Front end technology key components
- Functionality of the Technology Platform Qualification Vehicle demonstrated, plan for final qualification
- Characterization on typical silicon to demonstrate alignment with models
- Technology reliability at wafer level (and package level when necessary)
- EWS testing capability and front end/back end compatibility with corresponding FMEA
- Process flow, control plan and technology FMEA
- New material specification and Qualified Material List (QML) updated
- Preliminary front end/back end compatibility ensured
Back end technology development key components
- Process parameter compatibility check with production environment conditions
- Stress qualification trials with defined parameters, materials, flow chart and control plan to validate new production environment
- Front end/back end compatibility ensured
- Secure product deliveries on advanced technologies using stress methodologies to detect potential weak parts
- Advanced design rule specification updated (if needed)
- Relevant failures identified and documented in the Failure Mode Knowledge Matrix (FMKM)
- Process FMEA, flow chart and control plan
- Process capability on all steps (attribute, variable) checked
- Equipment selection and validation
- First version of equipment FMEA for new equipment
Product development key components
- Analysis of new product specification to forecast reliability performance
- Reliability plan, reliability design rules, prediction of failure rates for operating life test using Arrhenius’ law and other applicable models
- Use of tools and methodologies, such as APQP, DFM, DFT, DFT, DFMEA, FMKM
- Detection of potential reliability issues and solutions to overcome them
- Assessment of Engineering Samples (ES) to identify the main potential failure mechanisms
- Statistical analysis of electrical parameter drifts for early warning in case of fast parametric degradation (such as retention tests)
- Failure analysis on failed parts to clarify failure modes and mechanisms and identify the root causes
- Physical destructive analysis on good parts after reliability tests when required
- Electrostatic discharge (ESD) and latch-up sensitivity measurement
