MPU with Arm Dual Cortex-A7 650 MHz, Arm Cortex-M4 real-time coprocessor, 3D GPU, TFT/MIPI DSI displays, FD-CAN, Secure boot and Cryptography

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  • 主な特徴

    • Core
      • 32-bit dual-core Arm® Cortex®-A7
        • L1 32-Kbyte I / 32-Kbyte D for each core
        • 256-Kbyte unified level 2 cache
        • Arm® NEON™ and Arm® TrustZone®
      • 32-bit Arm® Cortex®-M4 with FPU/MPU
        • Up to 209 MHz (Up to 703 CoreMark®)
    • Memories
      • External DDR memory up to 1 Gbyte
        • up to LPDDR2/LPDDR3-1066 16/32-bit
        • up to DDR3/DDR3L-1066 16/32-bit
      • 708 Kbytes of internal SRAM: 256 Kbytes of AXI SYSRAM + 384 Kbytes of AHB SRAM + 64 Kbytes of AHB SRAM in Backup domain and 4 Kbytes of SRAM in Backup domain
      • Dual mode Quad-SPI memory interface
      • Flexible external memory controller with up to 16-bit data bus: parallel interface to connect external ICs and SLC NAND memories with up to 8-bit ECC
    • Security/safety
      • Secure boot, TrustZone® peripherals, active tamper
      • Cortex®-M4 resources isolation
    • Reset and power management
      • 1.71 V to 3.6 V I/Os supply (5 V-tolerant I/Os)
      • POR, PDR, PVD and BOR
      • On-chip LDOs (RETRAM, BKPSRAM, DSI 1.2 V, USB 1.8 V, 1.1 V)
      • Backup regulator (~0.9 V)
      • Internal temperature sensors
      • Low-power modes: Sleep, Stop and Standby
      • LPDDR2/3 retention in Standby mode
      • Controls for PMIC companion chip
    • Low-power consumption
      • Total current consumption down to 2 µA (Standby mode, no RTC, no LSE, no BKPSRAM, no RETRAM)
    • Clock management
      • Internal oscillators: 64 MHz HSI oscillator, 4 MHz CSI oscillator, 32 kHz LSI oscillator
      • External oscillators: 8-48 MHz HSE oscillator, 32.768 kHz LSE oscillator
      • 6 × PLLs with fractional mode
    • General-purpose input/outputs
      • Up to 176 I/O ports with interrupt capability
        • Up to 8 secure I/Os
        • Up to 6 Wakeup, 3 tampers, 1 active tamper
    • Interconnect matrix
      • 2 bus matrices
        • 64-bit Arm® AMBA® AXI interconnect, up to 266 MHz
        • 32-bit Arm® AMBA® AHB interconnect, up to 209 MHz
    • 3 DMA controllers to unload the CPU
      • 48 physical channels in total
      • 1 × high-speed general-purpose master direct memory access controller (MDMA)
      • 2 × dual-port DMAs with FIFO and request router capabilities for optimal peripheral management
    • Up to 37 communication peripherals
      • 6 × I2C FM+ (1 Mbit/s, SMBus/PMBus)
      • 4 × UART + 4 × USART (12.5 Mbit/s, ISO7816 interface, LIN, IrDA, SPI slave)
      • 6 × SPI (50 Mbit/s, including 3 with full duplex I2S audio class accuracy via internal audio PLL or external clock)
      • 4 × SAI (stereo audio: I2S, PDM, SPDIF Tx)
      • SPDIF Rx with 4 inputs
      • HDMI-CEC interface
      • MDIO Slave interface
      • 3 × SDMMC up to 8-bit (SD / e•MMC™ / SDIO)
      • 2 × CAN controllers supporting CAN FD protocol, out of which one supports time-triggered CAN (TTCAN)
      • 2 × USB 2.0 high-speed Host+ 1 × USB 2.0 full-speed OTG simultaneously
        • or 1 × USB 2.0 high-speed Host+ 1 × USB 2.0 high-speed OTG simultaneously
      • 10/100M or Gigabit Ethernet GMAC
        • IEEE 1588v2 hardware, MII/RMII/GMII/RGMII
      • 8- to 14-bit camera interface up to 140 Mbyte/s
    • 6 analog peripherals
      • 2 × ADCs with 16-bit max. resolution (12 bits up to 4.5 Msps, 14 bits up to 4 Msps, 16 bits up to 3.6 Msps)
      • 1 × temperature sensor
      • 2 × 12-bit D/A converters (1 MHz)
      • 1 × digital filters for sigma delta modulator (DFSDM) with 8 channels/6 filters
      • Internal or external ADC/DAC reference VREF+
    • Graphics
      • 3D GPU: Vivante® - OpenGL® ES 2.0
        • Up to 26 Mtriangle/s, 133 Mpixel/s
      • LCD-TFT controller, up to 24-bit // RGB888
        • up to WXGA (1366 × 768) @60 fps
        • Two layers with programmable colour LUT
      • MIPI® DSI 2 data lanes up to 1 GHz each
    • Up to 29 timers and 3 watchdogs
      • 2 × 32-bit timers with up to 4 IC/OC/PWM or pulse counter and quadrature (incremental) encoder input
      • 2 × 16-bit advanced motor control timers
      • 10 × 16-bit general-purpose timers (including 2 basic timers without PWM)
      • 5 × 16-bit low-power timers
      • RTC with sub-second accuracy and hardware calendar
      • 2 × 4 Cortex®-A7 system timers (secure, non-secure, virtual, hypervisor)
      • 1 × SysTick M4 timer
      • 3 × watchdogs (2 × independent and window)
    • Hardware acceleration
      • AES 128, 192, 256, TDES
      • HASH (MD5, SHA-1, SHA224, SHA256), HMAC
      • 2 × true random number generator (3 oscillators each)
      • 2 × CRC calculation unit
    • Debug mode
      • Arm® CoreSight™ trace and debug: SWD and JTAG interfaces
      • 8-Kbyte embedded trace buffer
    • 3072-bit fuses including 96-bit unique ID, up to 1184-bit available for user
    • All packages are ECOPACK2 compliant

回路ダイアグラム

サンプル & 購入

製品型番
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製品ステータス
Junction Temperature (°C) (min)
Junction Temperature (°C) (max)
概算価格(USS)
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ECCN (US)
詳細
販売代理店からオーダー
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STM32MP157CAC3 TFBGA361 Tray
Active
-40 125 9.8 10000 5A992C
詳細情報

Country of Origin:

-

在庫チェック

Distributor availability ofSTM32MP157CAC3

代理店名
地域 在庫 最小発注 Third party link
ARROW EUROPE 378 0 Order Now

代理店レポートによる在庫データ: 2019-09-20

代理店名

ARROW

在庫

378

Min.Order

0

地域

EUROPE Order Now

代理店レポートによる在庫データ: 2019-09-20

STM32MP157CAD3 TFBGA257 Tray
Active
-40 125 9.5 10000 5A992C
詳細情報

Country of Origin:

-

在庫チェック

Distributor availability ofSTM32MP157CAD3

代理店名
地域 在庫 最小発注 Third party link
ARROW EUROPE 1104 0 Order Now

代理店レポートによる在庫データ: 2019-09-20

代理店名

ARROW

在庫

1104

Min.Order

0

地域

EUROPE Order Now

代理店レポートによる在庫データ: 2019-09-20

STM32MP157CAC3T TFBGA361 Tape And Reel
Active
-40 125 9.8 10000 5A992C
詳細情報

Country of Origin:

-

No availability of distributors reported, please contact our sales office
STM32MP157CAA3 LFBGA448 Tray
Active
-40 125 11.4 10000 5A992C
詳細情報

Country of Origin:

-

No availability of distributors reported, please contact our sales office
STM32MP157CAB3T LFBGA354 Tape And Reel
Active
-40 125 10.6 10000 5A992C
詳細情報

Country of Origin:

-

No availability of distributors reported, please contact our sales office
STM32MP157CAB3 LFBGA354 Tray
Active
-40 125 10.6 10000 5A992C
詳細情報

Country of Origin:

-

No availability of distributors reported, please contact our sales office
STM32MP157CAD3T TFBGA257 Tape And Reel
Active
-40 125 9.5 10000 5A992C
詳細情報

Country of Origin:

-

No availability of distributors reported, please contact our sales office
STM32MP157CAA3T LFBGA448 Tape And Reel
Active
-40 125 11.4 10000 5A992C
詳細情報

Country of Origin:

-

No availability of distributors reported, please contact our sales office

STM32MP157CAC3

パッケージ

TFBGA361

梱包タイプ

Tray

Unit Price (US$)

9.8*

Distributor availability ofSTM32MP157CAC3

代理店名
地域 在庫 最小発注 Third party link
ARROW EUROPE 378 0 Order Now

代理店レポートによる在庫データ: 2019-09-20

代理店名

ARROW

在庫

378

Min.Order

0

地域

EUROPE Order Now

代理店レポートによる在庫データ: 2019-09-20

製品ステータス

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

9.8

数量

10000

ECCN (US)

5A992C

Country of Origin

-

STM32MP157CAD3

パッケージ

TFBGA257

梱包タイプ

Tray

Unit Price (US$)

9.5*

Distributor availability ofSTM32MP157CAD3

代理店名
地域 在庫 最小発注 Third party link
ARROW EUROPE 1104 0 Order Now

代理店レポートによる在庫データ: 2019-09-20

代理店名

ARROW

在庫

1104

Min.Order

0

地域

EUROPE Order Now

代理店レポートによる在庫データ: 2019-09-20

製品ステータス

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

9.5

数量

10000

ECCN (US)

5A992C

Country of Origin

-

STM32MP157CAC3T

パッケージ

TFBGA361

梱包タイプ

Tape And Reel

Unit Price (US$)

9.8*

製品ステータス

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

9.8

数量

10000

ECCN (US)

5A992C

Country of Origin

-

STM32MP157CAA3

パッケージ

LFBGA448

梱包タイプ

Tray

Unit Price (US$)

11.4*

製品ステータス

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

11.4

数量

10000

ECCN (US)

5A992C

Country of Origin

-

STM32MP157CAB3T

パッケージ

LFBGA354

梱包タイプ

Tape And Reel

Unit Price (US$)

10.6*

製品ステータス

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

10.6

数量

10000

ECCN (US)

5A992C

Country of Origin

-

STM32MP157CAB3

パッケージ

LFBGA354

梱包タイプ

Tray

Unit Price (US$)

10.6*

製品ステータス

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

10.6

数量

10000

ECCN (US)

5A992C

Country of Origin

-

STM32MP157CAD3T

パッケージ

TFBGA257

梱包タイプ

Tape And Reel

Unit Price (US$)

9.5*

製品ステータス

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

9.5

数量

10000

ECCN (US)

5A992C

Country of Origin

-

STM32MP157CAA3T

パッケージ

LFBGA448

梱包タイプ

Tape And Reel

Unit Price (US$)

11.4*

製品ステータス

Active

Junction Temperature (°C) (min)

-40

Junction Temperature (°C) (max)

125

Unit Price (US$)

11.4

数量

10000

ECCN (US)

5A992C

Country of Origin

-

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

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評価ツール

サポート & アプリケーション

00 ファイルがダウンロード用に選択されています

技術文書

    • 概要 バージョン サイズ アクション
      DS12505
      Arm® dual Cortex®-A7 650 MHz + Cortex®-M4 MPU, 3D GPU, TFT/DSI, 37 comm. interfaces, 29 timers, adv. analog, crypto
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      3.32 MB
      PDF
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      Arm® dual Cortex®-A7 650 MHz + Cortex®-M4 MPU, 3D GPU, TFT/DSI, 37 comm. interfaces, 29 timers, adv. analog, crypto

    • 概要 バージョン サイズ アクション
      AN5168
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      1.0
      374.96 KB
      PDF
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      Getting started with STM32MP1 Series hardware development
      1.0
      1.86 MB
      PDF
      AN4803
      High-speed SI simulations using IBIS and board-level simulations using HyperLynx® SI on STM32 MCUs and MPUs
      2.0
      2.1 MB
      PDF
      AN5027
      Interfacing PDM digital microphones using STM32 MCUs and MPUs
      2.0
      1.83 MB
      PDF
      AN5253
      Migrating from STM32F469/479 line to STM32MP151, STM32MP153 and STM32MP157 lines
      1.0
      206.89 KB
      PDF
      AN5122
      STM32MP1 Series DDR memory routing guidelines
      3.0
      734.71 KB
      PDF
      AN5284
      STM32MP1 Series system power consumption
      1.0
      223.69 KB
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      AN5109
      STM32MP1 Series using low-power modes
      3.0
      1.11 MB
      PDF
      AN5256
      STM32MP151, STM32MP153 and STM32MP157 discrete power supply hardware integration
      1.0
      700.33 KB
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      AN5036
      Thermal management guidelines for STM32 applications
      3.0
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      AN5225
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      Getting started with STM32MP1 Series hardware development

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      High-speed SI simulations using IBIS and board-level simulations using HyperLynx® SI on STM32 MCUs and MPUs

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      Interfacing PDM digital microphones using STM32 MCUs and MPUs

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      Migrating from STM32F469/479 line to STM32MP151, STM32MP153 and STM32MP157 lines

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      STM32MP1 Series DDR memory routing guidelines

      AN5284

      STM32MP1 Series system power consumption

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      STM32MP1 Series using low-power modes

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      STM32MP151, STM32MP153 and STM32MP157 discrete power supply hardware integration

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      RM0436
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製品型番 製品ステータス パッケージ グレード RoHSコンプライアンスグレード 材料宣誓書**
STM32MP157CAA3
Active
LFBGA448 インダストリアル Ecopack2
STM32MP157CAA3T
Active
LFBGA448 インダストリアル Ecopack2
STM32MP157CAB3
Active
LFBGA354 インダストリアル Ecopack2
STM32MP157CAB3T
Active
LFBGA354 インダストリアル Ecopack2
STM32MP157CAC3
Active
TFBGA361 インダストリアル Ecopack2
STM32MP157CAC3T
Active
TFBGA361 インダストリアル Ecopack2
STM32MP157CAD3
Active
TFBGA257 インダストリアル Ecopack2
STM32MP157CAD3T
Active
TFBGA257 インダストリアル Ecopack2

STM32MP157CAA3

Package:

LFBGA448

Material Declaration**:

PDF XML

Marketing Status

Active

Package

LFBGA448

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP157CAA3T

Package:

LFBGA448

Material Declaration**:

PDF XML

Marketing Status

Active

Package

LFBGA448

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP157CAB3

Package:

LFBGA354

Material Declaration**:

PDF XML

Marketing Status

Active

Package

LFBGA354

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP157CAB3T

Package:

LFBGA354

Material Declaration**:

PDF XML

Marketing Status

Active

Package

LFBGA354

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP157CAC3

Package:

TFBGA361

Material Declaration**:

Marketing Status

Active

Package

TFBGA361

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP157CAC3T

Package:

TFBGA361

Material Declaration**:

Marketing Status

Active

Package

TFBGA361

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP157CAD3

Package:

TFBGA257

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TFBGA257

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STM32MP157CAD3T

Package:

TFBGA257

Material Declaration**:

PDF XML

Marketing Status

Active

Package

TFBGA257

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.