The IIS3DHHC is an ultra-low noise, high-stability three-axis linear accelerometer.
The IIS3DHHC has a full scale of ±2.5 g and is capable of providing the measured accelerations to the application through an SPI 4-wire digital interface.
The sensing element is manufactured using a dedicated micromachining process developed by STMicroelectronics to produce inertial sensors and actuators on silicon wafers.
The IC interface is manufactured using a CMOS process that allows a high level of integration to design a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The IIS3DHHC is available in a high-performance (low-stress) ceramic cavity land grid array (CC LGA) package and can operate within a temperature range of -40 °C to +85 °C.
|DS12292: High-resolution, high-stability 3-axis digital accelerometer||2.0||649.75 KB|
|AN5146: IIS3DHHC: high-resolution, high-stability 3-axis digital accelerometer||2.0||411.03 KB|
|AN4509: Tilt measurement using a low-g 3-axis accelerometer||1.1||248.93 KB|
|TN0018: Surface mounting guidelines for MEMS sensors in an LGA package||6.0||214.31 KB|
|DT0105: 1-point or 3-point tumble sensor calibration||1.0||148.7 KB|
|DT0053: 6-point tumble sensor calibration||1.0||464.9 KB|
|DT0126: Low-power application design with ST's MEMS accelerometers||1.0||184.68 KB|
|DT0106: Residual linear acceleration by gravity subtraction to enable dead-reckoning||1.0||192.08 KB|
|DT0127: ST's MEMS accelerometer sensor testing & self-test||1.1||409.32 KB|
|Industrial MEMS motion sensors||1.0||659.27 KB|
|MEMS and Sensors Smart Motion tracking, IoT and enhanced user experience||1.0||1.91 MB|
|Sensor & motion algorithm software pack for STM32Cube||1.0||675.19 KB|
|Sensors for industrial and multi-segment solutions||1.0||1.77 MB|
|Capacitive MEMS accelerometer for condition monitoring||1.0||3.35 MB|
|AWS IoT Core||AWS||AWS IoT Core is a managed cloud platform that lets connected devices easily and securely interact with cloud applications and other devices.|
|AZURE Cloud||Microsoft||Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.|
|Watson IoT Platform||IBM||IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.|
|SensiBLE||SensiEDGE||Ready-to-use BLE System-on-Module packed with sensors, low power ARM® 32-bit Cortex®-M4 CPU and coin battery. Speed up IoT product development today!|
|SensiSUB||SensiEDGE||Connecting low-power SUB 1GHZ RF transceiver to the Cloud with fully customisable sensors, ARM® 32-bit Cortex®-M4 CPU and coin battery.|
|AndroidHAL-IIO||ST||Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)|
|AndroidHALInput||ST||Android sensor HAL for MEMS motion and environmental sensors (Input framework)|
|C-Driver-MEMS||ST||Standard C platform-independent drivers for MEMS motion and environmental sensors|
|LinuxDriverIIO||ST||Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework)|
|LinuxDriverInput||ST||Linux device drivers for MEMS motion and environmental sensors (Input framework)|
|STEVAL-MKI186V1||ST||IIS3DHHC adapter board for a standard DIL 24 socket|
|Hardware and firmware design||SIANA Systems||Complete hardware and firmware design for all applications|
|SensiEDGE customization services||SensiEDGE||End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!|
|製品型番||パッケージ||Packing Type||Marketing Status||Unit Price (US$) *||数量||ECCN (US)||Country of Origin||More info||Order from ST||Order from Distributors|
|IIS3DHHCTR||LGA 5X5X1.7 16LD CERAMIC CAVITY||Tape And Reel||Active : Product is in volume production||5.5||1000||EAR99||-||MORE INFO||Free Sample 買い物かごに追加||DISTRIBUTOR AVAILABILITY|
|製品型番||Marketing Status||パッケージ||RoHS Compliance Grade||Material Declaration**|
|IIS3DHHCTR||アクティブ||LGA 5X5X1.7 16LD CERAMIC CAVITY||Ecopack2|
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.