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	<title>STMicroelectronics News Release</title>
	<link>https://www.st.com/content/st_com/en/press-rss.html</link>
	<description>A Collection of STMicroelectronics News Release</description>
	<language>en</language>
	<lastBuildDate>Tue, 13 Oct 2026 22:40:04 +0200</lastBuildDate>
<item>
	<title><![CDATA[STMicroelectronics to propose the reappointment of Jean-Marc Chery as President & CEO]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM) announced today that its Supervisory Board has asked Jean-Marc Chery, ST’s President and CEO, to be available for a reappointment in his current role for an additional year. Jean-Marc Chery has accepted the proposal. The Supervisory Board will therefore propose to the shareholders adoption at the Company\'s 2027 Annual General Meeting of Shareholders, the reappointment for a one-year term of Jean-Marc Chery, as Chairman of the Managing Board and the Company\'s President and Chief Executive Officer. Mr. Chery’s leadership and vision, combined with a strong focus on execution, have provided ST with a clear strategic course supporting the continued development of ST’s value proposition, and a strong foundation for long-term value creation for ST and its stakeholders. The decision recognizes the importance of the continuity of ST’s strategy, execution discipline and the momentum achieved under Mr. Chery’s leadership. About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-to-propose-the-reappointment-of-jean-marc-chery-as-president-ceo-c3416.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Tue, 13 Oct 2026 06:01:03 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics announces status of common share repurchase program]]></title>
	<description><![CDATA[STMicroelectronics N.V. (the “Company” or “STMicroelectronics”), a global semiconductor leader serving customers across the spectrum of electronics applications, announces full details of its common share repurchase program (the “Program”) disclosed via a press release dated June 21, 2024. The Program was approved by a shareholder resolution dated May 22, 2024 and by the supervisory board. STMicroelectronics N.V. (registered with the trade register under number 33194537) (LEI: 213800Z8NOHIKRI42W10) announces the repurchase (by a broker acting for the Company) on the regulated market of Euronext Paris, in the period between October 05, 2026 to October 09, 2026 (the “Period”), of 346,538 ordinary shares (equal to 0.04% of its issued share capital) at the weighted average purchase price per share of EUR 49.2425 and for an overall price of EUR 17,064,401.16. The purpose of these transactions under article 5(2) of Regulation (EU) 596/2014 (the Market Abuse Regulation) was to meet obligations arising from share option programmes, or other allocations of shares, to employees or to members of the administrative, management or supervisory bodies of the issuer or of an associate company. The shares may be held in treasury prior to being used for such purpose and, to the extent that they are not ultimately needed for such purpose, they may be used for any other lawful purpose under article 5(2) of the Market Abuse Regulation. Below is a summary of the repurchase transactions made in the course of the Period in relation to the ordinary shares of STMicroelectronics (ISIN: NL0000226223), in detailed form. Transactions in Period Dates of transaction Number of shares purchased Weighted average purchase price per share (EUR) Total amount paid (EUR) Market on which the shares were bought (MIC code) 5-Oct-26 60,000 50.4548 3,027,288.00 XPAR 6-Oct-26 46,538 51.7449 2,408,104.16 XPAR 7-Oct-26 65,000 50.2872 3,268,668.00 XPAR 8-Oct-26 90,000 48.2588 4,343,292.00 XPAR 9-Oct-26 85,000 47.2594 4,017,049.00 XPAR Total for Period 346,538 49.2425 17,064,401.16 Following the share buybacks detailed above, the Company holds in total 15,930,103 treasury shares, which represents approximately 1.7% of the Company’s issued share capital. In accordance with Article 5(1)(b) of the Market Abuse Regulation and Article 2(3) of Commission Delegated Regulation (EU) 2016/1052, a full breakdown of the individual trades in the Program are disclosed on the ST website (https://investors.st.com/stock-and-bond-information/share-buyback). About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-announces-status-of-common-share-repurchase-program-c3415.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Share Repurchase]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Mon, 12 Oct 2026 13:21:52 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics announces status of common share repurchase program]]></title>
	<description><![CDATA[STMicroelectronics N.V. (the “Company” or “STMicroelectronics”), a global semiconductor leader serving customers across the spectrum of electronics applications, announces full details of its common share repurchase program (the “Program”) disclosed via a press release dated June 21, 2024. The Program was approved by a shareholder resolution dated May 22, 2024 and by the supervisory board. STMicroelectronics N.V. (registered with the trade register under number 33194537) (LEI: 213800Z8NOHIKRI42W10) announces the repurchase (by a broker acting for the Company) on the regulated market of Euronext Paris, in the period between September 28, 2026 to October 2, 2026 (the “Period”), of 310,000 ordinary shares (equal to 0.03% of its issued share capital) at the weighted average purchase price per share of EUR 47.1205 and for an overall price of EUR 14,607,365.00. The purpose of these transactions under article 5(2) of Regulation (EU) 596/2014 (the Market Abuse Regulation) was to meet obligations arising from share option programmes, or other allocations of shares, to employees or to members of the administrative, management or supervisory bodies of the issuer or of an associate company. The shares may be held in treasury prior to being used for such purpose and, to the extent that they are not ultimately needed for such purpose, they may be used for any other lawful purpose under article 5(2) of the Market Abuse Regulation. Below is a summary of the repurchase transactions made in the course of the Period in relation to the ordinary shares of STMicroelectronics (ISIN: NL0000226223), in detailed form. Transactions in Period Dates of transaction Number of shares purchased Weighted average purchase price per share (EUR) Total amount paid (EUR) Market on which the shares were bought (MIC code) 28-Sep-26 70,000 45.5195 3,186,365.00 XPAR 29-Sep-26 60,000 47.2025 2,832,150.00 XPAR 30-Sep-26 60,000 46.8866 2,813,196.00 XPAR 1-Oct-26 60,000 47.0945 2,825,670.00 XPAR 2-Oct-26 60,000 49.1664 2,949,984.00 XPAR Total for Period 310,000 47.1205 14,607,365.00 Following the share buybacks detailed above, the Company holds in total 15,583,565 treasury shares, which represents approximately 1.7% of the Company’s issued share capital. In accordance with Article 5(1)(b) of the Market Abuse Regulation and Article 2(3) of Commission Delegated Regulation (EU) 2016/1052, a full breakdown of the individual trades in the Program are disclosed on the ST website (https://investors.st.com/stock-and-bond-information/share-buyback). About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-announces-status-of-common-share-repurchase-program-c3414.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Share Repurchase]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Mon, 5 Oct 2026 13:00:31 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics announces timing for third quarter 2026 earnings release and conference call]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced that it will release third quarter 2026 earnings before the opening of trading on the European Stock Exchanges on October 29, 2026. The press release will be available immediately after the release on the Company’s website at www.st.com. STMicroelectronics will conduct a conference call with analysts, investors and reporters to discuss its third quarter 2026 financial results and current business outlook on October 29, 2026 at 9:30 a.m. Central European Time (CET) / 4:30 a.m. U.S. Eastern Time (ET). A live webcast (listen-only mode) of the conference call will be accessible at ST’s website, https://investors.st.com, and will be available for replay until November 13, 2026. About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-announces-timing-for-third-quarter-2026-earnings-release-and-conference-call-c3413.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Mon, 5 Oct 2026 07:00:59 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics delivers advanced context-aware sensors in ST Sustainable Technology framework]]></title>
	<description><![CDATA[STMicroelectronics’ newest miniature motion sensors feature enhanced precision for accurate event reconstruction while meeting the most stringent sustainable-materials standards. The new 6-axis sensors, or inertial measurement units (IMU), will be used in consumer devices like fitness trackers, smart tags, and professional applications such as industrial asset monitors, robots, and drone applications including photography and agricultural surveying. They are part of the ST Sustainable Technology initiative that drives responsible product development. Sensors that support event reconstruction let smart applications distinguish between different types of incidents, enhancing capabilities such as accident alerting, tool-usage monitoring, robot teaching, sports-performance analysis, and concussion detection. ST’s new IMUs, the consumer-oriented LSM6DSK320X and industrial-grade ISM6HGK256X, achieve this with an advanced super-symmetric gyroscope architecture that increases sensing precision, combined with precise accelerometer tracking across a wide dynamic range. These capabilities also enhance use cases such as drone-flight stabilization, structural-condition monitoring, and game controllers. “By maximizing the signal strength and resilience in an extremely compact form factor, the architecture of our latest 6-axis motion sensors will drive powerful new features in smart applications,” said Simone Ferri, Executive Vice President, MEMS Sub-Group, STMicroelectronics. “Moreover, meeting today’s leading sustainable-materials codes such as BPA-free, Pb-free and others helps smart-tech innovators address environmental and regulatory expectations as these become progressively tougher, encompassing additional classes of materials.” “ST’s new LSM6DSK320X sensor delivers unprecedented vibration immunity that we just had to integrate and take advantage of immediately in our ongoing reference platform development,” said Jay Blackman, Leader, Betaflight. “The LSM6DSK320X IMU is the new performance leader for smart and context-aware consumer technology, including UAVs,” said Dr. Zebo Zhou, Chief Technology Officer, Tianhe (Chengdu). \"Drone flight controllers place extremely demanding requirements on an IMU: the sensor must not saturate during aggressive maneuvers, must maintain low noise under severe vibrations, and must be compact and power efficient. Of all the available devices we have evaluated, ST’s LSM6DSK320X was the best match.” Further technical information: The super-symmetric architecture comprises two mirrored electromechanical structures, acting in counter-phase to each other, thereby cancelling the effects of external vibrations and shocks. Combined with a fully differential signal chain, this structure maximizes detected-signal strength and resilience. The internal structure is also extremely compact, enabling each IMU to contain one gyroscope with two separate accelerometers in a single package. The dual accelerometers allow simultaneous measurement of low-range disturbances up to ±16 g and high-g events up to ±320 g, ensuring these IMUs never miss an event. This contrasts with single-accelerometer IMUs that cannot perform measurements while switching between low-range and high-range modes. The consumer-oriented LSM6DSK320X and industrial-grade ISM6HGK256X also contain ST’s machine-learning core (MLC) that embeds AI processing directly in the sensor to reduce the application’s energy consumption and save system resources. Developers can leverage extra libraries including ST’s Motion XLF, and sensor-fusion and context-awareness software, in addition to basic libraries, that enhance power and flexibility to address diverse applications. The new IMUs are supported within the ST MEMS Studio development environment. The STEVAL-MKI257A adapter board for the LSM6DSK320X and STEVAL-MKI258KA adapter board for the ISM6HGK256X will be available in the eSTore and from distributors by November 2026. The LSM6DSK320X for consumer applications operates over a broad temperature range, from -40°C to +85°C. The industrial-grade ISM6HGK256X handles temperatures from -40°C to +105°C and is included in ST’s 10-year longevity program that assures long-term component availability. The IMUs come in 2.5 mm x 3 mm x 0.83 mm packages and available from $4.6 for the consumer-oriented LSM6DSK320X and $5.1 for the industrial-grade ISM6HGK256X for orders of 1000 pieces.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-delivers-advanced-context-aware-sensors-in-st-sustainable-technology-framework-n4791.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/09/N4791D-Sep-22-2026-Advanced-context-aware-sensors_PR-IMAGE-LO-RES.jpeg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[product press]]></postType>
	<pubDate>Tue, 22 Sep 2026 14:00:58 +0200</pubDate>

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	<title><![CDATA[ST is transforming semiconductor R&D: Moving from physical iteration to digital anticipation]]></title>
	<description><![CDATA[STMicroelectronics has presented a strategic project to create a new R&D Digital Twin center that will take shape at the company’s Castelletto site in Lombardy, west of Milan. The initiative aims to strengthen advanced research and development activities, accelerate innovation across the company, and pave the way for product and technology solutions that were previously out of reach. By Fabio Gualandris, President, Quality, Manufacturing, and Technology The creation of this new R&D Digital Twin Center in Castelletto, Italy marks an important step in transforming how we conduct semiconductor research and development, including how quickly we do so. The targeted benefits of this new approach are practical and measurable: shorter technology-development cycles, faster time-to-market, stronger first-pass success, higher engineering productivity, lower development costs and greater confidence before physical validation. Ultimately, these capabilities should help ST bring differentiated technologies and products to customers faster and with greater predictability. This ambition responds to a fundamental challenge facing the semiconductor industry. Technologies are becoming more complex, development costs are rising and the required time to market continues to shrink. Yet today, much of the learning process at the heart of R&D still depends on physical silicon. Differences between models and measured results and the late discovery of reliability, layout or process interactions can lead to additional development loops, consuming time, engineering resources and investment. Our goal is to move from physical iteration toward digital anticipation. To support this transition, the new center will connect physics-based modelling, simulation, data, artificial intelligence, engineering knowledge and silicon feedback in one integrated R&D environment. It will support technology development, process and device modelling, layout and design, reliability, qualification and testing. The objective is not to replace physical experimentation. Silicon validation will remain essential. Instead, we want to explore more possibilities digitally, identify potential issues earlier and reach physical validation with greater confidence. This can reduce repeated learning loops and accelerate the readiness of new technologies. For customers, this means a stronger foundation for differentiated technologies, improved predictability, faster time-to-market and more scalable innovation across product families. At the core of this approach is the digital twin: a continuously evolving digital representation of the interactions between semiconductor processes, devices and designs. It is calibrated using data from physical experiments and silicon characterization. Each experiment improves the digital models, helping subsequent development become faster, more accurate and more predictive. This feedback loop is especially powerful within ST’s integrated device manufacturer model. Our capabilities across technology R&D, product design, manufacturing and testing allow knowledge to circulate across engineering disciplines. Connecting these capabilities digitally can help teams make better-informed decisions earlier and apply learning across technologies, products and system-level solutions. Castelletto was chosen because it already brings together many of the capabilities the new R&D Digital Twin Center is designed to connect, while also benefiting from its proximity to our strategic manufacturing and R&D hub in Agrate. For more than 40 years, Castelletto has played a key role in semiconductor R&D, evolving into a specialized center for MEMS, smart power and BCD technologies, automotive and industrial integrated circuits, advanced packaging and system integration. Together with our integrated manufacturing and R&D footprint, the site enhances the company’s ability to connect advanced research, industrial expertise and silicon learning within a broader European semiconductor ecosystem. Castelletto’s proximity to Milan, at the heart of one of Europe’s most dynamic industrial and academic ecosystems, will further provide access to talent, partners and collaboration opportunities. Building the center at Castelletto therefore allows ST to leverage an established R&D foundation while creating, over the coming years, a connected digital ecosystem in which modelling, artificial intelligence and engineering knowledge continuously interact to support faster innovation, stronger collaboration and the reuse of knowledge across teams. The initiative will develop in two phases: a first phase until the end of 2027 focused on infrastructure preparation and proofs of concept, followed by a second phase of 3-5 years to finalize and deploy the new engineering model across ST’s R&D environment. The center is expected to employ up to 250 people as part of ST’s R&D team, supported by external expertise and investments in digital infrastructure, software, laboratories and equipment. People and partnerships will be as important as technology. The center will work with an ecosystem of universities, research organizations, suppliers and industrial partners. Semiconductor innovation increasingly depends on combining industrial expertise, academic research, advanced computing and specialized engineering capabilities. Castelletto will create an environment in which these contributions can come together around shared development challenges. Several proofs of concept already provide initial evidence for key elements of the approach. They include a digital twin for a MEMS accelerometer, multivariate anomaly detection, artificial intelligence for silicon photonics developed with Politecnico di Milano, and virtual integrated simulation and test automation. These projects address different stages of semiconductor development, but they share the same principle: using physics, data and artificial intelligence to understand complex interactions sooner and improve decisions before committing to additional physical development cycles. The new center’s scope is focused on technology R&D and its connected engineering disciplines. Manufacturing execution remains outside the initiative and continues to be managed through ST’s dedicated manufacturing digital programs to further digitalize, automate and optimize our front-end wafer fabrication and back-end assembly/testing operations. The two transformations are complementary, contributing to a broader evolution of ST’s technology and manufacturing capabilities. Semiconductor competitiveness increasingly depends not only on manufacturing scale, but also on the ability to connect engineering disciplines, digital infrastructure, data and talent within a faster and more predictive innovation system. With the new R&D Digital Twin Center, ST is investing in that capability. Castelletto will help us shorten learning cycles, strengthen technology readiness and build the digital foundation for the future of semiconductor R&D at ST.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/st-transforming-semiconductor-rd.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/09/RD-Digital-Twin-1.jpg]]></contentImage>
	<mainCategory><![CDATA[Feature]]></mainCategory>
	<postType><![CDATA[feature article]]></postType>
	<pubDate>Tue, 15 Sep 2026 19:59:48 +0200</pubDate>

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	<title><![CDATA[STMicroelectronics introduces automotive image sensor to help scale affordable in-cabin sensing]]></title>
	<description><![CDATA[STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, introduces ST SafeSense VD56GA, a new 1.1 MP automotive image sensor for infrared in-cabin sensing that helps OEMs and Tier 1 suppliers scale driver and occupant monitoring across vehicle lines while balancing performance, integration, and cost. As driver and occupant monitoring moves into more vehicle platforms, automotive manufacturers and suppliers are looking for imaging solutions that support strong in-cabin performance without adding unnecessary system cost or design complexity. VD56GA meets that need with a compact sensor architecture, high infrared sensitivity, and embedded image-processing features that can help simplify camera design and integration. The sensor is designed to give camera developers the image quality needed for driver and occupant monitoring while preserving the size and cost advantages of a compact format. In many in-cabin use cases, this can help customers meet performance targets without moving to a larger, more expensive sensor. “In-cabin sensing is moving beyond premium platforms, and carmakers need cost-effective solutions they can deploy broadly,” said Alexandre Balmefrezol, Executive Vice President and General Manager of the Imaging Sub-Group at STMicroelectronics. “With VD56GA, we focused on the system-level tradeoffs that matter most: image quality in infrared conditions, compact integration, and a cost structure that supports high-volume programs. Equally important, the sensor benefits from ST’s Integrated Device Manufacturer model, with front-end manufacturing in Crolles, France, giving customers greater supply-chain resilience, quality control, and long-term support for automotive programs.” “As driver and occupant monitoring systems move into a broader range of vehicle platforms, OEMs are increasingly focused on solutions that can be deployed at scale, with volumes set to exceed 70 million units by 2031. Success in this market depends not only on imaging performance, but also on reducing system cost, simplifying integration, and enabling adoption across high-volume vehicle programs,\" (*) underlined Anas Chalak, Market & Technology Analyst, Imaging at Yole Group. Helping carmakers scale driver and occupant monitoring VD56GA is designed to help reduce the cost of the complete camera module. Its imaging performance enables the use of lower-cost optics, simplified infrared illumination, less demanding optical filtering, and no external image-processing. For OEMs and Tier 1s, that can translate into a more cost-effective path to deploying driver and occupant monitoring across a broader range of vehicle programs. The sensor leverages a new backside-illuminated pixel architecture, called ST DeepNIR, optimized for infrared imaging. With 35% higher modulation transfer function (MTF) sharpness and nearly 60% higher quantum efficiency than the previous generation, VD56GA is currently the only sensor in its class to achieve this level of combined optical resolution and infrared sensitivity, helping in challenging conditions like under display camera. By extracting more performance from a compact 1.1 MP architecture, VD56GA helps automotive designers achieve the image quality required for advanced sensing functions, while benefiting from the integration and cost advantages of a compact sensor architecture. Compact integration with embedded image processing Designed for modern automotive camera modules, VD56GA is housed in a compact 3.7 mm x 3.2 mm CSP package, making it suitable for space-constrained installations and next-generation in-cabin camera designs. The device also integrates a range of embedded image-processing functions, including mirror, crop, dark calibration, auto exposure, and piecewise-linear processing. These features remove the need for external image-processing resources, simplify camera design and speed development. Support for both RAW and YUV output formats give OEMs and Tier 1 suppliers flexibility across different electronic architectures and software environments, making it easier to adapt the device to a broad range of implementation strategies. Building on ST’s automotive imaging leadership VD56GA builds on ST’s established presence in automotive imaging and in-cabin sensing. Earlier this year, ST announced shipment of its 10 millionth automotive of SafeSense by ST image sensors, reflecting broad adoption across key automotive regions, including Europe, Asia, and the United States. Customers benefit from ST’s vertically integrated manufacturing model and secure supply chain, with front-end manufacturing of VD56GA takes place at ST’s facility in Crolles, France and packaging in Asia; reinforcing the company’s focus on industrial resilience, product quality, and supply continuity for automotive customers worldwide. Availability Samples are available now. Pricing information and sample requests are available from local ST sales offices. Learn more: https://www.st.com/en/imaging-and-photonics-solutions/vd56ga.html *Source: Status of CMOS Image sensors industry 2026 report, Yole Group About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-introduces-automotive-image-sensor-to-help-scale-affordable-in-cabin-sensing-p4788.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/09/PR-image-lo-res.jpeg]]></contentImage>
	<mainCategory><![CDATA[Products & technology]]></mainCategory>
	<postType><![CDATA[product press]]></postType>
	<pubDate>Mon, 14 Sep 2026 07:00:46 +0200</pubDate>

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	<title><![CDATA[Lorenzo Grandi, STMicroelectronics’ President and CFO to speak at Citi investor conference]]></title>
	<description><![CDATA[STMicroelectronics N.V. (“ST”) (NYSE: STM) President and Chief Financial Officer Lorenzo Grandi will speak at Citi\'s 2026 Global TMT Conference in New York on Wednesday, September 9, 2026 at 10.50 am U.S. Eastern Time / 4.50 pm Central European Time. A live webcast (listen-only mode) of the conference will be accessible at ST’s website, https://investors.st.com, and will be available for replay until September 23, 2026. About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/lorenzo-grandi-stmicroelectronics-president-and-cfo-to-speak-at-citi-investor-conference-c3411.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Wed, 2 Sep 2026 07:00:09 +0200</pubDate>

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<item>
	<title><![CDATA[STMicroelectronics announces status of common share repurchase program]]></title>
	<description><![CDATA[STMicroelectronics N.V. (the “Company” or “STMicroelectronics”), a global semiconductor leader serving customers across the spectrum of electronics applications, announces full details of its common share repurchase program (the “Program”) disclosed via a press release dated June 21, 2024. The Program was approved by a shareholder resolution dated May 22, 2024 and by the supervisory board. STMicroelectronics N.V. (registered with the trade register under number 33194537) (LEI: 213800Z8NOHIKRI42W10) announces the repurchase (by a broker acting for the Company) on the regulated market of Euronext Paris, in the period between August 24, 2026 to August 25, 2026 (the “Period”), of 128,904 ordinary shares (equal to 0.01% of its issued share capital) at the weighted average purchase price per share of EUR 42.6526 and for an overall price of EUR 5,498,096.53. The purpose of these transactions under article 5(2) of Regulation (EU) 596/2014 (the Market Abuse Regulation) was to meet obligations arising from share option programmes, or other allocations of shares, to employees or to members of the administrative, management or supervisory bodies of the issuer or of an associate company. The shares may be held in treasury prior to being used for such purpose and, to the extent that they are not ultimately needed for such purpose, they may be used for any other lawful purpose under article 5(2) of the Market Abuse Regulation. Below is a summary of the repurchase transactions made in the course of the Period in relation to the ordinary shares of STMicroelectronics (ISIN: NL0000226223), in detailed form. Transactions in Period Dates of transaction Number of shares purchased Weighted average purchase price per share (EUR) Total amount paid (EUR) Market on which the shares were bought (MIC code) 24-Aug-26 90,607 42.6470 3,864,116.73 XPAR 25-Aug-26 38,297 42.6660 1,633,979.80 XPAR Total for Period 128,904 42.6526 5,498,096.53 Following the share buybacks detailed above, the Company holds in total 19,353,812 treasury shares, which represents approximately 2.1% of the Company’s issued share capital. In accordance with Article 5(1)(b) of the Market Abuse Regulation and Article 2(3) of Commission Delegated Regulation (EU) 2016/1052, a full breakdown of the individual trades in the Program are disclosed on the ST website (https://investors.st.com/stock-and-bond-information/share-buyback). About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-announces-status-of-common-share-repurchase-program-c3412.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Share Repurchase]]></mainCategory>
	<postType><![CDATA[newsbite]]></postType>
	<pubDate>Mon, 31 Aug 2026 13:00:33 +0200</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics announces status of common share repurchase program]]></title>
	<description><![CDATA[STMicroelectronics N.V. (the “Company” or “STMicroelectronics”), a global semiconductor leader serving customers across the spectrum of electronics applications, announces full details of its common share repurchase program (the “Program”) disclosed via a press release dated June 21, 2024. The Program was approved by a shareholder resolution dated May 22, 2024 and by the supervisory board. STMicroelectronics N.V. (registered with the trade register under number 33194537) (LEI: 213800Z8NOHIKRI42W10) announces the repurchase (by a broker acting for the Company) on the regulated market of Euronext Paris, in the period between August 18, 2026 to August 21, 2026 (the “Period”), of 396,468 ordinary shares (equal to 0.04% of its issued share capital) at the weighted average purchase price per share of EUR 44.4019 and for an overall price of EUR 17,603,932.09. The purpose of these transactions under article 5(2) of Regulation (EU) 596/2014 (the Market Abuse Regulation) was to meet obligations arising from share option programmes, or other allocations of shares, to employees or to members of the administrative, management or supervisory bodies of the issuer or of an associate company. The shares may be held in treasury prior to being used for such purpose and, to the extent that they are not ultimately needed for such purpose, they may be used for any other lawful purpose under article 5(2) of the Market Abuse Regulation. Below is a summary of the repurchase transactions made in the course of the Period in relation to the ordinary shares of STMicroelectronics (ISIN: NL0000226223), in detailed form. Transactions in Period Dates of transaction Number of shares purchased Weighted average purchase price per share (EUR) Total amount paid (EUR) Market on which the shares were bought (MIC code) 18-Aug-26 98,873 46.3181 4,579,609.50 XPAR 19-Aug-26 100,615 44.5410 4,481,492.72 XPAR 20-Aug-26 101,888 43.4158 4,423,549.03 XPAR 21-Aug-26 95,092 43.3189 4,119,280.84 XPAR Total for Period 396,468 44.4019 17,603,932.09 Following the share buybacks detailed above, the Company holds in total 19,224,908 treasury shares, which represents approximately 2.1% of the Company’s issued share capital. In accordance with Article 5(1)(b) of the Market Abuse Regulation and Article 2(3) of Commission Delegated Regulation (EU) 2016/1052, a full breakdown of the individual trades in the Program are disclosed on the ST website (https://investors.st.com/stock-and-bond-information/share-buyback). About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-announces-status-of-common-share-repurchase-program-c3410.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Share Repurchase]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Mon, 24 Aug 2026 13:00:03 +0200</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics and NUS launch Corporate Lab to power the future of Edge AI in Singapore]]></title>
	<description><![CDATA[STMicroelectronics N.V. (“ST”) (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and the National University of Singapore (NUS) have officially launched the ST–NUS HELIX Corporate Lab, a four-year strategic research initiative focused on advancing the next generation of edge AI technologies. HELIX, which stands for Hardware for Embodied Low-power Intelligent Xcceleration, will enable new generative and embodied AI use cases at the edge through system-to-silicon innovation. The Corporate Lab is supported under the Research, Innovation and Enterprise 2025 plan (RIE2025) and is hosted at the College of Design and Engineering and with participation from the School of Computing at NUS. The Corporate Lab brings together a multidisciplinary research ecosystem spanning AI algorithms, accelerator architectures, low-power memory systems, circuit design, silicon technologies, and application development. The programme will integrate NUS’ pioneering research with ST’s expertise in semiconductor technology, system development, and industry operations. NUS President Professor Tan Eng Chye said: “The ST–NUS HELIX Corporate Lab is a testament to the value of industry–academia partnerships in translating research into innovation. By combining NUS’ research strengths with STMicroelectronics’ industrial capabilities, we are building not only advanced, cutting-edge edge AI hardware, but also the talent and ecosystem that will help define the future of Singapore’s semiconductor and AI industries.” Laurent Malier, Executive Vice President, Global Technology R&D at STMicroelectronics, said: “ST’s strength as an integrated device manufacturer lies in our ability to bring together advanced silicon technologies, embedded memory, circuit design, heterogeneous integration and chiplets. Through HELIX, we are creating an industrially relevant foundation to explore differentiated AI computing technologies and accelerate the translation of promising research into scalable semiconductor solutions.” The Corporate Lab was officially launched today by Ms Low Yen Ling, Senior Minister of State, Ministry of Culture, Community and Youth, and Ministry of Trade and Industry, as the Guest-of-Honour. Building the future of edge AI Edge AI processes data directly within or close to a device rather than relying exclusively on remote cloud infrastructure. This enables faster response times, stronger data privacy, improved energy efficiency, and greater resilience in environments with limited or intermittent connectivity. These capabilities are increasingly important for AI systems that must perceive, reason, and act in real time, in the real world – often described as Physical AI. HELIX focuses on a key frontier within this space: embodied AI, where intelligence is built directly into a physical form — such as a robot, humanoid, or drone — combining multi-modal sensing, on-device computing, and real-time actuation. Delivering that intelligence efficiently, on compact and power-constrained hardware, is the challenge HELIX is built to address. Enabling these capabilities at the edge requires innovation across algorithms, software, system architecture, and hardware. HELIX builds on ST’s long-standing journey in AI and will help explore new system-level solutions that combine efficient computing, advanced memory architecture, and application-driven design to address the requirements of future intelligent devices. Complementing ST’s capabilities, NUS brings world-class expertise in integrated circuits, computer architecture, AI models, and system design. Under the partnership, researchers from NUS and STMicroelectronics will jointly work on research work packages, talent development, IP creation, and demonstration activities. The research at HELIX will span the full technology stack, from AI models and system architecture to heterogeneous accelerators, on-chip memory hierarchies, circuit design, chip integration, and silicon implementation. It will focus on memory-centric architecture, innovative in-memory computing, and scalable compute-and-memory systems, supported by ST’s P18 18nm Fully Depleted Silicon On Insulator (FD-SOI) technology and embedded Phase Change Memory (PCM). P18 FD-SOI enables ultra-low-power operation and adaptive body-biasing, while embedded PCM provides dense, non-volatile storage on the same die alongside the on-chip SRAM hierarchy. Together, these capabilities can reduce the off-chip data movement that dominates the energy consumption of memory-bound AI workloads. ST will make a substantial technology and engineering contribution to HELIX by providing NUS with a dedicated design chassis implemented in its proprietary P18 18nm FD-SOI technology. The platform will bring together ST’s silicon, architecture, integration, and engineering capabilities to give researchers an industrial-grade foundation for developing, integrating, and validating new AI accelerator concepts. By eliminating the need to build the underlying infrastructure from the ground up, the design chassis will enable greater focus on differentiated innovation, accelerate system-level validation, and create a more direct path from technology pathfinding to industrialization. By combining advances across AI algorithms, accelerator architectures, memory systems, circuits, and semiconductor technologies, HELIX aims to address the energy-efficiency, memory-bandwidth, latency, scalability, and integration challenges associated with deploying increasingly capable AI systems at the edge. Nurturing talent to drive Singapore’s semiconductor ecosystem The establishment of HELIX represents a strategic investment in Singapore’s future competitiveness in edge AI and advanced semiconductor systems. By fostering industry-relevant R&D, HELIX will strengthen local capabilities and nurture a new generation of talent in AI systems and chip design. Students, researchers, and professionals will have opportunities to participate in cutting-edge projects led by HELIX, gaining hands-on experience with the latest technologies, collaborating with industry leaders, and developing skills that meet the evolving needs of the sector. Through these initiatives, HELIX aims to build a robust talent pipeline and position Singapore as a global hub for innovation in edge AI and semiconductor technologies. About National University of Singapore (NUS) The National University of Singapore (NUS) is Singapore’s flagship university, which offers a global approach to education, research and entrepreneurship, with a focus on Asian perspectives and expertise. We have 15 colleges, faculties and schools across three campuses in Singapore, with more than 40,000 students from 100 countries enriching our vibrant and diverse campus community. We have also established more than 20 NUS Overseas Colleges entrepreneurial hubs around the world. Our multidisciplinary and real-world approach to education, research and entrepreneurship enables us to work closely with industry, governments and academia to address crucial and complex issues relevant to Asia and the world. Researchers in our faculties, research centres of excellence, corporate labs and more than 30 university-level research institutes focus on themes that include energy; environmental and urban sustainability; treatment and prevention of diseases; active ageing; advanced materials; risk management and resilience of financial systems; Asian studies; and Smart Nation capabilities such as artificial intelligence, data science, operations research and cybersecurity. For more information on NUS, please visit nus.edu.sg. About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at https://www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-and-nus-launch-corporate-lab-to-power-the-future-of-edge-ai-in-singapore-c3409.html</link>
	<contentImage><![CDATA[/wp-content/uploads/2026/08/ST-NUS-HELIX-Corporate-Lab_photo-1.png]]></contentImage>
	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Mon, 24 Aug 2026 07:01:46 +0200</pubDate>

</item>
<item>
	<title><![CDATA[The next decade of edge AI will be won inside memory]]></title>
	<description><![CDATA[By Giuseppe Desoli, PhD Company Fellow · ST\'s Chief Innovation Officer and General Manager and Group Vice President, System Research and Applications Group “For seventy years, we have built machines that move data to where computing happens. Edge AI will only scale if we turn that around, with computing happening inside memory and intelligence built into the sensor. That shift is the roadmap.” AI has been a cloud story. Why does it have to move to the edge? Because the economics have changed. For years, the hardest part of AI was training models. Training is expensive, but you do it once in a data center and use the result many times. What is coming now is different. We are seeing systems that need to reason all the time, and physical systems that need to sense and react all the time. In both cases, the main cost is no longer training. It is inference, meaning the moment when the AI actually makes a decision. And inference happens where the data is created. Once you see that, the case for edge AI becomes very practical. A machine that must react in a millisecond cannot wait for data to travel to the cloud and back. A device inside someone’s home should not need to send video elsewhere. And if you have hundreds of millions of sensors, it is simply too expensive for each one to rely on remote computing. So latency, privacy, and cost all point in the same direction. Intelligence needs to sit close to the data, close to the action, and close to the real world. You describe the key trend as “from storage to computing”. What does that mean in practice? In a neural network, moving data often costs much more energy than doing the math itself. So the real design question is not just how powerful the computing unit is. It is how far the data has to travel. You can think of the shift in four steps. First, there is the classic von Neumann model, where the processor and the memory are separate and data moves between them. Second, there is near-memory computing, where memory and processing are brought onto the same chip. That reduces data movement and improves bandwidth. Third, there is SRAM-based in-memory computing. In that case, the key math operation happens inside the memory array itself. Fourth, there is non-volatile in-memory computing. Here, the same dense memory array both stores the model parameters and performs the computation. The weights do not move at all. That is the real change. Memory stops being just a place to keep data. It becomes part of the computer itself. That idea is at the center of our architectural choices. In-memory computing test vehicles matter because simulation alone is not enough. An architecture only becomes real when it has faced the issues of silicon, such as variability, drift, manufacturing yield, and compiler support. Where does ST actually stand on in-memory computing today? We are already doing this in silicon, and we have been for several years. At ISSCC 2023, we presented a fully digital in-memory computing accelerator built in 18 nm FD-SOI. It reached 40 to 310 TOPS/W at precision levels up to 4 bits. What matters most is not just the number. It is what sits behind it. First, the design uses multiple tiles. That means the efficiency is not limited to a single lab block. It can scale into a larger, more practical accelerator. Second, it is digital. That means it gives exact, repeatable results and can move through standard design, test, and product development flows. That is what makes it relevant for real products. This work did not appear overnight. It builds on years of progress. It started with earlier silicon we presented in 2017, then moved through the platform and software work needed to make the architecture programmable. That path led to the Neural-ART family of NPU accelerators, including the first generation in the STM32N6, the first STM32 with built-in hardware AI acceleration. So for us, this is not separate research on one side and product planning on the other. It has been one continuous program for nearly ten years. Physical AI, embodied AI, robotics — a different problem, or the same one? It is closely related, but the challenge becomes more demanding because timing matters so much. A physical AI system has to keep sensing, understanding, deciding, and acting in real time. To do that well in a changing, unpredictable environment, it needs fast local inference. It cannot rely too heavily on sending data away and waiting for a response. That changes what edge computing has to deliver. These systems need to understand context on the device, combine data from different sensors, protect privacy, and support instant, reflex-like responses when needed. This is one reason robotics is changing. Older systems often relied on carefully written rules for a specific task. That works well in a controlled setting. It works much less well in the real world, where situations change constantly. What is replacing it is a more unified approach. One model can connect perception, reasoning, and control more directly. That makes it easier for machines to handle new objects and unfamiliar tasks. The models themselves are also evolving. They are moving toward ways of generating smoother, more continuous motion. That is good news for real machines, because motors and actuators need smooth, frequent updates to work well. And the gap between what these models need and what edge devices can provide is getting smaller. That means this is starting to look like a realistic design target, not a distant idea. This is exactly where memory-focused design matters. A system like this has to keep track of a changing world while making decisions in real time. So context awareness is not something you add later. It has to be built in from the start through the way memory and computing work together. How does an exploratory architecture become something a customer can buy? Mostly through the tools. New hardware is not a product if developers cannot actually use it. That is why every generation of accelerator we build also comes with compiler and quantization work that fits into a familiar development flow. That includes the ST Edge AI tools and the STM32 AI ecosystem, where a trained network comes from a standard framework and is then turned into code for the target device. A lot of our published work sits exactly in that less visible but essential layer: mapping networks onto hardware tiles and exploring compiler optimizations layer by layer. Part of this work also happens in open collaboration. We have long-standing partnerships with universities and with IBM Research Zurich, and now a joint corporate lab with the National University of Singapore. Memory-centric computing is too broad and important for any one company to explore alone. Many of the questions that will matter most ten years from now are still being debated today in research conferences.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/the-next-decade-of-edge-ai-will-be-won-inside-memory.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Feature]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Mon, 24 Aug 2026 07:01:14 +0200</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics publishes its IFRS 2026 Semi Annual Accounts]]></title>
	<description><![CDATA[STMicroelectronics NV (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, published today its IFRS 2026 Semi Annual Accounts for the six-month period ended June 27, 2026 on its website and filed them with the Netherlands Authority for the Financial Markets (AFM). The Company’s Semi Annual Accounts, prepared in accordance with International Financial Reporting Standards (IFRS-EU), are posted on the Company’s website (www.st.com) and the AFM’s website (www.afm.nl). About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-publishes-its-ifrs-2026-semi-annual-accounts-c3408.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Wed, 19 Aug 2026 22:00:54 +0200</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics announces status of common share repurchase program]]></title>
	<description><![CDATA[STMicroelectronics N.V. (the “Company” or “STMicroelectronics”), a global semiconductor leader serving customers across the spectrum of electronics applications, announces full details of its common share repurchase program (the “Program”) disclosed via a press release dated June 21, 2024. The Program was approved by a shareholder resolution dated May 22, 2024 and by the supervisory board. STMicroelectronics N.V. (registered with the trade register under number 33194537) (LEI: 213800Z8NOHIKRI42W10) announces the repurchase (by a broker acting for the Company) on the regulated market of Euronext Paris, in the period between August 10, 2026 to August 14, 2026 (the “Period”), of 115,000 ordinary shares (equal to 0.01% of its issued share capital) at the weighted average purchase price per share of EUR 47.9854 and for an overall price of EUR 5,518,320.50. The purpose of these transactions under article 5(2) of Regulation (EU) 596/2014 (the Market Abuse Regulation) was to meet obligations arising from share option programmes, or other allocations of shares, to employees or to members of the administrative, management or supervisory bodies of the issuer or of an associate company. The shares may be held in treasury prior to being used for such purpose and, to the extent that they are not ultimately needed for such purpose, they may be used for any other lawful purpose under article 5(2) of the Market Abuse Regulation. Below is a summary of the repurchase transactions made in the course of the Period in relation to the ordinary shares of STMicroelectronics (ISIN: NL0000226223), in detailed form. Transactions in Period Dates of transaction Number of shares purchased Weighted average purchase price per share (EUR) Total amount paid (EUR) Market on which the shares were bought (MIC code) 10-Aug-26 30,000 48.6051 1,458,153.00 XPAR 11-Aug-26 20,000 48.0160 960,320.00 XPAR 12-Aug-26 20,000 48.5767 971,534.00 XPAR 13-Aug-26 20,000 47.5233 950,466.00 XPAR 14-Aug-26 25,000 47.1139 1,177,847.50 XPAR Total for Period 115,000 47.9854 5,518,320.50 Following the share buybacks detailed above, the Company holds in total 18,828,440 treasury shares, which represents approximately 2.1% of the Company’s issued share capital. In accordance with Article 5(1)(b) of the Market Abuse Regulation and Article 2(3) of Commission Delegated Regulation (EU) 2016/1052, a full breakdown of the individual trades in the Program are disclosed on the ST website (https://investors.st.com/stock-and-bond-information/share-buyback). About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-announces-status-of-common-share-repurchase-program-c3407.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Share Repurchase]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Mon, 17 Aug 2026 13:53:06 +0200</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics announces status of common share repurchase program]]></title>
	<description><![CDATA[STMicroelectronics N.V. (the “Company” or “STMicroelectronics”), a global semiconductor leader serving customers across the spectrum of electronics applications, announces full details of its common share repurchase program (the “Program”) disclosed via a press release dated June 21, 2024. The Program was approved by a shareholder resolution dated May 22, 2024 and by the supervisory board. STMicroelectronics N.V. (registered with the trade register under number 33194537) (LEI: 213800Z8NOHIKRI42W10) announces the repurchase (by a broker acting for the Company) on the regulated market of Euronext Paris, in the period between August 03, 2026 to August 07, 2026 (the “Period”), of 65,209 ordinary shares (equal to 0.01% of its issued share capital) at the weighted average purchase price per share of EUR 45.7643 and for an overall price of EUR 2,984,246.06. The purpose of these transactions under article 5(2) of Regulation (EU) 596/2014 (the Market Abuse Regulation) was to meet obligations arising from share option programmes, or other allocations of shares, to employees or to members of the administrative, management or supervisory bodies of the issuer or of an associate company. The shares may be held in treasury prior to being used for such purpose and, to the extent that they are not ultimately needed for such purpose, they may be used for any other lawful purpose under article 5(2) of the Market Abuse Regulation. Below is a summary of the repurchase transactions made in the course of the Period in relation to the ordinary shares of STMicroelectronics (ISIN: NL0000226223), in detailed form. Transactions in Period Dates of transaction Number of shares purchased Weighted average purchase price per share (EUR) Total amount paid (EUR) Market on which the shares were bought (MIC code) 03-Aug-26 24 412 45.0658 1,100,146.31 XPAR 05-Aug-26 20 000 46.5398 930,796.00 XPAR 06-Aug-26 17 748 45.6584 810,345.28 XPAR 07-Aug-26 3 049 46.8870 142,958.46 XPAR Total for Period 65,209 45.7643 2,984,246.06 Following the share buybacks detailed above, the Company holds in total 18,713,440 treasury shares, which represents approximately 2.1% of the Company’s issued share capital. In accordance with Article 5(1)(b) of the Market Abuse Regulation and Article 2(3) of Commission Delegated Regulation (EU) 2016/1052, a full breakdown of the individual trades in the Program are disclosed on the ST website (https://investors.st.com/stock-and-bond-information/share-buyback). About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/stmicroelectronics-announces-status-of-common-share-repurchase-program-c3406.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Share Repurchase]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Mon, 10 Aug 2026 13:07:44 +0200</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics announces status of common share repurchase program]]></title>
	<description><![CDATA[Disclosure of Transactions in Own Shares – Period from July 27, 2026 to July 31, 2026 AMSTERDAM – August 4, 2026 – STMicroelectronics N.V. (the “Company” or “STMicroelectronics”), a global semiconductor leader serving customers across the spectrum of electronics applications, announces full details of its common share repurchase program (the “Program”) disclosed via a press release dated June 21, 2024. The Program was approved by a shareholder resolution dated May 22, 2024 and by the supervisory board. STMicroelectronics N.V. (registered with the trade register under number 33194537) (LEI: 213800Z8NOHIKRI42W10) announces the repurchase (by a broker acting for the Company) on the regulated market of Euronext Paris, in the period between July 27, 2026 to July 31, 2026 (the “Period”), of 206,011 ordinary shares (equal to 0.02% of its issued share capital) at the weighted average purchase price per share of EUR 45.0676 and for an overall price of EUR 9,284,422.75. The purpose of these transactions under article 5(2) of Regulation (EU) 596/2014 (the Market Abuse Regulation) was to meet obligations arising from share option programmes, or other allocations of shares, to employees or to members of the administrative, management or supervisory bodies of the issuer or of an associate company. The shares may be held in treasury prior to being used for such purpose and, to the extent that they are not ultimately needed for such purpose, they may be used for any other lawful purpose under article 5(2) of the Market Abuse Regulation. Below is a summary of the repurchase transactions made in the course of the Period in relation to the ordinary shares of STMicroelectronics (ISIN: NL0000226223), in detailed form. Transactions in Period Dates of transaction Number of shares purchased Weighted average purchase price per share (EUR) Total amount paid (EUR) Market on which the shares were bought (MIC code) 27-Jul-26 65,000 46.8945 3,048,142.50 XPAR 28-Jul-26 50,000 44.4501 2,222,505.00 XPAR 29-Jul-26 50,000 43.3511 2,167,555.00 XPAR 30-Jul-26 11,011 43.3227 477,026.25 XPAR 31-Jul-26 30,000 45.6398 1,369,194.00 XPAR Total for Period 206,011 45.0676 9,284,422.75 Following the share buybacks detailed above, the Company holds in total 19,610,605 treasury shares, which represents approximately 2.2% of the Company’s issued share capital. In accordance with Article 5(1)(b) of the Market Abuse Regulation and Article 2(3) of Commission Delegated Regulation (EU) 2016/1052, a full breakdown of the individual trades in the Program are disclosed on the ST website (https://investors.st.com/stock-and-bond-information/share-buyback). About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/share-repurchase-program-c3405c.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Share Repurchase]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Tue, 4 Aug 2026 13:03:29 +0200</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics announces status of common share repurchase program]]></title>
	<description><![CDATA[STMicroelectronics N.V. (the “Company” or “STMicroelectronics”), a global semiconductor leader serving customers across the spectrum of electronics applications, announces full details of its common share repurchase program (the “Program”) disclosed via a press release dated June 21, 2024. The Program was approved by a shareholder resolution dated May 22, 2024 and by the supervisory board. STMicroelectronics N.V. (registered with the trade register under number 33194537) (LEI: 213800Z8NOHIKRI42W10) announces the repurchase (by a broker acting for the Company) on the regulated market of Euronext Paris, in the period between July 20, 2026 to July 24, 2026 (the “Period”), of 226,883 ordinary shares (equal to 0.02% of its issued share capital) at the weighted average purchase price per share of EUR 50.4457 and for an overall price of EUR 11,445,280.67. The purpose of these transactions under article 5(2) of Regulation (EU) 596/2014 (the Market Abuse Regulation) was to meet obligations arising from share option programmes, or other allocations of shares, to employees or to members of the administrative, management or supervisory bodies of the issuer or of an associate company. The shares may be held in treasury prior to being used for such purpose and, to the extent that they are not ultimately needed for such purpose, they may be used for any other lawful purpose under article 5(2) of the Market Abuse Regulation. Below is a summary of the repurchase transactions made in the course of the Period in relation to the ordinary shares of STMicroelectronics (ISIN: NL0000226223), in detailed form. Transactions in Period Dates of transaction Number of shares purchased Weighted average purchase price per share (EUR) Total amount paid (EUR) Market on which the shares were bought (MIC code) 20-Jul-26 30,000 54.5718 1,637,154.00 XPAR 21-Jul-26 20,000 56.6005 1,132,010.00 XPAR 22-Jul-26 18,158 57.1432 1,037,606.23 XPAR 23-Jul-26 76,853 49.1672 3,778,646.82 XPAR 24-Jul-26 81,872 47.1451 3,859,863.63 XPAR Total for Period 226,883 50.4457 11,445,280.67 Following the share buybacks detailed above, the Company holds in total 19,404,594 treasury shares, which represents approximately 2.1% of the Company’s issued share capital. In accordance with Article 5(1)(b) of the Market Abuse Regulation and Article 2(3) of Commission Delegated Regulation (EU) 2016/1052, a full breakdown of the individual trades in the Program are disclosed on the ST website (https://investors.st.com/stock-and-bond-information/share-buyback). About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3404.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Share Repurchase]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Mon, 27 Jul 2026 13:01:28 +0200</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics Reports Q2 2026 Financial Results]]></title>
	<description><![CDATA[STMicroelectronics N.V. (“ST”) (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, reported U.S. GAAP financial results for the second quarter ended June 27, 2026. This press release also contains non-U.S. GAAP measures (see Appendix for additional information). ST reported second quarter net revenues of $3.49 billion, gross margin of 34.8%, operating income of $187 million, and net income of $222 million or $0.24 diluted earnings per share (non-U.S. GAAP1 gross margin of 35.2%, non-U.S. GAAP1 operating income of $269 million, and non-U.S. GAAP1 net income of $291 million or $0.31 diluted earnings per share). Jean-Marc Chery, ST President & CEO, commented: “Q2 net revenues came above the mid-point of our business outlook range, driven by higher revenues in CECP and Automotive. Gross margin was in line with the mid-point of our business outlook range.” “On a year-over-year basis, Q2 net revenues increased 26.0%. Q2 gross margin was 34.8%, operating margin was 5.4% and net income was $222 million. On a non-U.S. GAAP1 basis gross margin was 35.2%, operating margin was 7.7% and net income was $291 million.” “During the quarter demand increased further, with strong bookings in all end markets. We saw improved visibility and signs of tight supply in several product categories. Inventory in distribution is now below our standard target.” “Our third quarter business outlook, at the mid-point, is for net revenues of $3.70 billion, increasing about 6.2% sequentially and about 16.2% year-over-year. Gross margin is expected to be about 37.0%, including about 70 basis points of unused capacity charges.” “We anticipate a revenue growth acceleration in Q4, mainly driven by our engaged customer programs in AI datacenters and LEO satellite communication. We expect Q4 revenues to be above $4 billion, this translates into a H2 vs H1 growth above our normal 15% seasonality.” “Driven by continued strong demand in AI datacenters, we are raising our revenue ambition for datacenters. Revenues are now expected above $1 billion in 2026 and, assuming the current dynamic continues and with the current engagements we have, well above $2 billion in 2027. This confirms ST’s strong position in the evolving AI datacenters.” 1Non-U.S. GAAP. See Appendix for reconciliation to U.S. GAAP and information explaining why the Company believes these measures are important. The press release is available as a PDF here.]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3403.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Corporate]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Thu, 23 Jul 2026 06:01:42 +0200</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics announces status of common share repurchase program]]></title>
	<description><![CDATA[STMicroelectronics N.V. (the “Company” or “STMicroelectronics”), a global semiconductor leader serving customers across the spectrum of electronics applications, announces full details of its common share repurchase program (the “Program”) disclosed via a press release dated June 21, 2024. The Program was approved by a shareholder resolution dated May 22, 2024 and by the supervisory board. STMicroelectronics N.V. (registered with the trade register under number 33194537) (LEI: 213800Z8NOHIKRI42W10) announces the repurchase (by a broker acting for the Company) on the regulated market of Euronext Paris, in the period between July 13, 2026 to July 17, 2026 (the “Period”), of 199,413 ordinary shares (equal to 0.02% of its issued share capital) at the weighted average purchase price per share of EUR 57.2549 and for an overall price of EUR 11,417,364.55. The purpose of these transactions under article 5(2) of Regulation (EU) 596/2014 (the Market Abuse Regulation) was to meet obligations arising from share option programmes, or other allocations of shares, to employees or to members of the administrative, management or supervisory bodies of the issuer or of an associate company. The shares may be held in treasury prior to being used for such purpose and, to the extent that they are not ultimately needed for such purpose, they may be used for any other lawful purpose under article 5(2) of the Market Abuse Regulation. Below is a summary of the repurchase transactions made in the course of the Period in relation to the ordinary shares of STMicroelectronics (ISIN: NL0000226223), in detailed form. Transactions in Period Dates of transaction Number of shares purchased Weighted average purchase price per share (EUR) Total amount paid (EUR) Market on which the shares were bought (MIC code) 13-Jul-26 32,254 61.1380 1,971,945.05 XPAR 14-Jul-26 20,000 61.2760 1,225,520.00 XPAR 15-Jul-26 35,000 59.5560 2,084,460.00 XPAR 16-Jul-26 65,000 56.2663 3,657,309.50 XPAR 17-Jul-26 47,159 52.5484 2,478,130.00 XPAR Total for Period 199,413 57.2549 11,417,364.55 Following the share buybacks detailed above, the Company holds in total 19,177,711 treasury shares, which represents approximately 2.1% of the Company’s issued share capital. In accordance with Article 5(1)(b) of the Market Abuse Regulation and Article 2(3) of Commission Delegated Regulation (EU) 2016/1052, a full breakdown of the individual trades in the Program are disclosed on the ST website (https://investors.st.com/stock-and-bond-information/share-buyback). About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3402.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Share Repurchase]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Mon, 20 Jul 2026 13:00:54 +0200</pubDate>

</item>
<item>
	<title><![CDATA[STMicroelectronics announces status of common share repurchase program]]></title>
	<description><![CDATA[STMicroelectronics N.V. (the “Company” or “STMicroelectronics”), a global semiconductor leader serving customers across the spectrum of electronics applications, announces full details of its common share repurchase program (the “Program”) disclosed via a press release dated June 21, 2024. The Program was approved by a shareholder resolution dated May 22, 2024 and by the supervisory board. STMicroelectronics N.V. (registered with the trade register under number 33194537) (LEI: 213800Z8NOHIKRI42W10) announces the repurchase (by a broker acting for the Company) on the regulated market of Euronext Paris, in the period between July 06, 2026 to July 10, 2026 (the “Period”), of 96,195 ordinary shares (equal to 0.01% of its issued share capital) at the weighted average purchase price per share of EUR 60.2676 and for an overall price of EUR 5,797,437.03. The purpose of these transactions under article 5(2) of Regulation (EU) 596/2014 (the Market Abuse Regulation) was to meet obligations arising from share option programmes, or other allocations of shares, to employees or to members of the administrative, management or supervisory bodies of the issuer or of an associate company. The shares may be held in treasury prior to being used for such purpose and, to the extent that they are not ultimately needed for such purpose, they may be used for any other lawful purpose under article 5(2) of the Market Abuse Regulation. Below is a summary of the repurchase transactions made in the course of the Period in relation to the ordinary shares of STMicroelectronics (ISIN: NL0000226223), in detailed form. Transactions in Period Dates of transaction Number of shares purchased Weighted average purchase price per share (EUR) Total amount paid (EUR) Market on which the shares were bought (MIC code) 06-Jul-26 15,249 61.9214 944,239.43 XPAR 07-Jul-26 35,000 59.3457 2,077,099.50 XPAR 08-Jul-26 20,000 58.7469 1,174,938.00 XPAR 09-Jul-26 5,946 60.7871 361,440.10 XPAR 10-Jul-26 20,000 61.9860 1,239,720.00 XPAR Total for Period 96,195 60.2676 5,797,437.03 Following the share buybacks detailed above, the Company holds in total 18,978,298 treasury shares, which represents approximately 2.1% of the Company’s issued share capital. In accordance with Article 5(1)(b) of the Market Abuse Regulation and Article 2(3) of Commission Delegated Regulation (EU) 2016/1052, a full breakdown of the individual trades in the Program are disclosed on the ST website (https://investors.st.com/stock-and-bond-information/share-buyback). About STMicroelectronics At ST, we are 49,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are on track to be carbon neutral in all direct and indirect emissions (scopes 1 and 2), product transportation, business travel, and employee commuting emissions (our scope 3 focus), and to achieve our 100% renewable electricity sourcing goal by the end of 2027. Further information can be found at www.st.com]]></description>
	<link>https://newsroom.st.com/media-center/press-item.html/c3401.html</link>
	<contentImage><![CDATA[]]></contentImage>
	<mainCategory><![CDATA[Share Repurchase]]></mainCategory>
	<postType><![CDATA[corporate press]]></postType>
	<pubDate>Mon, 13 Jul 2026 13:01:27 +0200</pubDate>

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