Date: 20-28 February – virtual format
The International Solid-State Circuits Conference is the foremost global forum for presentation of advances in solid-state circuits and System-on-Chips. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and applications to stay ahead of technical trends, and to network with leading experts.
STMicroelectronics is part of the ISSCC community and joins the 2022 event edition with several presentations, including a plenary talk by Marco Cassis, President, Analog, MEMS and Sensors Group and Head of STMicroelectronics’ Strategy, System Research and Applications, Innovation Office, about Intelligent sensing.
Plenary keynote at 7:45 AM PST
Intelligent sensing: enabling the next “automation age”
Sensors have undergone extraordinary proliferation since the beginning of the 21st Century. Thanks to IoT, connected smart sensors can now be found all around us. This makes it possible to collect a wealth of data autonomously and continuously without human intervention, automating routine activities while unlocking previously unattainable insights and functionality.
As we enter the Automation Age, the information generated from these sensors can be processed and acted on locally to take action in the physical world. Sensing, artificial intelligence, and actuation will enable autonomous end-to-end system solutions in existing and new application fields including automotive, digital health, agriculture, environmental control, and decarbonization.
The semiconductor industry is driving this transformation and sensors, smart embedded actuators, analog interfaces, connectivity, security and embedded AI, offer a perfect toolset for companies to continue to innovate. To fuel this innovation, we need to develop energy efficient, high-accuracy, autonomous, ultra-compact, and trusted ICs.
These chips need to feature state-of-the-art system and embedded security techniques to protect the gathered data, its processing, and the resulting actuation. New and super-efficient computational hardware technologies supporting AI and machine learning are already transforming at-the-edge data processing and are pushing the envelope on intelligent functionality and IoT network scalability.
Future advances will rely on these evolving IC technologies as well as associated packaging solutions. These will include super-integration, wafer-to-wafer bonding, and system-in-package, to enable the heterogenous integration of multiple technologies.
Conference agenda – ST sessions
|19 Feb||9:00am||Circuit Insights |
Industry perspective: why circuit design?
|Andreia Cathelin |
|19 Feb||9:00am||Circuit Insights |
Fireside chat with circuit designers
|Elsa Lacombe |
|20 Feb||8:05am||Next Gen Circuit Designer 2022 Workshop |
Elevator Pitch Session
|Sofia Perinelli |
ST Elevator pitch presenter
|20 Feb||9:50am||Next Gen Circuit Designer 2022 Workshop |
Panel: Our path to circuit design
|Andreia Cathelin, |
|21 Feb||7:45||Plenary keynote |
Intelligent Sensing: Enabling the Next “Automation Age”
|Marco Cassis |
ST President Analog, MEMS and Sensors Group
|22 Feb||8:30am||GaN, High Voltage and wireless power||Patrick Arno |
ST Session Co-Chair
|25 Feb||7:00am||Forum 2: Chip Design for Low-Power, Robust, and Secure IoT Devices||Andreia Cathelin, Bruce Rae |
|25 Feb||7:00am||Forum 3: The Path to 6G: Architectures, Circuits, Technologies||Andreia Cathelin, |
|In addition to the list of presentations above, we recognize the role of Bruce Rae as ITPC European Regional Chair.|