Product overview
概要
The B-L475E-IOT01A Discovery kit for IoT node allows users to develop applications with direct connection to cloud servers. The Discovery kit enables a wide diversity of applications by exploiting low-power communication, multiway sensing and Arm® Cortex® -M4 core-based STM32L4 Series features.The support for Arduino Uno V3 and PMOD connectivity provides unlimited expansion capabilities with a large choice of specialized add-on boards.
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All features
- Ultra-low-power STM32L4 Series MCUs based on Arm® Cortex®-M4 core with 1 Mbyte of Flash memory and 128 Kbytes of SRAM, in LQFP100 package
- 64-Mbit Quad-SPI (Macronix) Flash memory
- Bluetooth® V4.1 module (SPBTLE-RF)
- Sub-GHz (868 MHz or 915 MHz) low-power-programmable RF module (SPSGRF-868 or SPSGRF-915)
- 802.11 b/g/n compliant Wi-Fi® module from Inventek Systems (ISM43362-M3G-L44)
- Dynamic NFC tag based on M24SR with its printed NFC antenna
- 2 digital omnidirectional microphones (MP34DT01)
- Capacitive digital sensor for relative humidity and temperature (HTS221)
- High-performance 3-axis magnetometer (LIS3MDL)
- 3D accelerometer and 3D gyroscope (LSM6DSL)
- 260-1260 hPa absolute digital output barometer (LPS22HB)
- Time-of-Flight and gesture-detection sensor (VL53L0X)
- 2 push-buttons (user and reset)
- USB OTG FS with Micro-AB connector
- Expansion connectors:
- Arduino™ Uno V3
- PMOD
- Flexible power-supply options:
- ST LINK USB VBUS or external sources
- On-board ST-LINK/V2-1 debugger/programmer with USB re-enumeration capability: mass storage, Virtual COM port and debug port
- Comprehensive free software HAL library including a variety of examples, as part of the STM32Cube MCU Package
- Support of a wide choice of Integrated Development Environments (IDEs) including IAR™, Keil®, GCC-based IDEs, Arm® Mbed Enabled™
- Arm® Mbed™ online (see http://mbed.org)
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注目ビデオ
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Utilities (1)
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品質 & 信頼性
製品型番 | Marketing Status | RoHSコンプライアンスグレード | 材料宣誓書** |
---|---|---|---|
B-L475E-IOT01A1 |
量産中
|
Ecopack1 |
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B-L475E-IOT01A2 |
量産中
|
Ecopack1 |
|
B-L475E-IOT01A1
Package:
Ecopack1Material Declaration**:
B-L475E-IOT01A2
Package:
Ecopack1Material Declaration**:
(**) st.comで提供している材料宣誓書は、パッケージ・ファミリ内で最も一般的に使用されているパッケージに基づく汎用ドキュメントの場合があります。そのため、特定の製品では100%正確ではない可能性があります。特定の製品情報については、セールスサポートまでお問い合わせください
サンプル & 購入
製品型番 | 販売代理店から購入 | STから購入 | コア製品 | 製品ステータス | サプライヤ | ECCN (US) | ECCN (EU) | Specific features | Country of Origin | WEEE Compliant | Budgetary Price (US$)*/Qty | |
---|---|---|---|---|---|---|---|---|---|---|---|---|
B-L475E-IOT01A1 | 1 distributors | STM32L475VG |
量産中
|
ST | 5A992C | 5A002A2 | Sub-GHz (915 MHz) RF module | CHINA | true | 53.0 / 1 | ||
B-L475E-IOT01A2 | 4 distributors | STM32L475VG |
量産中
|
ST | 5A992C | 5A002A2 | Sub-GHz (868 MHz) RF module | CHINA | true | 53.0 / 1 |
コア製品
STM32L475VG製品ステータス
量産中Budgetary Price (US$)*/Qty
53.0 / 1コア製品
STM32L475VG製品ステータス
量産中Budgetary Price (US$)*/Qty
53.0 / 1(*)概算用の希望小売単価(US$)です。現地通貨でのお見積りについては、STのセールス・オフィスまたは販売代理店までお問い合わせください。