製品概要
概要
STM32Cube is an STMicroelectronics original initiative to significantly improve developer productivity by reducing development effort, time and cost. STM32Cube covers the whole STM32 portfolio.
STM32Cube includes STM32CubeMX, a graphical software configuration tool for pinout and clock tree.
It also comprises the STM32CubeWL MCU Package composed of the STM32Cube hardware abstraction layer (HAL) and the low-layer (LL) APIs, plus a consistent set of middleware components such as FatFS, SBSFU and FreeRTOS™, plus LoRaWAN and sub-GHz PHY connectivity services. All embedded software components are delivered with a full set of examples running on STMicroelectronics boards.
The STM32Cube HAL is an STM32 embedded software layer that ensures maximized portability across the STM32 portfolio, while the LL APIs make up a fast, light-weight, expert-oriented layer which is closer to the hardware than the HAL. HAL and LL APIs can be used simultaneously with a few restrictions.
Both the HAL and LL APIs are production-ready and have been developed in compliance with CodeSonar®, MISRA C®:2012 guidelines and ISO/TS 16949. Furthermore, STMicroelectornics specific validation processes add a deeper-level qualification.
STM32CubeWL gathers in one single package all the generic embedded software components required to develop an application on STM32WL Series microcontrollers. Following STM32Cube initiative, this set of components is highly portable, not only within the STM32WL Series but also to other STM32 Series. In addition, the low-layer APIs provide an alternative, high-performance, low-footprint solution to the STM32CubeWL HAL at the cost of portability and simplicity.
HAL and LL APIs are available in open-source BSD license for user convenience.
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特徴
- Consistent and complete embedded software offer that frees the user from dependency issues
- Maximized portability between all STM32 series supported by STM32Cube
- Application and peripheral examples for easy understanding
- High-quality hardware abstraction layer (HAL) using CodeSonar® static analysis tool and compliant with MISRA C®:2012
- High-quality low-layer APIs (LL) using CodeSonar® static analysis tool and compliant with MISRA C®:2012
- STM32WL-specific middleware: FreeRTOS™, FatFS, sub-GHz physical layer
- LoRaWAN stack
- Free-of-charge, user-friendly license terms
- Automatic update mechanism with new release notification through STM32CubeMX updater feature
ソフトウェア入手
| 製品型番 | 概要 | 最新バージョン | サプライヤ | ダウンロード | すべてのバージョン |
|---|---|---|---|---|---|
| STM32CubeWL | STM32Cube MCU Package for STM32WL series | 1.1.0 | ST | x ライセンス契約同意Please indicate your acceptance or NON-acceptance by selecting “I ACCEPT” or “I DO NOT ACCEPT” as indicated below in the media. BY INSTALLING COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF (AND THE RELATED DOCUMENTATION) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (STMICROELECTRONICS), THE RECIPIENT, ON BEHALF OF HIMSELF OR HERSELF, OR ON BEHALF OF ANY ENTITY BY WHICH SUCH RECIPIENT IS EMPLOYED AND/OR ENGAGED AGREES TO BE BOUND BY THIS SOFTWARE PACKAGE LICENSE AGREEMENT. Under STMicroelectronics’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in this software package and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the software package or any part thereof, with or without modification, are permitted provided that the following conditions are met:
THIS SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THIS SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY. | x ライセンス契約同意Please indicate your acceptance or NON-acceptance by selecting “I ACCEPT” or “I DO NOT ACCEPT” as indicated below in the media. BY INSTALLING COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF (AND THE RELATED DOCUMENTATION) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (STMICROELECTRONICS), THE RECIPIENT, ON BEHALF OF HIMSELF OR HERSELF, OR ON BEHALF OF ANY ENTITY BY WHICH SUCH RECIPIENT IS EMPLOYED AND/OR ENGAGED AGREES TO BE BOUND BY THIS SOFTWARE PACKAGE LICENSE AGREEMENT. Under STMicroelectronics’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in this software package and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the software package or any part thereof, with or without modification, are permitted provided that the following conditions are met:
THIS SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THIS SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY. x ライセンス契約同意Please indicate your acceptance or NON-acceptance by selecting “I ACCEPT” or “I DO NOT ACCEPT” as indicated below in the media. BY INSTALLING COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF (AND THE RELATED DOCUMENTATION) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (STMICROELECTRONICS), THE RECIPIENT, ON BEHALF OF HIMSELF OR HERSELF, OR ON BEHALF OF ANY ENTITY BY WHICH SUCH RECIPIENT IS EMPLOYED AND/OR ENGAGED AGREES TO BE BOUND BY THIS SOFTWARE PACKAGE LICENSE AGREEMENT. Under STMicroelectronics’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in this software package and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the software package or any part thereof, with or without modification, are permitted provided that the following conditions are met:
THIS SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THIS SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY. |
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注目ビデオ
Follow issues and share solutions on Github for STM32Cube MCU packages. Integrate your own software components in a STM32Cube Expansion for STM32CubeMX and STM32CubeIDE tools, thanks to the new STM32PackCreator utility
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すべてのリソース
| Resource title | バージョン | Latest update |
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製品スペック (1)
| Resource title | バージョン | Latest update | ||
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| 3.0 | 05 Nov 2020 | 05 Nov 2020 |
アプリケーションノート (5 of 7)
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| 5.0 | 19 Jul 2021 | 19 Jul 2021 | ||
| 4.0 | 19 Jul 2021 | 19 Jul 2021 | ||
| 2.0 | 19 Jul 2021 | 19 Jul 2021 | ||
| 3.0 | 19 Jul 2021 | 19 Jul 2021 | ||
| 2.0 | 19 Jul 2021 | 19 Jul 2021 | ||
| 1.0 | 22 Jul 2021 | 22 Jul 2021 | ||
| 2.0 | 19 Jul 2021 | 19 Jul 2021 |
ユーザ･マニュアル (5 of 6)
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| 3.0 | 19 Jul 2021 | 19 Jul 2021 | ||
| 3.0 | 28 Oct 2019 | 28 Oct 2019 | ||
| 4.0 | 08 Jun 2021 | 08 Jun 2021 | ||
| 2.0 | 19 Jul 2021 | 19 Jul 2021 | ||
| 2.0 | 10 Jul 2019 | 10 Jul 2019 | ||
| 1.0 | 08 Dec 2020 | 08 Dec 2020 |
プレゼンテーション (5 of 6)
| Resource title | バージョン | Latest update | ||
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| 2.1 | 28 Apr 2021 | 28 Apr 2021 | ||
| 2.5 | 11 Jul 2017 | 11 Jul 2017 | ||
| 8.1 | 07 Apr 2021 | 07 Apr 2021 | ||
| 2.1 | 20 Jul 2021 | 20 Jul 2021 | ||
| 21.04 | 28 Apr 2021 | 28 Apr 2021 | ||
| 1.0 | 27 Apr 2021 | 27 Apr 2021 |
パンフレット (1)
| Resource title | バージョン | Latest update | ||
|---|---|---|---|---|
| 11.19 | 27 Jul 2020 | 27 Jul 2020 |
ライセンス契約 (1)
| Resource title | バージョン | Latest update | ||
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| 6.16 | 15 Jul 2021 | 15 Jul 2021 |
