EITHER IN ABSOLUTE TERMS OR RELATIVE TO COMPETING INVESTMENTS. THE JOINT BOOKRUNNERS ARE ACTING ON BEHALF OF THE ISSUER AND NO ONE ELSE IN CONNECTION WITH THE BONDS AND WILL NOT BE RESPONSIBLE TO ANY OTHER PERSON FOR PROVIDING THE PROTECTIONS AFFORDED TO CLIENTS OF THE JOINT BOOKRUNNERS OR FOR PROVIDING ADVICE IN RELATION TO THE SECURITIES. EACH OF THE ISSUER, THE JOINT BOOKRUNNERS AND THEIR RESPECTIVE AFFILIATES EXPRESSLY DISCLAIMS ANY OBLIGATION OR UNDERTAKING TO UPDATE, REVIEW OR REVISE ANY STATEMENT CONTAINED IN THIS PRESS RELEASE WHETHER AS A RESULT OF NEW INFORMATION, FUTURE DEVELOPMENTS OR OTHERWISE.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/3398.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Tue, 16 Jun 2026 17:22:50 +0200</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics announces (i) a US$1.5 billion dual-tranche offering of New Convertible Bonds and (ii) the early redemption of its 2027 Convertible Bonds]]></title>
	<description><![CDATA[Not for release, publication or distribution directly or indirectly, in whole or in part, in or into the United States, Australia, Canada, Japan or South Africa or in any other jurisdiction in which offers or sales would be prohibited by applicable law. This announcement is not an offer to sell or a solicitation to buy securities in any jurisdiction, including the United States, Australia, Canada, Japan or South Africa. Neither this announcement nor anything contained herein shall form the basis of, or be relied upon in connection with, any offer or commitment whatsoever in any jurisdiction. STMicroelectronics N.V. (the “Company” or “ST”) announces today the launch of a US$1.5 billion offering of senior unsecured bonds convertible into new or existing ordinary shares of ST (the “Shares”) (the “New Convertible Bonds”) and the early redemption of the outstanding US$750 million Zero Coupon Convertible Bonds due 2027 (ISIN: XS2211997239, the “2027 Convertible Bonds”). The New Convertible Bonds will be offered in two tranches (with a minimum size of US$500 million per tranche) with a maturity of 5 years (the “2031 Convertible Bonds”) and 7 years (the “2033 Convertible Bonds”), respectively. The terms of the New Convertible Bonds are expected to contain customary provisions which will allow the Company to satisfy conversion rights on the New Convertible Bonds with a combination of cash and Shares, or cash or Shares only including, unless the Company elects otherwise, by way of net share settlement. The offering proceeds, net of costs, will be used by ST for general corporate purposes, including the early redemption of the 2027 Convertible Bonds. Offering of New Convertible Bonds The Company proposes to issue the dual-tranche New Convertible Bonds as follows: The 2031 Convertible Bonds will bear interest at an annual rate between 0.00% and 0.50%, payable semi-annually in arrear. The 2031 Convertible Bonds will be issued at 100% of their principal amount and will be redeemed at 100% of their principal amount on June 23rd, 2031, unless previously redeemed, converted or purchased and cancelled; and The 2033 Convertible Bonds will bear interest at an annual rate between 0.625% and 1.125%, payable semi-annually in arrear. The 2033 Convertible Bonds will be issued at 100% of their principal amount and will be redeemed at 100% of their principal amount on June 23rd, 2033, unless previously redeemed, converted or purchased and cancelled. The initial conversion price for the New Convertible Bonds is expected to be set: In relation to the 2031 Convertible Bonds, at a premium between 47.5% – 52.5%; and In relation to the 2033 Convertible Bonds, at a premium between 50% – 55%, in each case over the volume-weighted average price of a Share between opening of trading today and pricing of the offering on the Euronext Milan Market, organised and managed by Borsa Italiana S.p.A., converted into US dollars at the prevailing exchange rate at the time of pricing. The final terms of the New Convertible Bonds are expected to be determined and announced later today and settlement is expected to take place on or about June 23rd, 2026. Application will be made for the New Convertible Bonds to be admitted to trading on the Open Market (Freiverkehr) segment of the Frankfurt Stock Exchange within 90 days of settlement. In the context of the offering of the New Convertible Bonds, the Company will commit to a lock-up period from (and including) the pricing date to (and including) 90 days after closing in respect of the Shares and related securities. The issuance of the New Convertible Bonds has been approved by the managing board and the supervisory board of the Company. BNP PARIBAS and J.P. Morgan are acting as Joint Global Coordinators and Joint Bookrunners and Citigroup, Goldman Sachs Bank Europe SE, Intesa Sanpaolo, Morgan Stanley Europe SE, Natixis, Société Générale and UniCredit are acting as Joint Bookrunners in respect of the offering. Early redemption of the 2027 Convertible Bonds The Company will today give notice to the holders of the 2027 Convertible Bonds to redeem all of the 2027 Convertible Bonds on July 16th, 2026, at their principal amount in accordance with Condition 7(b)(i) of the Terms and Conditions of the 2027 Convertible Bonds. Holders of the 2027 Convertible Bonds are entitled to exercise their right to convert their 2027 Convertible Bonds into Shares, cash or a combination of Shares and cash by reference to the prevailing conversion price, currently US$45.10 per Share, subject to the relevant Conversion Date occurring on or before July 1st, 2026 in accordance with Condition 6(a)(i) of the Terms and Conditions of the 2027 Convertible Bonds. If holders of such 2027 Convertible Bonds exercise their conversion right, the Company may decide to settle such exercise through the payment of cash and delivery of Shares pursuant to the Net Share Settlement provisions of Condition 6(a)(iii) of the Terms and Conditions of the 2027 Convertible Bonds. * * * * * Issuer’s LEI: 213800Z8NOHIKRI42W10 * * * * * Inside information This press release relates to the disclosure of information that qualified, or may have qualified, as inside information within the meaning of Article 7(1) of the Market Abuse Regulation (EU) 596/2014 (“MAR”). * * * * * IMPORTANT NOTICE IN RELATION TO THE BONDS NO ACTION HAS BEEN TAKEN BY THE ISSUER, THE JOINT BOOKRUNNERS OR ANY OF THEIR RESPECTIVE AFFILIATES THAT WOULD PERMIT AN OFFERING OF THE BONDS OR POSSESSION OR DISTRIBUTION OF THIS PRESS RELEASE OR ANY OFFERING OR PUBLICITY MATERIAL RELATING TO THE BONDS IN ANY JURISDICTION WHERE ACTION FOR THAT PURPOSE IS REQUIRED. PERSONS INTO WHOSE POSSESSION THIS PRESS RELEASE COMES ARE REQUIRED BY THE ISSUER AND THE JOINT BOOKRUNNERS TO INFORM THEMSELVES ABOUT, AND TO OBSERVE, ANY SUCH RESTRICTIONS. THIS PRESS RELEASE IS NOT FOR DISTRIBUTION, DIRECTLY OR INDIRECTLY IN OR INTO THE UNITED STATES OR TO U.S. PERSONS (AS DEFINED IN REGULATION S UNDER THE U.S. SECURITIES ACT OF 1933., AS AMENDED) (THE “U.S. SECURITIES ACT”).). THIS PRESS RELEASE IS NOT AN OFFER TO SELL SECURITIES OR THE SOLICITATION OF ANY OFFER TO BUY SECURITIES, NOR SHALL THERE BE ANY OFFER OF SECURITIES IN ANY JURISDICTION IN WHICH SUCH OFFER OR SALE WOULD BE UNLAWFUL. THE BONDS AND THE SHARES TO BE DELIVERED UPON CONVERSION OF THE BONDS AND NOTIONALLY UNDERLYING THE BONDS HAVE NOT BEEN AND WILL NOT BE REGISTERED UNDER THE U.S. SECURITIES ACT AND MAY NOT BE OFFERED, SOLD OR DELIVERED WITHIN THE UNITED STATES OR TO, OR FOR THE ACCOUNT OR BENEFIT OF, U.S. PERSONS (AS SUCH TERMS ARE DEFINED IN REGULATION S UNDER THE U.S. SECURITIES ACT) ABSENT REGISTRATION OR AN EXEMPTION FROM THE APPLICABLE REGISTRATION REQUIREMENTS UNDER THE U.S. SECURITIES ACT. THERE WILL BE NO PUBLIC OFFER OF THE BONDS IN THE UNITED STATES. THE OFFERING WHEN MADE, ANY OFFERING DOCUMENTATION RELATING TO THE OFFERING AND THIS PRESS RELEASE ARE ONLY ADDRESSED TO, AND DIRECTED IN THE UNITED KINGDOM (“UK”) AND MEMBER STATES OF THE EUROPEAN ECONOMIC AREA (THE “EEA”) AT PERSONS WHO ARE “QUALIFIED INVESTORS” WITHIN THE MEANING OF THE PROSPECTUS REGULATION IN RESPECT OF EACH MEMBER STATE OF THE EEA, AND THE POATRs IN RESPECT OF THE UNITED KINGDOM, RESPECTIVELY (“QUALIFIED INVESTORS”) AND HAVE BEEN PREPARED ON THE BASIS THAT (I) ANY OFFER OF NEW CONVERTIBLE BONDS IN ANY MEMBER STATE OF THE EEA WILL BE MADE PURSUANT TO AN EXEMPTION UNDER THE PROSPECTUS REGULATION FROM THE REQUIREMENT TO PUBLISH A PROSPECTUS FOR OFFERS OF BONDS AND (II) ANY OFFER OF NEW CONVERTIBLE BONDS IN THE UK WILL BE MADE PURSUANT TO AN EXEMPTION UNDER THE POATRs FROM THE REQUIREMENT TO PUBLISH A PROSPECTUS FOR OFFERS OF BONDS. THE EXPRESSION \"PROSPECTUS REGULATION\" MEANS REGULATION (EU) 2017/1129 (AS AMENDED OR SUPERSEDED) AND THE EXPRESSION “POATRs” MEANS THE PUBLIC OFFERS AND ADMISSIONS TO TRADING REGULATIONS 2024. SOLELY FOR THE PURPOSES OF THE PRODUCT GOVERNANCE REQUIREMENTS CONTAINED WITHIN: (A) EU DIRECTIVE 2014/65/EU ON MARKETS IN FINANCIAL INSTRUMENTS, AS AMENDED (“MIFID II”); (B) ARTICLES 9 AND 10 OF COMMISSION DELEGATED DIRECTIVE (EU) 2017/593 SUPPLEMENTING MIFID II; (C) LOCAL IMPLEMENTING MEASURES IN THE EEA; (D) REGULATION (EU) NO 600/2014 AS IT FORMS PART OF UNITED KINGDOM DOMESTIC LAW BY VIRTUE OF THE EUROPEAN UNION (WITHDRAWAL) ACT 2018 (“EUWA”) (“UK MIFIR”); AND (E) THE FCA HANDBOOK PRODUCT INTERVENTION AND PRODUCT GOVERNANCE SOURCEBOOK (TOGETHER, THE “PRODUCT GOVERNANCE REQUIREMENTS”), AND DISCLAIMING ALL AND ANY LIABILITY, WHETHER ARISING IN TORT, CONTRACT OR OTHERWISE, WHICH ANY “MANUFACTURER” (FOR THE PURPOSES OF THE RELEVANT PRODUCT GOVERNANCE REQUIREMENTS) MAY OTHERWISE HAVE WITH RESPECT THERETO, THE BONDS HAVE BEEN SUBJECT TO A PRODUCT APPROVAL PROCESS, WHICH HAS DETERMINED THAT: (I) THE TARGET MARKET FOR THE BONDS IS (A) IN THE EEA, ELIGIBLE COUNTERPARTIES AND PROFESSIONAL CLIENTS ONLY, EACH AS DEFINED IN MIFID II AND (B) IN THE UNITED KINGDOM, ELIGIBLE COUNTERPARTIES (AS DEFINED IN THE FCA HANDBOOK CONDUCT OF BUSINESS SOURCEBOOK) AND PROFESSIONAL CLIENTS (AS DEFINED IN UK MIFIR); AND/OR (II) ALL CHANNELS FOR DISTRIBUTION OF THE BONDS TO ELIGIBLE COUNTERPARTIES AND PROFESSIONAL CLIENTS ARE APPROPRIATE AS PERMITTED BY MIFID II (THE “TARGET MARKET ASSESSMENT”). ANY PERSON SUBSEQUENTLY OFFERING, SELLING OR RECOMMENDING THE BONDS (A \"DISTRIBUTOR\") SHOULD TAKE INTO CONSIDERATION THE MANUFACTURERS’ TARGET MARKET ASSESSMENT; HOWEVER, A DISTRIBUTOR SUBJECT TO THE RELEVANT PRODUCT GOVERNANCE REQUIREMENTS IS RESPONSIBLE FOR UNDERTAKING ITS OWN TARGET MARKET ASSESSMENT IN RESPECT OF THE BONDS (BY EITHER ADOPTING OR REFINING THE MANUFACTURERS’ TARGET MARKET ASSESSMENT) AND DETERMINING APPROPRIATE DISTRIBUTION CHANNELS. THE TARGET MARKET ASSESSMENT IS WITHOUT PREJUDICE TO THE REQUIREMENTS OF ANY CONTRACTUAL OR LEGAL SELLING RESTRICTIONS IN RELATION TO ANY OFFERING OF THE BONDS. FOR THE AVOIDANCE OF DOUBT, THE TARGET MARKET ASSESSMENT DOES NOT CONSTITUTE: (A) AN ASSESSMENT OF SUITABILITY OR APPROPRIATENESS FOR THE PURPOSES OF MIFID II OR UK MIFIR; OR (B) A RECOMMENDATION TO ANY INVESTOR OR GROUP OF INVESTORS TO INVEST IN, OR PURCHASE, OR TAKE ANY OTHER ACTION WHATSOEVER WITH RESPECT TO THE BONDS. THE BONDS ARE NOT INTENDED TO BE OFFERED, SOLD OR OTHERWISE MADE AVAILABLE TO AND SHOULD NOT BE OFFERED, SOLD OR OTHERWISE MADE AVAILABLE TO ANY RETAIL INVESTOR IN THE EEA OR THE UNITED KINGDOM. FOR THESE PURPOSES, A RETAIL INVESTOR (A) IN THE EEA, MEANS A PERSON WHO IS ONE (OR MORE) OF: (I) A RETAIL CLIENT AS DEFINED IN POINT (11) OF ARTICLE 4(1) OF MIFID II; OR (II) A CUSTOMER WITHIN THE MEANING OF DIRECTIVE (EU) 2016/97 (AS AMENDED), WHERE THAT CUSTOMER WOULD NOT QUALIFY AS A PROFESSIONAL CLIENT AS DEFINED IN POINT (10) OF ARTICLE 4(1) OF MIFID II AND (B) IN THE UK, MEANS A PERSON WHO IS NOT A PROFESSIONAL CLIENT, AS DEFINED IN POINT (8) OF ARTICLE 2(1) OF REGULATION (EU) NO 600/2014 AS IT FORMS PART OF DOMESTIC LAW BY VIRTUE OF THE EUWA. CONSEQUENTLY, (I) NO KEY INFORMATION DOCUMENT REQUIRED BY REGULATION (EU) NO 1286/2014, AS AMENDED (THE “PRIIPS REGULATION”) FOR OFFERING OR SELLING THE BONDS OR OTHERWISE MAKING THEM AVAILABLE TO RETAIL INVESTORS IN THE EEA HAS BEEN PREPARED AND THEREFORE OFFERING OR SELLING THE BONDS OR OTHERWISE MAKING THEM AVAILABLE TO ANY RETAIL INVESTOR IN THE EEA MAY BE UNLAWFUL UNDER THE PRIIPS REGULATION AND (II) NO DISCLOSURE DOCUMENT REQUIRED BY THE FCA PRODUCT DISCLOSURE SOURCEBOOK (“DISC”) FOR OFFERING, SELLING OR DISTRIBUTING THE BONDS OR OTHERWISE MAKING THEM AVAILABLE TO RETAIL INVESTORS IN THE UNITED KINGDOM HAS BEEN PREPARED AND THEREFORE OFFERING, SELLING OR DISTRIBUTING THE BONDS OR OTHERWISE MAKING THEM AVAILABLE TO ANY RETAIL INVESTOR IN THE UNITED KINGDOM MAY BE UNLAWFUL UNDER DISC AND THE CONSUMER COMPOSITE INVESTMENTS (DESIGNATED ACTIVITIES) REGULATIONS 2024. IN ADDITION, THIS PRESS RELEASE IS FOR DISTRIBUTION ONLY TO PERSONS WHO (I) HAVE PROFESSIONAL EXPERIENCE IN MATTERS RELATING TO INVESTMENTS FALLING WITHIN ARTICLE 19(5) OF THE FINANCIAL SERVICES AND MARKETS ACT 2000 (FINANCIAL PROMOTION) ORDER 2005 (AS AMENDED THE “FINANCIAL PROMOTION ORDER”), (II) ARE PERSONS FALLING WITHIN ARTICLE 49(2)(A) TO (D) (“HIGH NET WORTH COMPANIES, UNINCORPORATED ASSOCIATIONS ETC.\") OF THE FINANCIAL PROMOTION ORDER, (III) ARE OUTSIDE THE UNITED KINGDOM, OR (IV) ARE PERSONS TO WHOM AN INVITATION OR INDUCEMENT TO ENGAGE IN INVESTMENT ACTIVITY (WITHIN THE MEANING OF SECTION 21 OF THE FINANCIAL SERVICES AND MARKETS ACT 2000) IN CONNECTION WITH THE ISSUE OR SALE OF ANY SECURITIES MAY OTHERWISE LAWFULLY BE COMMUNICATED OR CAUSED TO BE COMMUNICATED (ALL SUCH PERSONS TOGETHER BEING REFERRED TO AS “RELEVANT PERSONS”). THIS PRESS RELEASE IS DIRECTED ONLY AT RELEVANT PERSONS AND MUST NOT BE ACTED ON OR RELIED ON BY PERSONS WHO ARE NOT RELEVANT PERSONS. ANY INVESTMENT OR INVESTMENT ACTIVITY TO WHICH THIS PRESS RELEASE RELATES IS AVAILABLE ONLY TO RELEVANT PERSONS AND WILL BE ENGAGED IN ONLY WITH RELEVANT PERSONS. ANY DECISION TO PURCHASE ANY OF THE BONDS SHOULD ONLY BE MADE ON THE BASIS OF AN INDEPENDENT REVIEW BY A PROSPECTIVE INVESTOR OF THE ISSUER’S PUBLICLY AVAILABLE INFORMATION. NEITHER THE JOINT BOOKRUNNERS NOR ANY OF THEIR RESPECTIVE AFFILIATES ACCEPT ANY LIABILITY ARISING FROM THE USE OF, OR MAKE ANY REPRESENTATION AS TO THE ACCURACY OR COMPLETENESS OF, THIS PRESS RELEASE OR THE ISSUER’S PUBLICLY AVAILABLE INFORMATION. THE INFORMATION CONTAINED IN THIS PRESS RELEASE IS SUBJECT TO CHANGE IN ITS ENTIRETY WITHOUT NOTICE UP TO THE SETTLEMENT DATE. EACH PROSPECTIVE INVESTOR SHOULD PROCEED ON THE ASSUMPTION THAT IT MUST BEAR THE ECONOMIC RISK OF AN INVESTMENT IN THE BONDS OR THE SHARES TO BE ISSUED OR TRANSFERRED AND DELIVERED UPON CONVERSION OF THE BONDS AND NOTIONALLY UNDERLYING THE BONDS (TOGETHER WITH THE BONDS, THE “SECURITIES”). NONE OF THE ISSUER OR THE JOINT BOOKRUNNERS MAKE ANY REPRESENTATION AS TO (I) THE SUITABILITY OF THE SECURITIES FOR ANY PARTICULAR INVESTOR, (II) THE APPROPRIATE ACCOUNTING TREATMENT AND POTENTIAL TAX CONSEQUENCES OF INVESTING IN THE SECURITIES OR (III) THE FUTURE PERFORMANCE OF THE SECURITIES EITHER IN ABSOLUTE TERMS OR RELATIVE TO COMPETING INVESTMENTS. THE JOINT BOOKRUNNERS ARE ACTING ON BEHALF OF THE ISSUER AND NO ONE ELSE IN CONNECTION WITH THE BONDS AND WILL NOT BE RESPONSIBLE TO ANY OTHER PERSON FOR PROVIDING THE PROTECTIONS AFFORDED TO CLIENTS OF THE JOINT BOOKRUNNERS OR FOR PROVIDING ADVICE IN RELATION TO THE SECURITIES. EACH OF THE ISSUER, THE JOINT BOOKRUNNERS AND THEIR RESPECTIVE AFFILIATES EXPRESSLY DISCLAIMS ANY OBLIGATION OR UNDERTAKING TO UPDATE, REVIEW OR REVISE ANY STATEMENT CONTAINED IN THIS PRESS RELEASE WHETHER AS A RESULT OF NEW INFORMATION, FUTURE DEVELOPMENTS OR OTHERWISE. About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3397.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Tue, 16 Jun 2026 06:19:19 +0200</pubDate>

</item>
<item>
	<title><![CDATA[STマイクロエレクトロニクス、ST87M01 NB-IoTモジュールプラットフォームの認証を北米・ブラジルへ拡大]]></title>
	<description><![CDATA[STマイクロエレクトロニクス（NYSE：STM、以下ST）は、北米およびブラジルにおいて、NB（Narrow Band）-IoTモジュール･シリーズ「ST87M01」の認証を取得したことを発表しました。これにより、両地域のIoTプロジェクトにおいて、同モジュールの5G時代に対応可能なコネクティビティや各種オプション機能、ならびにサプライ･チェーン上の利点を活用できるようになります。 米国およびカナダ市場向けにFCC、PTCRBおよびISEDの認証を取得したモジュールは、NB-IoT Release 15のセルラー接続仕様に加え、屋外 / 屋内での位置特定やアセット･トラッキング向けのGNSSおよびWi-Fi測位のオプションも備えています。STは、世界中の企業から信頼されるグローバルIoTネットワーク事業者であるOnomondo社と協力し、すぐに利用可能なコネクティビティ層を備えたこれらの認証済みモジュールの市場展開を進めています。これにより、顧客は北米全域において、運用管理を含む包括的な導入支援を利用し、迅速にサービスを展開することができます。 STの特定用途向け製品事業部ジェネラル･マネージャであるDomenico Arrigoは、次のようにコメントしています。「FCCやPTCRBおよびISEDの認証取得により、ST87M01は米国およびカナダ全域でのIoT導入を支える準備が完全に整いました。Onomondo社との協力は、これにさらなる価値を加えるものです。顧客は、実績あるグローバル･コネクティビティ･プラットフォームを活用して、北米全域でアプリケーションを迅速かつ確実に導入から管理、そして拡張までできるようになります。」 Onomondo社のグローバル･パートナーシップ担当ディレクターであるWanig Le Pennec氏は、次のようにコメントしています。「STとの協業により、エネルギー効率に優れた小型モジュールとグローバルなコネクティビティ機能を統合し、1つの認証済みソリューションとしての提供が可能になりました。その結果、北米全域のチームは各市場により迅速に参入でき、すべてのデバイスを完全に可視化して、フリートの拡大に応じて性能の最適化やコスト管理を行うための制御性を得ることができます。」 ST87M01モジュール･プラットフォームは、ブラジルのAnatel認証も取得し、世界規模での展開をさらに拡大します。NB-IoT接続とオプションのGNSS / Wi-Fi測位により、ST87M01は、スマート･メータやスマート街路照明、家畜の監視、農業用センサ、アセット･トラッキングなど、ブラジルで急成長しているIoT分野の可能性を最大限に引き出すことができます。顧客は今後、ブラジルで進化を続けるコネクテッド･インフラの要件に完全に対応した、小型でエネルギー効率が高く、拡張性にも優れたソリューションを市場に提供できるようになります。 STのDomenico Arrigoは、さらに次のようにコメントしています。「ブラジルは、政府による積極的な取り組みと活発な企業エコシステムを背景に、ラテンアメリカで最も急速に拡大しているIoT市場の1つになりました。Anatel認証を取得したことで、ST87M01は位置情報機能と卓越したエネルギー効率、大規模な展開を容易にするシンプルな運用性を提供し、こうしたビジネス機会の活用を目指す顧客を支援します。」 各市場で提供されるモジュール 米国およびカナダ向け品名：ST87M01-2001（NB-IoT接続対応）、ST87M01-2301（NB-IoT接続およびGNSS / Wi-Fi測位対応） ブラジル向けのAnatel (1) 認証取得済みモジュール：ST87M01-1000（NB-IoT接続対応）、ST87M01-1100およびST87M01-1101（NB-IoT接続およびGNSS / Wi-Fi測位対応） すべての機能を1つの製品に高密度に集積化することで、基板設計上の課題とコストを削減できます。 詳細情報 ST87M01モジュールはすでに、ヨーロッパや中東、アフリカ（EMEA）全域で、電気･ガス･水道メータ、スマート･シティ、および産業用IoTソリューション（スマート･メータ、アセット･トラッキング、遠隔監視、スマート･ビル、スマート･ファクトリなど）に広く導入され、欧州無線機器指令（第3条3項のサイバー･セキュリティ要件を含む）に準拠しています。また、複数のGSMバンドへの対応に加え、NB-IoT、RSP、UICC、ETSI USIM向けの3GPP試験仕様を含む、Global Certification Forum（GCF）の認証も取得しています。 すべてのST87M01モジュールは、設計、製造、サポートのすべてをSTが一貫して手がけており、生産、出荷、セキュリティに関して信頼性･安全性を確保します。 ST87M01モジュールを使用してIoTデバイスを構築することで、開発者は、開発ツール、ハードウェア･キット、リファレンス設計、ソフトウェア･ライブラリ、アプリケーション事例、アンテナ設計支援を含むSTの広範な開発エコシステムを活用することができます。開発者向けに提供されるリソースには、ST87M01ファームウェアやSTの「Easy Connect」ソフトウェア･ライブラリ、Windows PC向けグラフィカル･ツール（モジュール設定の構成やファームウェア画像のダウンロード）などがあります。 これらのツールには、コマンド送信用のコンソールに加え、ネットワーク接続や無線接続の監視、測位サービスの管理、およびデバッグを行うためのパネルが用意されています。開発者はこれらのツールを活用して、ST87M01をホスト･システムのマイクロコントローラに集積できるほか、シンプルなアプリケーションや用途の場合には、ST87M01にファームウェアを直接組み込むこともできます。地域別の新しいモジュール向けに、専用の評価キットも用意されています。 同モジュールの消費電流はスタンバイ時に0.5µA未満、省電力モード（PSM）での動作時は1.2µA未満に抑えており、市場で求められる低消費電力化と現場での長期バッテリ駆動を実現します。 ST87M01モジュールは現在量産中で、厚さわずか2.4mmの小型パッケージ（10.6 x 12.8mm）で提供されます。価格およびサンプル提供については、STのセール ス･オフィスまでお問い合わせください。 詳細については、ウェブサイトをご覧ください。 (1) ブラジルの国家規制当局 STマイクロエレクトロニクスについて STは、約49,000名の従業員を擁し、包括的なサプライ・チェーンと最先端の製造設備を有する世界的な総合半導体メーカーです。約20万社を超えるお客様や数千社のパートナー企業と協力しながら、お客様のビジネス創出や持続可能な社会をサポートする半導体ソリューションの開発ならびにエコシステムの構築に取り組んでいます。STのテクノロジーは、スマート・モビリティ、電力エネルギー管理の効率化、クラウド接続型自律デバイスの普及を可能にします。STは、すべての直接・間接排出（スコープ1および2）、ならびに製品輸送、従業員の出張･通勤による排出（スコープ3の注力分野）におけるカーボンニュートラル達成に向けた取り組みを進めており、2027年末までに再生可能エネルギーの使用率を100％にする計画です。さらに詳しい情報はSTのウェブサイト（http://www.st.com）をご覧ください。]]></description>
	<link>https://newsroom.st.com/ja/media-center/press-item.html/n4781.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/06/N4781D-Jun-10-2026-ST87M01-NB-IoT-for-AME-markets_PR-IMAGE-LO-RES.jpeg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[newsbite]]></postType>
	<pubDate>Wed, 10 Jun 2026 14:00:29 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics and the LEO opportunity]]></title>
	<description><![CDATA[By Remi El-Ouazzane, President, Microcontrollers, Digital ICs and RF products Group. A new space economy is taking shape The space industry can be seen as evolving along two broad paths. Traditional space includes geostationary and medium Earth orbit systems used for established applications such as broadcasting, meteorology, and GNSS. These programs are mission-critical, but they are characterized by large satellites, long development cycles, and highly predictable service models. Low Earth orbit (LEO) is different. It is built around smaller satellites, much faster deployment, lower latency, and business models designed for mass adoption. This shift is not just about orbit altitude; it is about economics. LEO opens the door to broader connectivity, higher deployment volumes, and stronger semiconductor content per system. That change has been enabled by three major technology inflections. First, launch costs have fallen dramatically thanks to reusable rockets. Second, satellites have become lighter, more standardized, and more digital, with software-defined payloads and inter-satellite optical links increasingly common. Third, user terminals have evolved from traditional parabolic antennas into electronically steered phased arrays capable of tracking fast-moving satellites with precision and reliability. Together, these shifts have created an ecosystem where silicon content matters more than ever. ST’s position: from early participation to market leadership ST has been active in space for more than 45 years, with a long track record across both traditional and new space programs. In LEO, the company was involved from the beginning and has since become the leading semiconductor player in the market. That leadership is already visible in the numbers. ST’s LEO-related revenue reached approximately $600 million in 2025, up from about $175 million in 2021, representing a CAGR of roughly 36%. This is an impressive starting point, but the opportunity is still in its early innings. The market is expanding quickly, the customer base is broadening, and the underlying technology roadmap continues to deepen semiconductor content across satellites, gateways, and user terminals. Why LEO is scaling so fast The economics of LEO are being transformed by scale. Gartner estimates that LEO services spending will approach $15 billion globally in 2026. The growth is continuing across three major service categories: broadband, direct-to-cell, and eventually orbital data centers. Broadband is the largest opportunity today. LEO constellations can connect underserved regions, improve resilience for corporate and government users, and provide connectivity for mobility applications such as aviation, maritime, and eventually automotive. In a world where almost 3 billion people remain on the wrong side of the digital divide, the importance of global broadband access is difficult to overstate. The second growth engine is direct-to-cell, which enables phones and IoT devices to connect directly to satellites acting as cell towers in space. This expands connectivity into previously unreachable areas and opens growth in roaming-free services and asset tracking. The third frontier is orbital data centers. While still early, the concept is gaining traction as the cost of launch per kilogram is reduced and the economics of putting compute in orbit become more credible. A highly semiconductor-intensive ecosystem Over the next five years, LEO will scale rapidly into a true communications ecosystem. Space-based downlink capacity is expected to grow around 10x by 2030, gateway infrastructure will expand by estimated 1.6x, and subscribers could rise from about 10 million today to more than 200 million. LEO is not just a communications market. It is a semiconductor market. ST’s opportunity spans all three layers of the ecosystem: • Satellites • Gateways • User terminals Each layer has different technical requirements, but all rely on advanced silicon content. A key factor is the scale: the market is shipping thousands of satellites per year, thousands of gateways, and millions, eventually tens of millions, of user terminals. That combination creates a very large addressable market. Based on our current view, we estimate that LEO broadband electronics SAM was around $650 million in 2025, growing to roughly $2 billion in 2028 and close to $3 billion by 2030, excluding additional upside from orbital data centers. Technology differentiation: where ST wins ST’s competitive strength in LEO comes from the combination of our process technologies, packaging capabilities, and manufacturing scale. FD-SOI for satellites and microcontrollers: ST’s Fully Depleted Silicon On Insulator, or FD-SOI, supplied from our 300 mm fab in France and through foundry partnerships, is a key enabler for ASICs and microcontrollers in space systems. It offers a combination of performance, power efficiency, radiation robustness, and embedded memory capabilities. This matters because satellites need electronics that are reliable, efficient, and resilient in harsh conditions. In LEO, where platforms must be lighter and more integrated, these attributes are essential. BiCMOS for user terminals: For user terminals, BiCMOS is the best technology on the planet for front-end modules. These modules perform signal amplification, transmit and receive switching, filtering, and phase shifting for beamforming. They are central to the cost, performance, and scalability of phased-array antennas. ST’s BiCMOS platform is especially strong in Ku-band cost-optimized designs and Ka-band performance designs, both served from our French manufacturing base. Panel-Level Packaging: On the back end, ST’s Panel-Level Packaging, or PLP, is a genuine differentiator. Unlike traditional round-wafer packaging, PLP uses large rectangular panels, enabling high-volume production, strong RF and thermal performance, and miniaturization. The combination of BiCMOS and PLP is particularly powerful. Neither technology alone would be as compelling as the two together. This is a classic example of how our IDM model delivers technology excellence plus manufacturing execution. ST employee holding a BiCMOS PLP panel Starlink as proof of scale The clearest proof point for ST’s LEO capability is our long-standing collaboration with SpaceX. The relationship spans more than a decade and has involved co-development across key technologies for satellites and user terminals. So far, we have delivered more than 7.5 billion ICs into the program, with active silicon covering roughly 20,000 square meters, or the equivalent of four American football fields. The scale is extraordinary, and it demonstrates that ST can support industrial-grade space programs at very high volume. Economics, scale, and customer concentration Today the LEO market remains relatively concentrated. In the next five years, more players may emerge with the scale and capital intensity to matter, including Amazon Leo (formerly ‘Project Kuiper’), Terawave, OneWeb, European projects, and new emerging constellations. This concentration creates both opportunity and discipline. We believe we can sustain a leading position because of our process integration, packaging capabilities, and manufacturing independence. Product life cycles in user terminals are also short, around 18 months per generation, which reinforces the importance of our IDM model with the capability for industrial scale, rapid ramp-up, and tight execution. This is precisely the kind of environment where our manufacturing model creates advantage. The long-term ambition Our message is straightforward. We expect space to become a major growth driver, with an ambition to generate well above €3 billion in cumulative revenue from space over the 2026 to 2028 period. On the LEO side specifically, this includes broadband and direct-to-cell, with orbital data centers as potential upside. The broader significance is that ST is building a leadership position in a market that is only beginning to expand. LEO is no longer a niche space project. It is becoming a communications infrastructure layer, and eventually perhaps a compute layer, for the planet. For ST, the opportunity is not just about serving satellites. It is about supplying the technologies that make the new space economy scalable, efficient, and economically viable. Presentation: ST: The LEO Opportunity]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/f0021.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Feature]]></mainCategory>
	<postType><![CDATA[product press]]></postType>
	<pubDate>Thu, 4 Jun 2026 07:00:47 +0200</pubDate>

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	<title><![CDATA[STマイクロエレクトロニクス、産業機器の状態モニタリングに最適なセンサ内AI搭載の高性能振動センサを発表]]></title>
	<description><![CDATA[多種多様な電子機器に半導体を提供する世界的半導体メーカーのSTマイクロエレクトロニクス（NYSE：STM、以下ST）は、高精度、高い信頼性、そして優れた電力効率が求められる産業機器の状態モニタリング向けにインテリジェントな振動センサを発表しました。 STのMEMS（微小電気機械システム：Micro Electro-Mechanical System）技術を採用し、インテリジェント･センサ処理ユニット（ISPU 2.0）を搭載した振動センサ「IIS3DWB10IS」は、センシング素子により近い位置で高度なデジタル信号処理およびAI推論を実現します。また、10kHz以上の周波数に対応し、最大200gの振動と衝撃を測定する堅牢な小型センサであり、高いデジタル精度と使いやすさに加え、過酷な環境にも耐えられる、最大125°Cの広範な動作温度範囲を兼ね備えています。この振動センサにより、装置の稼働時間を延長し、予期せぬダウンタイムを削減するほか、さまざまな産業機器の環境における予知保全機能への対応を可能にします。 さまざまな産業分野において、切断や成形、搬送、冷却といった工程では、回転と振動を伴う機器･装置が使用されていることから、振動解析は状態モニタリングの大部分を占めます。ベアリングの故障を事前に予測するなど、問題の早期検出によって装置の停止を予防することは、自動車やその他の製造業を含むあらゆる分野の企業にとって、生産フロー全体の最適化につながります。 STのアナログ･パワー&ディスクリート･MEMS･センサグループ　エグゼクティブ･バイスプレジデント 兼 MEMSサブグループ ジェネラル･マネージャであるSimone Ferriは、次のようにコメントしています。「STの産業機器向けMEMS振動センサは、ハイエンド･アプリケーションに必要とされるダイナミック･レンジと帯域幅を備えており、STのセンサ内デジタル処理技術の優位性をさらに強化しています。高速信号処理とAI推論のための新たなハードウェア･アクセラレータとともに、ISPU 2.0を集積することにより、遅延や消費電力を抑えながら、装置の摩耗状態の認識精度を高めています。この次世代の状態モニタリングに最適な振動センサは、軽量かつ容易な実装が可能で、超高精度で十分にバッテリ駆動できるほどの電力効率を備えているため、圧電センサを代替する初の有力な選択肢となります。」 Bonfiglioli S.P.A社のCTO（最高技術責任者）であるAndrea Torcelli氏は、次のようにコメントしています。「IIS3DWB10ISは、当社が求める市場や環境に適したユニークな特性を備えています。広いダイナミック･レンジや広帯域幅、優れた温度耐性を備えていることに加え、さらに導入しやすいよう、コスト･パフォーマンスに優れた簡略的な回路設計が可能になるため、既存の圧電センサ技術を置き換えることができます。加えて、ISPU 2.0プロセッサを集積し、複雑な信号処理と高速AI推論をセンシング素子の近くに配置しているため、よりスマートなシステム応答を実現できます。」 リモートでの状態モニタリングリングにより、予知保全や優先順位を付けたメンテナンスを実現できるため、装置の稼働時間と動作効率を改善しながら、予期せぬ故障の発生を防止し、安全性を強化できるようになります。Fortune Business Insights社によると、この技術の世界市場は9%超の年平均成長率を達成し、2032年には50億ドルを超える規模になると見られています*。 *https://www.fortunebusinessinsights.com/machine-condition-monitoring-market-112654 技術情報 振動センサ「IIS3DWB10IS」は、広い帯域幅で処理機能を組み込んだ初めてのデジタル･センサです。ハイエンド産業機器の状態モニタリング･アプリケーションのニーズに対応した性能を実現しており、圧電センサを代替する有力な選択肢になります。 10kHzを超える振動を正確に測定し、最大200gの広いダイナミック･レンジを持ちながら、ノイズフロアは圧電センサに匹敵する、わずか35µg/sqrt（Hz）にとどまります。さらに、IIS3DWB10ISは圧電センサと同等の精度と感度に加えて、小型で消費電力が低く、電気･機械設計も簡略化できます。さらに、演算のパーティショニングにおける柔軟性の高さといった、デジタル･センシングの強みも兼ね備えています。 ISPU 2.0（インテリジェント･センサ処理ユニット）は新たなハードウェア･アクセラレータであり、リアルタイムの信号処理とAI処理をエッジ部で実行します。このハードウェア･アクセラレータは、使用頻度の高い機能の処理をさらに高速化し、電力効率を向上します。コアはC言語でのプログラムが可能で、プログラム用とデータ用のRAMを内蔵しています。 サポートしているエコシステムには、標準的な振動モニタリングリングでよく使用されるアルゴリズム（FFTやフィルタリング処理、エンベロープ、速度重大度、異常検出など）のISPUでの実行を支援するソフトウェア･ライブラリが提供されます。 40MIPSおよび40MFLOPSのデジタル信号処理に対応するISPU 2.0は、前世代の最大4倍の処理性能を実現しています。加えて、ISPU 2.0センサ･インタフェースでは、MEMS回路と共に6倍のデータ転送速度を実現します。 IIS3DWB10ISには、2048 x 80bitのFIFOレジスタと高精度の温度センサも搭載されています。 また、堅牢なMEMSベースの設計により、最大125°Cの動作温度範囲に対応しています。IIS3DWB10ISは、STの産業機器向け製品の10年間の長期製品供給保証の対象製品です。 IIS3DWB10ISは、16リードLGAパッケージ（4.5 x 4.5 x 1.5 mm）で提供されます。リードは、ウェッタブル・フランク構造のため、高品質の表面実装組立工程における光学検査を自動化しやすくなっています。2026年7月までに提供が開始される予定で、単価は1000個購入時に約25ドルです。 詳細についてはウェブサイトをご覧ください。 STマイクロエレクトロニクスについて STは、約49,000名の従業員を擁し、包括的なサプライ・チェーンと最先端の製造設備を有する世界的な総合半導体メーカーです。約20万社を超えるお客様や数千社のパートナー企業と協力しながら、お客様のビジネス創出や持続可能な社会をサポートする半導体ソリューションの開発ならびにエコシステムの構築に取り組んでいます。STのテクノロジーは、スマート・モビリティ、電力エネルギー管理の効率化、クラウド接続型自律デバイスの普及を可能にします。STは、すべての直接・間接排出（スコープ1および2）、ならびに製品輸送、従業員の出張･通勤による排出（スコープ3の注力分野）におけるカーボンニュートラル達成に向けた取り組みを進めており、2027年末までに再生可能エネルギーの使用率を100％にする計画です。さらに詳しい情報はSTのウェブサイト（http://www.st.com）をご覧ください。]]></description>
	<link>https://newsroom.st.com/ja/media-center/press-item.html/p4778.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/06/P4778D-Jun-3-2026-IIS3DWB10IS-smart-vibrometer_PR-IMAGE-LO-RES.jpg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[product press]]></postType>
	<pubDate>Wed, 3 Jun 2026 07:00:42 +0200</pubDate>

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	<title><![CDATA[STマイクロエレクトロニクス、AIサーバからロボティクスまで、幅広い高性能アプリケーションの電力効率向上に貢献する新しいGaN製品を発表]]></title>
	<description><![CDATA[STマイクロエレクトロニクス（NYSE：STM、以下ST）は、電動化を支える高性能アプリケーションにおいて、効率と電力密度の向上を実現する新しいGaN（窒化ガリウム）ベースのパワー半導体を発表しました。STPOWERポートフォリオの700V PowerGaN製品は、AIサーバの消費電力の増大や、従来のシリコン技術の限界を超える、より高性能な電力変換へのニーズといった課題に対応します。 STの新しいPowerGaN製品は、高電圧電源の高効率化と高電力密度化を実現します。定格電圧700Vでの動作を想定して設計されており、信頼性に優れた大電力動作と、より高周波の回路構成に対応します。低い導通損失や高周波動作時における極めて低いスイッチング損失、逆回復電荷ゼロといったPowerGaN固有の特徴により、システムの小型･軽量化と動作温度の低減が可能になります。これらの特性は、ロボティクス、産業用電源、および発電･送配電･蓄電用スマートグリッド･コンバータで使用されるパワー半導体において特に重要です。 STのパワー & ディスクリート･サブグループ担当エグゼクティブ･バイスプレジデントであるMario Aleoは、次のようにコメントしています。「新しい700V製品をPowerGaNポートフォリオに追加することにより、窒化ガリウム技術のメリットを中･高電力アプリケーションへと広げることができます。STは今後も、さらなる電圧定格や機能の追加により、未来のAIサーバやヒューマノイド･ロボティクス、産業用電源、そして家電製品を含む先進的なコンスーマ向け電源アプリケーションに向けて、GaN製品ポートフォリオの強化を進めていきます。」 技術情報 STの700V PowerGaNシリーズに新たに加わった7品種のGaN HEMTは、6A ~ 29Aの幅広い連続電流定格と、53mΩ ~ 270mΩの標準オン抵抗（RDS(on)）に対応しています。また、GaNワイド･バンドギャップ技術に固有の極めて低い内部静電容量と低いゲート電荷も特徴としており、いずれの品種もQg × RDS(on)の性能指数（FoM）において従来のシリコン製品を大幅に上回ります。 STの信頼性基準に準拠した新しい700V PowerGaNトランジスタは、選択肢を広げるとともに、最先端の性能と効率を実現します。MOSFETの代替として電力変換回路に直接置き換えることができ、より高い周波数の新たな回路構成も可能にします。高いスイッチング周波数で動作できるため、磁性部品や受動部品の小型化が可能になり、よりコンパクトなパワー段と高い電力密度を実現できます。 同製品は、主要なEDA（電子設計自動化）ライブラリやツールチェーンで広くサポートされ、実績のある表面実装型パッケージ（DPAK、TO-LL、PowerFLAT）で提供されます。TO-LLおよびPowerFLATパッケージの製品は、ゲート制御回路を主電力経路から分離するケルビン･ソース端子を備えているため、ノイズ耐性が極めて大きく、ゲート･ドライバを保護し、タイミング･マージンを確保します。今回発表された製品は以下のとおりです。 • SGT350R70GTK（6A、270mΩ*）：はんだ付け可能な端子を備えた3ピンのDPAKパッケージ（6.10 x 6.60mm）で提供 • SGT070R70HTO（26A、53mΩ*）：熱効率に優れたドレイン / ソース接続端子を備えたリードレスTO-LLパッケージで提供 • SGT080R70ILB（29A、60mΩ*）、SGT105R70ILB（21.7A、80mΩ*）、SGT140R70ILB（17A、106mΩ*）、SGT190R70ILB（11.5A、138mΩ*）、SGT240R70ILB（10A、165mΩ*）：いずれも、放熱性能を高めるはんだ付け可能なソース･パッドを備えたPowerFLAT 8x8パッケージで提供 (*) 標準オン抵抗（RDS(on)） 新しい700V PowerGaNトランジスタは現在量産中で、STのeStoreまたは販売代理店から入手可能です。1000個購入時の単価は、約0.63ドルから約2.25ドルです。 詳細については、ウェブサイトをご覧ください。 STマイクロエレクトロニクスについて STは、約49,000名の従業員を擁し、包括的なサプライ・チェーンと最先端の製造設備を有する世界的な総合半導体メーカーです。約20万社を超えるお客様や数千社のパートナー企業と協力しながら、お客様のビジネス創出や持続可能な社会をサポートする半導体ソリューションの開発ならびにエコシステムの構築に取り組んでいます。STのテクノロジーは、スマート・モビリティ、電力エネルギー管理の効率化、クラウド接続型自律デバイスの普及を可能にします。STは、すべての直接・間接排出（スコープ1および2）、ならびに製品輸送、従業員の出張･通勤による排出（スコープ3の注力分野）におけるカーボンニュートラル達成に向けた取り組みを進めており、2027年末までに再生可能エネルギーの使用率を100％にする計画です。さらに詳しい情報はSTのウェブサイト（http://www.st.com）をご覧ください。]]></description>
	<link>https://newsroom.st.com/ja/media-center/press-item.html/n4776.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/05/N4776I-May-26-2026-PowerGaN_PR-IMAGE-LO-RES.jpg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[newsbite]]></postType>
	<pubDate>Tue, 2 Jun 2026 09:43:37 +0200</pubDate>

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	<title><![CDATA[STマイクロエレクトロニクス、AIインフラへの需要が引き続き堅調な中、データセンター向け事業の売上予測を上方修正]]></title>
	<description><![CDATA[多種多様な電子機器に半導体を提供する世界的半導体メーカーのSTマイクロエレクトロニクス（NYSE：STM、以下ST）は、AIインフラの堅調な需要の継続、ならびに生産能力増強に向けた取り組みの直近の進捗に基づき、データセンター向け事業の売上予測を上方修正することを発表しました。 現在、2026年のデータセンター向け事業の売上は、約10億ドルを見込んでいます。（従来は「5億ドルを大幅に上回る」予測でした。）また、現在の勢いが継続し、進行中の案件が順調に進行した場合、2027年にこの売上は倍増する可能性があります。（従来は「10億ドルを大幅に上回る」予測でした。） 将来予測に関する記述 本リリースの記述のうち過去の事実以外の記述には、経営陣の現時点での見解および推測に基づく将来の見込みおよび将来予測に関する記述（1933年米国証券法第27A条または1934年米国証券取引所法21E条（いずれも修正後）に該当する）があり、とりわけ以下の要因によって当該記述と著しく異なる結果、業績または状況を引き起こす既知または未知のリスクおよび不確定要因に左右され、且つ本記述にはこれらのリスクおよび不確定要因が含まれています。  マクロ経済環境への影響や当社製品の需要に悪影響を及ぼす、または悪影響を及ぼす可能性のある関税、貿易障壁および制裁措置の継続･適用･拡大など、国際的な貿易政策の変化  当社製品の製造キャパシティおよび最終製品市場の需要に影響を及ぼす、または悪影響を及ぼす可能性のある不確実なマクロ経済状況および業界動向（インフレならびにサプライ･チェーンの変化など）  予測と異なる顧客の需要により、期待された利益を完全に、または全く実現することができない可能性を持つ変革策に着手する必要が生じる可能性  変化の激しい技術環境において、革新的な製品を設計･製造･販売する能力  当社、当社の顧客もしくは納入業者が事業を行う地域における経済、社会、公衆衛生、労働、政治もしくはインフラ環境の変化（マクロ経済もしくは地域的な事象、地政学的ならびに軍事的な衝突、社会不安、労働争議またはテロ活動が原因となるものを含む）  当社の計画の実行および（または）、助成金を利用した当社の研究開発および製造計画の目標を達成する能力に影響を及ぼす不測のイベントもしくは状況  当社の大手販売代理店の経営難、もしくは主要顧客による購買数の大幅な削減  当社の生産設備の稼働力、製品構成および製造能力、および（または）納入業者もしくは第三者の製造受託業者が確保した製造容量を満たすために当社に必要とされる数量  原材料、設備、第三者の製造委託サービスおよび技術、もしくは当社の事業運営で必要とされるその他供給品の調達およびその費用（インフレに起因する費用の増加を含む）  製造･財務･販売を含む当社の極めて重要な事業活動を支え、サイバーセキュリティの脅威にさらされる当社の情報技術（IT）システムの機能性および性能、ならびに当社、または当社の顧客、サプライヤ、パートナー、および第三者ライセンス技術の提供者のITシステムの不具合  当社の従業員、顧客もしくは第三者に関する個人情報の盗難、紛失または悪用、ならびにデータ･プライバシー法令への違反  競合他社もしくはその他第三者からの知的財産権（IP）に関する請求による影響、および必要とされるライセンスを適正な期間と条件で入手できる当社の能力  当社の業績ならびに税額控除・税制優遇、控除、引当金を正確に予測し、繰延税金資産を認識する能力に影響を及ぼす可能性のある、税法の改正、新法制定もしくは法改正、税務監査の結果、または国際租税条約の改正に伴う当社の総合的な税務ポジションの変動  外国為替市場や、特に当社が事業に使用するユーロおよびその他の主要通貨との比較における米ドル為替レートの変動性  進行中の訴訟および当社が被告となる可能性がある新たな訴訟の結果  当社の製品に関する製造物責任もしくは保証請求、故障の続発もしくは引渡不履行に基づく請求、あるいはその他の請求、または当社の部品を搭載した製品の当社顧客によるリコールの実施  当社、顧客もしくは納入業者が事業を行う地域における異常気象、地震、津波、火山の噴火もしくはその他天災などの自然現象、気候変動、健康リスク、世界的 / 地域的な感染拡大といった伝染病またはその流行などによる影響  気候変動、持続可能性、ならびにすべての直接・間接排出（スコープ1および2）、ならびに製品輸送、従業員の出張･通勤による排出（スコープ3の注力分野）におけるカーボンニュートラル達成に向けた取り組みおよび2027年末までに再生可能エネルギーの使用率を100％にするという当社の目標に関連するものを含む、業界における規制ならびにイニシアティブの増加  世界的 / 地域的な感染拡大が世界経済に長期間にわたって継続的に著しい悪影響を及ぼす可能性、および当社の事業ならびに業績結果に重大な悪影響を及ぼす可能性  当社のサプライヤ、競合他社ならびに顧客間の垂直･水平統合に伴う業界の変化  第三者の重要な部材の性能および当社の期待に合致した外部委託業者の能力など、当社が制御できない要因の影響を受ける新たなプログラムを立ち上げる能力  個々の顧客による製品使用が予想された使用方法と異なった場合にエネルギー消費を含む性能に差異が生じる可能性、その結果、公表した排出削減目標の未達、不利な法的措置ならびに追加の調査費用が発生する可能性 将来予測に関するこれらの記述は、様々なリスクや不確定要因の影響を受けます。そうした様々なリスクや不確定要因は、当社の事業の実績と効率が将来予測に関する記載と大きく異なる要因となりえます。将来予測に関するいくつかの記述は、「思います」、「期待します」、「可能性があります」、「予期されます」、「はずです」、「でしょう」、「しようとします」、「見込まれます」もしくは同様の表現、またはその否定表現もしくはその他の表現の変化、類似する専門用語、あるいは戦略、計画、または意向に関する議論により識別することができます。 これらのリスク要因は、2026年2月26日に米国証券取引委員会（SEC）に提出された当社の2025年12月31日終了年度フォーム20-Fに関する年次報告書に含まれる「第3項　主要情報 － リスク要因」に記載され、詳細に議論されています。これらのリスク要因または不確定要因の1つ以上が具体化した場合や、基礎となる前提が誤りであることが判明した場合、実際の結果が予測、確信、期待によって本プレスリリースに記載した結果と大きく異なる可能性があります。当社は、後発事象や状況を反映させるために本リリースに含まれる業界情報または将来予測の記述を更新する意向はなく、かつ更新する責任を一切負いません。 米国証券取引委員会（SEC）に提出される書類に随時記載されている、上記または「第3項 主要情報 – リスク要因」に記載されているその他の要因や不確実性の好ましくない変化は、当社の事業および（または）財政状態に重大な悪影響を及ぼす可能性があります。 STマイクロエレクトロニクスについて STは、約49,000名の従業員を擁し、包括的なサプライ・チェーンと最先端の製造設備を有する世界的な総合半導体メーカーです。約20万社を超えるお客様や数千社のパートナー企業と協力しながら、お客様のビジネス創出や持続可能な社会をサポートする半導体ソリューションの開発ならびにエコシステムの構築に取り組んでいます。STのテクノロジーは、スマート・モビリティ、電力エネルギー管理の効率化、クラウド接続型自律デバイスの普及を可能にします。STは、すべての直接・間接排出（スコープ1および2）、ならびに製品輸送、従業員の出張･通勤による排出（スコープ3の注力分野）におけるカーボンニュートラル達成に向けた取り組みを進めており、2027年末までに再生可能エネルギーの使用率を100％にする計画です。さらに詳しい情報はSTのウェブサイト（http://www.st.com）をご覧ください。]]></description>
	<link>https://newsroom.st.com/ja/media-center/press-item.html/c3396.html</link>
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	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Tue, 2 Jun 2026 07:00:38 +0200</pubDate>

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	<title><![CDATA[Water stewardship in action]]></title>
	<description><![CDATA[This article from our sustainability magazine Amplify highlights how our teams are enhancing water recycling in Kirkop (Malta) and strengthening collaborative water stewardship in Shenzhen (China). Water stewardship in action Chip production relies heavily on water, especially ultrapure water, which is needed to manufacture them. This dependency challenges semiconductor makers to optimize their use of water. By prioritizing water recycling and efficient usage, companies can reduce environmental impact while supporting the industry’s growth and resilience. At ST, we have developed a clear and practical approach to water stewardship focused on monitoring, risk management, and innovative solutions. This includes water stress assessments, conservation programs, water efficiency improvements, and wastewater treatment initiatives. Putting this approach into practice means implementing effective solutions at our sites. In Kirkop (Malta), our team introduced an advanced water recycling system that treats and reuses both production and facility wastewater. This system helps conserve valuable water resources while supporting our manufacturing needs. To better understand how this innovative system works, let’s take a closer look at the water treatment process step by step. 01 / EQUALIZATION TANK Water from production, domestic, and other facility sources is collected and mixed in the equalization tank. Here, the pH is carefully adjusted to create an optimal environment for beneficial bacteria to thrive. 02 / OXIDATION TANK The water flows into the oxidation tank, where tiny air bubbles promote natural breakdown of pollutants by bacteria. Nutrients such as glucose, urea, and phosphorus are added in precise amounts to support this process. Bioflocculation occurs here, causing bacteria and particles to clump together, which helps separate solids and improve water quality. 03 / MICRO BIOREACTOR (MBR) MEMBRANE FILTRATION The water then passes through the MBR membrane, an advanced filtration system that uses pressure to produce clean, high-quality water within a compact footprint. A 24/7 online monitoring system continuously tracks water quality, ensuring the treated water meets ultrapure standards and is ready for reuse. 04 / SLUDGE MANAGEMENT AND DECANTING To maintain system efficiency, sludge is regularly removed. A decanter extracts water from the sludge, leaving solid waste that is safely managed, completing a carefully controlled cycle of treatment and reuse. The need for collaboration We recognize that managing water responsibly means more than just focusing on our own sites. Water is a shared resource, and effective stewardship requires collaboration. We work with suppliers and industry groups, such as the Responsible Business Alliance, to share knowledge and advance water systems. Since joining the Alliance for Water Stewardship (AWS) in 2023, we have strengthened our approach to water stewardship. AWS stands out for its broad focus on water challenges and its thorough look at local water contexts beyond individual site operations. This encourages collaboration among many stakeholders to address shared water issues. Our Shenzhen site (China), has led the way in putting these ideas into action. In December 2024, it became the first ST site to be AWS certified, achieving Platinum ranking. The project involved several teams across the site, including Environmental, Health and Safety (EHS), Operations, Facilities, Quality Management, and Corporate Sustainability. Their main goal was to complete AWS certification within one year while establishing new ways to engage with stakeholders such as suppliers, neighboring businesses, NGOs, and local communities. Among the key initiatives was a pilot project to reuse reclaimed water for municipal uses like road cleaning and landscaping irrigation. This reduced wastewater discharge and conserved tap water. In partnership with Hitachi Global Storage Technologies, the team improved industrial wastewater treatment and built infrastructure that can supply reclaimed water to the community with a capacity of 4,000 cubic meters per day. In addition, the team conducted a supply chain water risk assessment by distributing questionnaires and analyzing responses from several suppliers. This helped identify water risks and indirect water use across the supply chain, providing valuable insights for future action. This article is one of many featured in our new sustainability magazine. Explore the full issue to discover more initiatives, insights, and perspectives from across ST at st-sustainability-magazine-amplify-vol1-en.pdf]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/f0020.html</link>
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	<mainCategory><![CDATA[Feature]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Mon, 1 Jun 2026 12:59:52 +0200</pubDate>

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	<title><![CDATA[Statement from the Supervisory Board of STMicroelectronics]]></title>
	<description><![CDATA[Following the conclusion of STMicroelectronics N.V. (NYSE: STM) Annual General Meeting of Shareholders, which took place today in Amsterdam (the Netherlands), the members of the Supervisory Board of ST appointed Mr. Armando Varricchio as the Chairman and Mr. Nicolas Dufourcq as the Vice-Chairman of the Supervisory Board, respectively, for a 3-year term to expire at the end of the 2029 AGM. The biographies of Messrs. Varricchio and Dufourcq are available on the Company’s website (www.st.com). About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3395.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Wed, 27 May 2026 11:50:59 +0200</pubDate>

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	<title><![CDATA[All resolutions approved at the 2026 STMicroelectronics’ Annual General Meeting of Shareholders]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced the results related to the voting items of its 2026 Annual General Meeting of Shareholders (the “2026 AGM”), which was held today in Amsterdam, the Netherlands. The press release is available as a PDF here.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3394.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Wed, 27 May 2026 11:40:39 +0200</pubDate>

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	<title><![CDATA[How ST’s intelligent sensing is enabling Physical AI]]></title>
	<description><![CDATA[By Marco Cassis, President, Analog, Power & Discrete, MEMS and Sensors Group, Head of STMicroelectronics’ Strategy, System Research and Applications, Innovation Office. From factory floors and operating rooms to self-driving cars and smart homes, artificial intelligence is taking on tasks that require it to understand and respond to the real world in real time. This is the era of Physical AI: systems that don\'t just process data, but perceive, decide, and act. For AI to operate safely and reliably in dynamic environments, it needs a continuous, accurate feed of physical-world information from temperature to motion, pressure, proximity and orientation, interpreted fast enough to matter. This sensing layer is the foundation on which every downstream decision rests. STMicroelectronics sits at the heart of this challenge. With a technology portfolio spanning MEMS and optical sensing, microcontrollers, edge AI processing, and wide bandgap semiconductors for power delivery, ST provides the full signal chain from first sensor contact to final actuator command. The ability to filter, classify, and act on physical data before it ever reaches a central processor is critical. Intelligent sensing is becoming a defining enabler of Physical AI, and ST\'s approach is shaping what machines can know, and do, about the world around them. Why Physical AI needs more than data Most AI innovation of the past decade has been driven by algorithms trained in data centers and deployed via the cloud. But as AI migrates into cars, factories, hospitals, and homes, its performance is constrained by the quality, fidelity, and timeliness of its inputs. Sensing is at the heart of making good decisions. But the dominant sensing architecture today is still fundamentally passive: sensors stream raw data to centralized processors, which derive context and issue commands. This creates three structural problems that become increasingly untenable as AI takes on safety-critical roles. Latency is the most immediate. Autonomous vehicles, industrial robots, and human-machine interfaces cannot wait for a round trip to a remote processor. Decisions must be made in milliseconds, at the point of perception. Power and bandwidth are next. Continuous transmission of raw sensor data is expensive in energy and network resources. Physical AI requires millions of devices, many running on battery to scale. Safety and reliability are the most consequential. Noisy signals, dropped data, or misinterpreted data in systems that operate near people pose risks. The closer AI gets to the physical world, the higher the cost of a perceptual failure. The shift underway is therefore not about deploying more sensors but about using more intelligent ones. ST\'s answer: sensors that sense and think STMicroelectronics is addressing this challenge by moving intelligence as close as possible to where data originates. Rather than treating sensors as passive data sources, ST\'s intelligent sensing solutions extract context locally, filter and interpret raw signals at the edge, and transmit only the information that matters. The result is lower latency, reduced power consumption, lighter network load, and stronger privacy, because most data never needs to leave the device. ST pursues this through two complementary and increasingly converging pillars. Firstly, Edge AI combines ST\'s sensors with STM32 microcontrollers and dedicated AI accelerators to enable analytics and inference directly on the device. This delivers fast, deterministic responses without dependence on cloud connectivity, a critical capability in automotive systems, industrial controls, and smart infrastructure where network availability cannot be assumed and response times are measured in microseconds. Secondly, in-sensor AI pushes intelligence further still, inside the sensor itself. Through embedded cores such as the Intelligent Sensor Processing Unit (ISPU) and on-sensor machine learning engines, ST devices can process raw sensing data in real time, execute ML algorithms at ultralow power, and output high-level information using a classified gesture, a detected anomaly, a recognized motion pattern, rather than a raw data stream. This matters enormously in wearables, robotics, and personal electronics, where responsiveness and battery life are fundamental requirements. Together, these pillars define a new sensing paradigm with sensors that understand what they perceive. ST’s full-stack advantage What distinguishes ST\'s position in intelligent sensing is not any single technology, but the coherence of the stack behind it. ST brings together leadership in MEMS motion, pressure, and environmental sensing; advanced imaging capabilities including 2D, 3D, and Time-of-Flight; STM32 microcontrollers with neural processing units; and the software tools to integrate them. Crucially, ST controls this stack from research and design through to manufacturing, including 300 mm fabs in Europe. This integration means ST can engineer the interfaces between sensing, processing, and actuation as a coherent system, rather than optimizing each layer in isolation. For Physical AI architectures, where the interaction between sensing and decision-making is the performance-critical variable, this is a genuine differentiator. ST\'s technology and product breadth positions the company to serve both consumer and high-value automotive and industrial applications simultaneously. From consumer to mission-critical ST has long been a trusted sensing partner for consumer electronics, enabling the motion awareness, environmental responsiveness, and biometrics that have become standard in smartphones, wearables, and gaming devices. That consumer heritage built on volume, miniaturization, and power efficiency, provides a strong foundation for the more demanding environments ST is increasingly serving. Intelligent sensing is becoming foundational infrastructure for the most significant structural shifts of the coming decade: the energy transition, remote and continuous healthcare, smart cities, next-generation consumer devices, and the continued automation of industry. Across all of them, the sensor is no longer a passive input device. It is an intelligent agent at the frontier between the digital and physical worlds. In automotive, ST\'s intelligent sensing is enabling driver and in-cabin monitoring, advanced driver assistance systems (ADAS), and autonomous driving. In industrial settings, it underpins collaborative robotics, predictive maintenance, and condition monitoring on factory floors. In smart infrastructure, it supports continuous, low-power monitoring of buildings, energy systems, and urban environments. In imaging, ST is concentrating on high-growth segments where precise, robust perception is essential for future mobility, automation, and smart environments. What intelligent sensing enables: the capability map Across every domain where Physical AI is taking hold, ST\'s intelligent sensing portfolio is unlocking a consistent set of strategic capabilities: Immediate responsiveness. Robots, vehicles, and autonomous devices can react to people and changing conditions in real time, enabling interactions that feel natural rather than mechanical. Operational safety. Continuous, high-fidelity perception and motion awareness are prerequisites for systems that share space with humans whether on a factory floor, a public road, or in a domestic environment. Edge independence. Local processing reduces dependence on network connectivity, increases system resilience, and cuts the energy and bandwidth cost of large-scale deployment. System simplicity. Higher integration and embedded intelligence reduce external component counts, lowering both system complexity and bill-of-materials cost. Predictive maintenance and uptime. Low-power continuous monitoring enables condition-based maintenance strategies that extend asset life and reduce unplanned downtime. Privacy and trustworthiness. Sensitive data processed on-device never traverses a network. Combined with in-house manufacturing and a robust supply chain, this supports secure, auditable deployment at scale. The humanoid robot test case No application illustrates the demands of Physical AI more vividly than humanoid robotics. A humanoid robot must sense its environment continuously and accurately, understand human presence and intention, maintain dynamic balance, navigate unpredictable spaces, and manipulate objects, often in close proximity to people, in real time, without fail. It is, in effect, a walking proof of concept for every challenge Physical AI must solve. ST estimates that a typical humanoid robot contains approximately $600 of addressable semiconductor content. ST is already working with multiple humanoid robot developers worldwide, providing the sensing and edge computing capabilities that allow these systems to perceive, move, and interact safely in human environments. As the humanoid market scales from research platforms to deployed systems, the quality of sensing will be among the most important variables. That awareness is what Physical AI requires. And sensing is where it begins. Conclusion Physical AI is already being designed into products that will define the next generation of mobility, manufacturing, healthcare, and infrastructure. By embedding intelligence at the point of perception ST is helping customers build machines that are not merely connected to the world, but genuinely aware of it.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/f0019.html</link>
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	<mainCategory><![CDATA[Feature]]></mainCategory>
	<postType><![CDATA[newsbite]]></postType>
	<pubDate>Tue, 26 May 2026 07:00:46 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics President and CEO Jean-Marc Chery to speak at BNP Paribas Exane CEO conference]]></title>
	<description><![CDATA[STMicroelectronics N.V. (“ST”) (NYSE: STM) President and Chief Executive Officer Jean-Marc Chery will speak at the BNP Paribas Exane CEO conference in Paris on June 2, 2026 at 11 A.M. Central European Time. A live webcast (listen-only mode) of the conference will be accessible at ST’s website, https://investors.st.com, and will be available for replay until June 16, 2026. About STMicroelectronics At ST, we are 48,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3393.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Mon, 25 May 2026 07:00:50 +0200</pubDate>

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	<title><![CDATA[ST and quantum: bringing industrial scale to a new compute frontier]]></title>
	<description><![CDATA[ST is bringing its industrial semiconductor expertise to quantum computing, helping advance silicon-based quantum processors toward commercial viability, with the quality, scalability, and cost discipline required for real-world deployment. With its integrated device manufacturer (IDM) model, 300 mm manufacturing leadership in its Fab in Crolles/France, and fully depleted silicon-on-insulator (FD-SOI) technology platform, ST is well positioned to address one of quantum computing’s central challenges: industrialization. Why quantum computing now? Quantum computing is a major frontier in advanced computing, with the potential to address problem classes that are increasingly difficult for classical systems. For ST, the opportunity lies in helping turn that scientific progress into manufacturable, scalable, and reliable technology. Our industrial semiconductor expertise, with our 300 mm manufacturing capabilities in Crolles/France, is highly relevant to this next phase of quantum computing, where success will depend as much on industrialization as on physics. Where is the field today? Quantum computing is entering a phase where industrial requirements matter more than ever. The next step is not only to prove that a device works, but also to build systems that are manufacturable, stable, and scalable. From ST’s perspective, the future of quantum will depend on the same disciplines that have shaped advanced semiconductor technologies: process control, integration, quality, and platform maturity. Industrializing those breakthroughs is what will make quantum relevant for real-world compute environments, including future applications powered by high-performance computing. What qualifies ST for the quantum industry? ST is an industrial enabler of quantum computing. As a global IDM, we bring deep manufacturing expertise and proven technology development capabilities to a field that must move from laboratory demonstrations to scalable hardware. Our role is to help bridging the gap between quantum potential and industrial deployment, because quantum computing will only become broadly relevant if it can be produced with the consistency, integration, and quality expected from advanced semiconductor technologies. Why does ST believe silicon / FD-SOI will help industrialize quantum computing? ST believes that silicon-based approaches are especially promising because they build on the semiconductor industry’s strengths and investment for high-volume manufacturing, thus offering a faster path to industrialization. FD-SOI is particularly relevant because it combines strong power-performance, excellent variability control and high integration potential, capabilities that are critical for quantum architectures, where stability, precision, and reproducibility matter. Together, these attributes help move quantum hardware from experimental concepts to manufacturable quantum hardware. What must happen for quantum to scale? ST brings the industrial foundations needed to help quantum hardware scale. As a global IDM, we have end-to-end control from technology development to manufacturing execution, and our 300 mm manufacturing leadership provides the process maturity, consistency, and scalability required for industrial deployment. We also bring deep expertise in FD-SOI, a technology platform particularly well suited to applications where power efficiency, variability control, and integration are essential. How does this fit into the broader compute landscape? ST sees quantum computing and HPC as complementary parts of a broader advanced computing landscape. HPC will remain essential for large-scale simulation, classical workloads, and data-intensive applications while quantum computing may one day accelerate specific classes of highly complex problems where classical computing becomes less efficient. The future is likely to be heterogeneous, with quantum and classical systems working together and ST’s role is to provide the semiconductor foundations that support this evolution.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/f0018.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Feature]]></mainCategory>
	<postType><![CDATA[technical press]]></postType>
	<pubDate>Thu, 21 May 2026 07:00:13 +0200</pubDate>

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	<title><![CDATA[STマイクロエレクトロニクス、次世代のパーソナル電子機器向けに超低消費電力CMOSイメージ･センサを発表]]></title>
	<description><![CDATA[多種多様な電子機器に半導体を提供する世界的半導体メーカーのSTマイクロエレクトロニクス（NYSE：STM、以下ST）は、バッテリ動作や環境発電（エナジー・ハーベスト）により動作する小型機器向けに、高品質で常時駆動の画像システムを実現する、グローバル･シャッターを搭載した超低消費電力の次世代CMOSイメージ･センサを発表しました。ST BrightSenseファミリに追加された「VD55G4」（IR・モノクロ）および「VD65G4」（RGB・カラー）は、主要顧客向けに先行して提供されており、次世代のスマートな超低消費電力画像システムの開発に貢献します。 次世代のパーソナル電子機器およびスマート機器向けに設計されたこれらの新しいセンサは、ウェアラブル機器やAR / VRおよびXRヘッドセット、スマート家電、医療機器などのアプリケーションに適しています。両製品は、消費電力やサイズ、コストに厳しい制約がある機器において、豊富な視覚情報のコンテキストとAI処理が可能なデータを提供できるよう設計されています。検知時に起動する超低消費電力アーキテクチャと、超小型グローバル･シャッターの光学フォーマットを組み合わせ、低消費電力マイクロコントローラ（マイコン）や低コストのシステム･オン･チップ（SoC）向けに最適化されたインタフェースを備えています。 STのエグゼクティブ･バイスプレジデント 兼 イメージング･サブグループ･ジェネラル･マネージャーであるAlexandre Balmefrezolは、次のようにコメントしています。「常時オンのビジョン機能は、スマート･グラスやAR / VRヘッドセットからスマート家電や医療機器に至るまで、次世代のパーソナル電子機器にとって不可欠な要素となりつつあります。STはVD55G4とVD65G4を通じて、この機能を、小型バッテリで長時間の動作が求められる小型･軽量製品にも提供します。これらの新しいセンサにより、顧客は、直感的で応答性に優れた体験を生み出すことができるとともに、バッテリ寿命の延長や、日常生活で使用する機器へのビジョンおよびエッジAI機能の組み込みが可能になります。」 ウェアラブル機器やAR / VRからスマート家電まで VD55G4およびVD65G4は、小型･軽量かつ厳しい電力効率が求められる機器に、常時オンのビジョン機能を提供します。ST BrightSenseファミリに追加された両製品には、カラー･オプションや対話型ユースケースでの高速応答、そして低消費電力マイコンと容易に接続できるコネクティビティが追加されています。これにより、スペースとコストが制約された設計においても、簡単にビジョン機能を追加できます。 ウェアラブル機器においては、視線検出や存在検出、コンテキストに応じたアラートなど、常時周囲を認識する機能を実現しながら、超小型設計に対応し、マイコン･ベースのプラットフォームで直接動作します。 AR / VRなどのヘッドセットでは、低消費電力と高品質な画像取得を組み合わせることで、正確なトラッキングと空間認識を可能にし、快適性を損なうことなくバッテリ寿命の延長に貢献します。 スマート家電やIoT機器、医療機器においては、より多くの処理をデバイス上で実行できるため、クラウドへの依存と待機電力を低減できます。小型で電力効率に優れた両製品は、太陽光発電やエナジー･ハーベストで動作する画像システムにも最適です。 消費電力を10分の1まで削減した超低消費電力設計 最適化されたセンサのアーキテクチャと専用モードにより、VD55G4およびVD65G4は、従来のグローバル･シャッター搭載センサと比べて最大で10分の1まで消費電力を抑えることができます。両製品は、周囲の変化をモニタリングし、必要な時にのみメイン･プロセッサを起動することで、常時ストリーミングする方式からイベント駆動型の動作へ移行することができます。これにより、終日利用可能な機能とバッテリ寿命の延長、小型バッテリやエナジー･ハーベストで動作する実用的な画像システムの実現が可能になります。 超小型かつ画像処理機能を内蔵する両製品は、設計を簡略化しシステム･コストを削減するとともに、さまざまなエッジ･デバイスにおいて応答性に優れたAI対応ビジョン機能を提供します。 充実する設計エコシステム VD55G4（IR・モノクロ）およびVD65G4（RGB・カラー）イメージ･センサはSTのクロル工場で製造されており、300mmウェハを用いた65nmと40nmの3次元積層アーキテクチャと自社プロセスを採用しています。 また、STは以下のような各種ツールとリソースを含む統合的な開発環境をエコシステムとして提供しています。 • STM32やRaspberry Piなどのプラットフォーム向け開発ボード • ターンキーのカメラ･モジュール • 評価用ソフトウェア、プラットフォーム用ドライバ • 組み込みビジョン機器の開発を迅速化するソフトウェア開発キット 今後リリース予定のこれらのリソースにより、システム設計者は、常時駆動可能な画像システム･ソリューションの迅速な開発および導入が可能になります。 価格およびサンプル提供については、STのセールス･オフィスまたは販売代理店までお問い合わせください。ST BrightSense製品の詳細については、ウェブサイトをご覧ください。 STマイクロエレクトロニクスについて STは、約48,000名の従業員を擁し、包括的なサプライ・チェーンと最先端の製造設備を有する世界的な総合半導体メーカーです。約20万社を超えるお客様や数千社のパートナー企業と協力しながら、お客様のビジネス創出や持続可能な社会をサポートする半導体ソリューションの開発ならびにエコシステムの構築に取り組んでいます。STのテクノロジーは、スマート・モビリティ、電力エネルギー管理の効率化、クラウド接続型自律デバイスの普及を可能にします。STは、すべての直接・間接排出（スコープ1および2）、ならびに製品輸送、従業員の出張･通勤による排出（スコープ3の注力分野）におけるカーボンニュートラル達成に向けた取り組みを進めており、2027年末までに再生可能エネルギーの使用率を100％にする計画です。さらに詳しい情報はSTのウェブサイト（http://www.st.com）をご覧ください。]]></description>
	<link>https://newsroom.st.com/ja/media-center/press-item.html/p4772.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/04/P4772D-Apr-28-2026-New-BrightSense-image-sensors_PR-IMAGE-LO-RES.jpg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[product press]]></postType>
	<pubDate>Tue, 28 Apr 2026 07:01:08 +0200</pubDate>

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