The LIS3DSH is an ultra-low-power high-performance three-axis linear accelerometer belonging to the “nano” family with an embedded state machine that can be programmed to implement autonomous applications.
The LIS3DSH has dynamically selectable full scales of ±2g/±4g/±6g/±8g/±16g and is capable of measuring accelerations with output data rates from 3.125 Hz to 1.6 kHz.
The self-test capability allows the user to check the functioning of the sensor in the final application.
The device can be configured to generate interrupt signals activated by user-defined motion patterns.
The LIS3DSH has an integrated first-in, first-out (FIFO) buffer allowing the user to store data in order to limit intervention by the host processor.
The LIS3DSH is available in a small thin plastic land grid array package (LGA) and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.
|DS8721: MEMS digital output motion sensor: ultra-low-power high-performance three-axis “nano” accelerometer||3.0||933.89 KB|
|AN3393: LIS3DSH: 3-axis digital output accelerometer||5.0||2.52 MB|
|AN4508: 低G3軸加速度センサのパラメータとキャリブレーション||1.0||332.97 KB|
|AN4509: Tilt measurement using a low-g 3-axis accelerometer||1.1||248.93 KB|
|TN0018: Surface mounting guidelines for MEMS sensors in an LGA package||6.0||214.31 KB|
|DT0105: 1-point or 3-point tumble sensor calibration||1.0||148.7 KB|
|DT0053: 6-point tumble sensor calibration||1.0||464.9 KB|
|DT0011: Benefits in using FIFO buffer embedded in ST MEMS sensors||1.0||618.26 KB|
|DT0126: Low-power application design with ST's MEMS accelerometers||1.0||184.68 KB|
|DT0106: Residual linear acceleration by gravity subtraction to enable dead-reckoning||1.0||192.08 KB|
|DT0127: ST's MEMS accelerometer sensor testing & self-test||1.1||409.32 KB|
|3-axis digital accelerometers for smarter, easier-to-use and energy-efficient portable devices||2.0||891.61 KB|
|MEMS and Sensors Smart Motion tracking, IoT and enhanced user experience||1.0||1.91 MB|
|Peripheral semiconductors for set-top box applications||4.3||633.85 KB|
|Sensor & motion algorithm software pack for STM32Cube||1.0||675.19 KB|
|Capacitive MEMS accelerometer for condition monitoring||1.0||3.35 MB|
|AWS IoT Core||AWS||AWS IoT Core is a managed cloud platform that lets connected devices easily and securely interact with cloud applications and other devices.|
|AZURE Cloud||Microsoft||Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.|
|Watson IoT Platform||IBM||IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.|
|Accel2 click||MikroElektronika||Accel 2 click carries ST's LIS3DSH IC, a low-power factory-calibrated three-axis accelerometer which embeds a FIFO buffer and two programmable state machines.|
|SensiBLE||SensiEDGE||Ready-to-use BLE System-on-Module packed with sensors, low power ARM® 32-bit Cortex®-M4 CPU and coin battery. Speed up IoT product development today!|
|SensiSUB||SensiEDGE||Connecting low-power SUB 1GHZ RF transceiver to the Cloud with fully customisable sensors, ARM® 32-bit Cortex®-M4 CPU and coin battery.|
|STEVAL-MKI134V1||LIS3DSH adapter board for standard DIL24 socket|
|Hardware and firmware design||SIANA Systems||Complete hardware and firmware design for all applications|
|SensiEDGE customization services||SensiEDGE||End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!|
|製品型番||パッケージ||Packing Type||Marketing Status||Unit Price (US$) *||数量||ECCN (US)||Country of Origin||More info||Order from ST||Order from Distributors|
|LIS3DSHTR||LLGA 16 3x3x1.0||Tape And Reel||Active : Product is in volume production||0.832||1000||EAR99||-||MORE INFO||Free Sample 買い物かごに追加||DISTRIBUTOR AVAILABILITY|
|製品型番||Marketing Status||パッケージ||RoHS Compliance Grade||Material Declaration**|
|LIS3DSHTR||アクティブ||LLGA 16 3x3x1.0||Ecopack2|
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.