The H3LIS331DL is a low-power high-performance 3-axis linear accelerometer belonging to the “nano” family, with digital I2C/SPI serial interface standard output.
The device features ultra-low power operational modes that allow advanced power saving and smart sleep-to-wakeup functions.
The H3LIS331DL has dynamically user-selectable full scales of ±100g/±200g/±400g and it is capable of measuring accelerations with output data rates from 0.5 Hz to 1 kHz.
The H3LIS331DL is available in a small thin plastic land grid array package (LGA) and it is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.
|DS9012: MEMS motion sensor: low-power high-g 3-axis digital accelerometer||3.0||804.23 KB|
|TN0018: Surface mounting guidelines for MEMS sensors in an LGA package||6.0||214.31 KB|
|DT0105: 1-point or 3-point tumble sensor calibration||1.0||148.7 KB|
|DT0053: 6-point tumble sensor calibration||1.0||464.9 KB|
|DT0076: Compensating for accelerometer installation error: zeroing pitch and roll for a reference orientation||1.0||490.58 KB|
|DT0126: Low-power application design with ST's MEMS accelerometers||1.0||184.68 KB|
|DT0106: Residual linear acceleration by gravity subtraction to enable dead-reckoning||1.0||192.08 KB|
|DT0127: ST's MEMS accelerometer sensor testing & self-test||1.1||409.32 KB|
|Industrial MEMS motion sensors||1.0||659.27 KB|
|MEMS and Sensors Smart Motion tracking, IoT and enhanced user experience||1.0||1.91 MB|
|Sensor & motion algorithm software pack for STM32Cube||1.0||675.19 KB|
|Sensors for industrial and multi-segment solutions||1.0||1.77 MB|
|AUTO - International Journal of THE FIA, March 2013: Size matters. ST’s high-g accelerometer revolutionizes crash safety in Formula One racing||1.0||378.27 KB|
|Capacitive MEMS accelerometer for condition monitoring||1.0||3.35 MB|
|AWS IoT Core||AWS||AWS IoT Core is a managed cloud platform that lets connected devices easily and securely interact with cloud applications and other devices.|
|AZURE Cloud||Microsoft||Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.|
|Watson IoT Platform||IBM||IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.|
|Accel 3 click||MikroElektronika||Accel 3 click carries the H3LIS331DL a low-power high-performance 3-axis linear accelerometer. The click is designed to run on a 3.3V power supply. It communicates with the target microcontroller over SPI or I2C interface, with additional functionality provided by the INT pin on the mikroBUS™ line.|
|SensiBLE||SensiEDGE||Ready-to-use BLE System-on-Module packed with sensors, low power ARM® 32-bit Cortex®-M4 CPU and coin battery. Speed up IoT product development today!|
|SensiSUB||SensiEDGE||Connecting low-power SUB 1GHZ RF transceiver to the Cloud with fully customisable sensors, ARM® 32-bit Cortex®-M4 CPU and coin battery.|
|X-CUBE-MEMS-XT1||ST||Sensor and DSP algorithm software expansion for STM32Cube|
|AndroidHALInput||ST||Android sensor HAL for MEMS motion and environmental sensors (Input framework)|
|C-Driver-MEMS||ST||Standard C platform-independent drivers for MEMS motion and environmental sensors|
|LinuxDriverInput||ST||Linux device drivers for MEMS motion and environmental sensors (Input framework)|
|STEVAL-MKI153V1||ST||H3LIS331DL 3-axis digital accelerometer adapter board for standard DIL 24 socket, compatible with STEVAL-MKI109V2|
|Hardware and firmware design||SIANA Systems||Complete hardware and firmware design for all applications|
|SensiEDGE customization services||SensiEDGE||End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!|
|製品型番||パッケージ||Packing Type||Marketing Status||Unit Price (US$) *||数量||ECCN (US)||Country of Origin||More info||Order from ST||Order from Distributors|
|H3LIS331DLTR||LLGA 16 3x3x1.0||Tape And Reel||Active : Product is in volume production||5.5||1000||EAR99||-||MORE INFO||Free Sample 買い物かごに追加||DISTRIBUTOR AVAILABILITY|
|H3LIS331DL||LLGA 16 3x3x1.0||Tray||Active : Product is in volume production||5.5||1000||EAR99||-||MORE INFO||DISTRIBUTOR AVAILABILITY|
|製品型番||Marketing Status||パッケージ||RoHS Compliance Grade||Material Declaration**|
|H3LIS331DLTR||アクティブ||LLGA 16 3x3x1.0||Ecopack2|
|H3LIS331DL||アクティブ||LLGA 16 3x3x1.0||Ecopack2|
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.