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The STM32MP153C devices are based on the high-performance dual-core Arm® Cortex®-A7 32-bit RISC core operating at up to 650 MHz. The Cortex-A7 processor includes a 32-Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU and a 256-Kbyte level2 cache. The Cortex-A7 processor is a very energy-efficient application processor designed to provide rich performance in high-end wearables, and other low-power embedded and consumer applications. It provides up to 20% more single thread performance than the Cortex-A5 and provides similar performance than the Cortex-A9.
The Cortex-A7 incorporates all features of the high-performance Cortex-A15 and Cortex-A17 processors, including virtualization support in hardware, NEON™, and 128-bit AMBA®4 AXI bus interface.
The STM32MP153C devices also embed a Cortex® -M4 32-bit RISC core operating at up to 209 MHz frequency. Cortex-M4 core features a floating point unit (FPU) single precision which supports Arm® single-precision data-processing instructions and data types. The Cortex® -M4 supports a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
The STM32MP153C devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16 or 32-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz.
The STM32MP153C devices incorporate high-speed embedded memories with 708 Kbytes of Internal SRAM (including 256 Kbytes of AXI SYSRAM, 3 banks of 128 Kbytes each of AHB SRAM, 64 Kbytes of AHB SRAM in backup domain and 4 Kbytes of SRAM in backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, a 32-bit multi-AHB bus matrix and a 64-bit multi layer AXI interconnect supporting internal and external memories access.
All the devices offer two ADCs, two DACs, a low-power RTC, 12 general-purpose 16-bit timers, two PWM timers for motor control, five low-power timers, a true random number generator (RNG), and a cryptographic acceleration cell. The devices support six digital filters for external sigma delta modulators (DFSDM). They also feature standard and advanced communication interfaces.主な特徴
- コア
- 32-bit dual-core Arm® Cortex®-A7
- L1 32-Kbyte I / 32-Kbyte D for each core
- 256-Kbyte unified level 2 cache
- Arm® NEON™ and Arm® TrustZone®
- 32-bit Arm® Cortex®-M4 with FPU/MPU
- Up to 209 MHz (Up to 703 CoreMark®)
- 32-bit dual-core Arm® Cortex®-A7
- Memories
- External DDR memory up to 1 Gbyte
- up to LPDDR2/LPDDR3-1066 16/32-bit
- up to DDR3/DDR3L-1066 16/32-bit
- 708 Kbytes of internal SRAM: 256 Kbytes of AXI SYSRAM + 384 Kbytes of AHB SRAM + 64 Kbytes of AHB SRAM in Backup domain and 4 Kbytes of SRAM in Backup domain
- Dual mode Quad-SPI memory interface
- Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs and SLC NAND memories with up to 8-bit ECC
- External DDR memory up to 1 Gbyte
- Security/safety
- Secure boot, TrustZone® peripherals, active tamper
- Cortex®-M4 resources isolation
- Reset and power management
- 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
- POR, PDR, PVD and BOR
- On-chip LDOs (RETRAM, BKPSRAM, USB 1.8 V, 1.1 V)
- Backup regulator (~0.9 V)
- Internal temperature sensors
- Low-power modes: Sleep, Stop and Standby
- LPDDR2/3 retention in Standby mode
- Controls for PMIC companion chip
- Low-power consumption
- Total current consumption down to 2 µA (Standby mode, no RTC, no LSE, no BKPSRAM, no RETRAM)
- Clock management
- Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator
- External oscillators: 8-48 MHz HSE oscillator, 32.768 kHz LSE oscillator
- 5 × PLLs with fractional mode
- General-purpose input/outputs
- Up to 176 I/O ports with interrupt capability
- Up to 8 secure I/Os
- Up to 6 Wakeup, 3 tampers, 1 active tamper
- Up to 176 I/O ports with interrupt capability
- Interconnect matrix
- 2 bus matrices
- 64-bit Arm® AMBA® AXI interconnect, up to 266 MHz
- 32-bit Arm® AMBA® AHB interconnect, up to 209 MHz
- 2 bus matrices
- 3 DMA controllers to unload the CPU
- 48 physical channels in total
- 1 × high-speed general-purpose master direct memory access controller (MDMA)
- 2 × dual-port DMAs with FIFO and request router capabilities for optimal peripheral management
- Up to 37 communication peripherals
- 6 × I2C FM+ (1 Mbit/s, SMBus/PMBus)
- 4 × UART + 4 × USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI slave)
- 6 × SPI (50 Mbit/s, including 3 with full duplex I2S audio class accuracy via internal audio PLL or external clock)
- 4 × SAI (stereo audio: I2S, PDM, SPDIF Tx)
- SPDIF Rx with 4 inputs
- HDMI-CEC interface
- MDIO Slave interface
- 3 × SDMMC up to 8-bit (SD / e•MMC™/ SDIO)
- 2 × CAN controllers supporting CAN FD protocol, out of which one supports time-triggered CAN (TTCAN)
- 2 × USB 2.0 high-speed Host+ 1 × USB 2.0 full-speed OTG simultaneously
- or 1 × USB 2.0 high-speed Host+ 1 × USB 2.0 high-speed OTG simultaneously
- 10/100M or Gigabit Ethernet GMAC
- IEEE 1588v2 hardware, MII/RMII/GMII/RGMII
- 8- to 14-bit camera interface up to 140 Mbyte/s
- 6 analog peripherals
- 2 × ADCs with 16-bit max. resolution (12 bits up to 4.5 Msps, 14 bits up to 4 Msps, 16 bits up to 3.6 Msps)
- 1 × temperature sensor
- 2 × 12-bit D/A converters (1 MHz)
- 1 × digital filters for sigma delta modulator (DFSDM) with 8 channels/6 filters
- Internal or external ADC/DAC reference VREF+
- Graphics
- LCD-TFT controller, up to 24-bit // RGB888
- up to WXGA (1366 × 768) @60 fps
- Two layers with programmable colour LUT
- LCD-TFT controller, up to 24-bit // RGB888
- Up to 29 timers and 3 watchdogs
- 2 × 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
- 2 × 16-bit advanced motor control timers
- 10 × 16-bit general-purpose timers (including 2 basic timers without PWM)
- 5 × 16-bit low-power timers
- RTC with sub-second accuracy and hardware calendar
- 2 × 4 Cortex®-A7 system timers (secure, non-secure, virtual, hypervisor)
- 1 × SysTick M4 timer
- 3 × watchdogs (2 × independent and window)
- Hardware acceleration
- AES 128, 192, 256, TDES
- HASH (MD5, SHA-1, SHA224, SHA256), HMAC
- 2 × true random number generator (3 oscillators each)
- 2 × CRC calculation unit
- Debug mode
- Arm® CoreSight™ trace and debug: SWD and JTAG interfaces
- 8-Kbyte embedded trace buffer
- 3072-bit fuses including 96-bit unique ID, up to 1184-bit available for user
- All packages are ECOPACK2 compliant
- コア
回路ダイアグラム

サンプル & 購入
製品型番 | パッケージ | 梱包タイプ | 製品ステータス | Junction Temperature (°C) (min) | Junction Temperature (°C) (max) | 概算価格(USS) | 数量 | ECCN (US) | Country of Origin | 詳細 | 販売代理店からオーダー | STからオーダー |
---|---|---|---|---|---|---|---|---|---|---|---|---|
STM32MP153CAC3T | TFBGA361 | Tape And Reel | アクティブ | -40 | 125 | 7.94 | 10000 | 5A992C | - | 販売代理店に在庫がない場合は、STのセールスオフィスまでお問い合わせください | ||
STM32MP153CAA3T | LFBGA448 | Tape And Reel | アクティブ | -40 | 125 | 8.82 | 10000 | 5A992C | - | 販売代理店に在庫がない場合は、STのセールスオフィスまでお問い合わせください | ||
STM32MP153CAD3T | TFBGA257 | Tape And Reel | アクティブ | -40 | 125 | 7.64 | 10000 | 5A992C | - | 在庫チェック | ||
STM32MP153CAD3 | TFBGA257 | Tray | アクティブ | -40 | 125 | 7.64 | 10000 | 5A992C | - | 在庫チェック | 購入 | |
STM32MP153CAA3 | LFBGA448 | Tray | アクティブ | -40 | 125 | 8.82 | 10000 | 5A992C | - | 在庫チェック | 購入 | |
STM32MP153CAB3T | LFBGA354 | Tape And Reel | アクティブ | -40 | 125 | 8.02 | 10000 | 5A992C | - | 販売代理店に在庫がない場合は、STのセールスオフィスまでお問い合わせください | ||
STM32MP153CAC3 | TFBGA361 | Tray | アクティブ | -40 | 125 | 7.94 | 10000 | 5A992C | - | 在庫チェック | 購入 | |
STM32MP153CAB3 | LFBGA354 | Tray | アクティブ | -40 | 125 | 8.02 | 10000 | 5A992C | - | 在庫チェック | 購入 |
STM32MP153CAC3T
パッケージ
TFBGA361梱包タイプ
Tape And ReelUnit Price (US$)
7.94*STM32MP153CAA3T
パッケージ
LFBGA448梱包タイプ
Tape And ReelUnit Price (US$)
8.82*STM32MP153CAD3T
パッケージ
TFBGA257梱包タイプ
Tape And ReelUnit Price (US$)
7.64*STM32MP153CAB3T
パッケージ
LFBGA354梱包タイプ
Tape And ReelUnit Price (US$)
8.02*(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
ビデオ
We asked Sylvain the following questions: - Could you please tell me about the STM32MP1 ? - STM32MP1: ideal for what kind of application? - Why is the STM32MP1 so special? - What ecosystem does the STM32MP1 come with? - Is the STM32MP1 available? - Could we see a quick demo? - Where to get more info?
Introducing our STM32MP1 microprocessor series with dual Arm® Cortex®-A7 and Cortex®-M4
Introducing our STM32MP1 microprocessor series with dual Arm® Cortex®-A7 and Cortex®-M4 Cores
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製品型番 | 製品ステータス | パッケージ | グレード | RoHSコンプライアンスグレード | Material Declaration** |
---|---|---|---|---|---|
STM32MP153CAA3 | アクティブ | LFBGA448 | インダストリアル | Ecopack2 | |
STM32MP153CAA3T | アクティブ | LFBGA448 | インダストリアル | Ecopack2 | |
STM32MP153CAB3 | アクティブ | LFBGA354 | インダストリアル | Ecopack2 | |
STM32MP153CAB3T | アクティブ | LFBGA354 | インダストリアル | Ecopack2 | |
STM32MP153CAC3 | アクティブ | TFBGA361 | インダストリアル | Ecopack2 | |
STM32MP153CAC3T | アクティブ | TFBGA361 | インダストリアル | Ecopack2 | |
STM32MP153CAD3 | アクティブ | TFBGA257 | インダストリアル | Ecopack2 | |
STM32MP153CAD3T | アクティブ | TFBGA257 | インダストリアル | Ecopack2 |
STM32MP153CAC3
Package:
TFBGA361Material Declaration**:
STM32MP153CAC3T
Package:
TFBGA361Material Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.