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The enhanced embedded sensor topology of the STREF-MKI128V6 MEMS sensor module helps you save development time and effort for your applications. This compact board integrates the iNEMO inertial module (LSM6DSM) with 3D accelerometer and 3D gyroscope that is particularly suitable for smartphones with OIS/ EIS and AR/VR systems, a magnetometer (LIS2MDL), a dust-resistant full-mold absolute pressure sensor (LPS22HB), and a relative humidity and temperature sensor (HTS221).
主な特徴
- The board integrates:
- iNEMO inertial module LSM6DSM
- Magnetometer LIS2MDL
- Pressor sensor LPS22HB
- Relative Humidity and temperature sensor HTS221
- WEEE compliant
- RoHS compliant
- The board integrates:
サンプル & 購入
| 製品型番 | コア製品 | 製品ステータス | 概算価格（USS） | 数量 | ECCN (US) | Country of Origin | 販売代理店からオーダー | STからオーダー |
|---|---|---|---|---|---|---|---|---|
| STREF-MKI128V6 | LSM6DSM, LIS2MDL, LPS22HB, HTS221 | アクティブ | - | - | - | - | 販売代理店に在庫がない場合は、STのセールスオフィスまでお問い合わせください |
STREF-MKI128V6
コア製品
LSM6DSM, LIS2MDL, LPS22HB, HTS221製品ステータス
アクティブUnit Price (US$)
*(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
| 製品型番 | 製品ステータス | パッケージ | グレード | RoHSコンプライアンスグレード | WEEE Compliant | Material Declaration** |
|---|---|---|---|---|---|---|
| STREF-MKI128V6 | アクティブ | CARD | インダストリアル | - | - | |
STREF-MKI128V6
Package:
CARDMaterial Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
