Technology Tour - Newport Beach, CA | Session Abstracts
Session 1 Abstracts

Applications Enabled by ST’s Time-Of-Flight Technology

9:45 – 10:25
Speaker: John Kvam, STMicroelectronics

Based on a simple concept, ST FlightSense™ technology enables a large variety of applications. This session will present several different applications enabled by ST technology.

STM32 Wireless MCU Solutions

10:45 – 11:25
Speaker: Greg Davis, STMicroelectronics

Connectivity solutions are more important than ever in today’s IoT design. The STM32 wireless MCU series continues to expand, offering wider choice of devices such as the STM32WB that brings BLE 5.0 connectivity coupled with Cortex® M-4 and M0+ Arm® cores in a single chip solution. With security features that will ensure your IoT design is secure, multiple connection options such as BLE Mesh, Zigbee or Thread, the STM32WB is truly the most complete Bluetooth® SoC available on the market today. The STM32L series power consumption schemes applied to STM32WB will ensure your IoT devices can be powered as long as possible in the field.

Low Cost, Highly Precise Real Time Kinematics for Automotive and Autonomous Systems

11:30 – 12:10
Speaker: Michael Murray, Aceinna

This discussion will focus upon the market trends, applications and adoption rates for Real Time Kinematic systems. We will also discuss how newly integrated devices and networks are disrupting existing and emerging applications due to the decreased cost, complexity and subsequently, time to market.

Automotive Megatrends: STMicroelectronics Broad Portfolio to Address the Needs

1:15 – 1:55
Speaker: Alex Popovic, STMicroelectronics

From digitalization to electrification, the high-tech Automotive tsunami has arrived. See how ST is part of these megatrends in the automotive world.

Stellar: Advanced Multicore Automotive Arm® Cortex® Microcontrollers for Automotive Systems

2:00 – 2:40
Speaker: Khaldoun Albarazi, STMicroelectronics

Automotive requirements for microcontrollers are continuously increasing to meet the features and functions required for vehicle electrification, connectivity and availability. Real-time deterministic scalable performance coupled with functional safety (ASIL ISO26262) and security are drivers for the next generation of ST’s automotive Stellar family.

With 28 nm FDSOI technology combined with a new non-volatile memory (ePCM) the Stellar G and Stellar P are well suited for various control ECUs and a mix of propulsion systems. This presentation will highlight the unique technology behind the Stellar G/P family, providing best performance, best power efficiency and built-in OTA memory replication and support. Further we will introduce the Stellar E family as the first of its kind ARM Cortex M7 ASIL-D specialized MCU for Automotive Digital Power Conversion.

Benefits of Applying Silicon Carbide Power MOSFETs

3:00 – 3:40
Speaker: Jeff Fedison, STMicroelectronics

The recent commercialization of silicon carbide power devices has given way to a revolution in power electronics where traditional silicon devices are being replaced by smaller and more efficient silicon carbide devices. This presentation will describe benefits silicon carbide devices impart on power electronics. The state of the art in SiC MOSFETs will be reviewed along with information about the latest offering from ST. A wide range of applications already exist for SiC, including traction inverters and chargers for electric vehicles, photovoltaic inverters, industrial drives and switched-mode power supplies. A few examples of these applications will be described and comparisons will be made to traditional silicon-based solutions. The presentation will include a discussion of the requirements of gate drivers suitable for SiC MOSFETs.

Intelligent Power and E-Fuse Solutions

3:45 – 4:25
Speaker: Karl Wojcik, STMicroelectronics

Presenting ST’s revolutionary new generation High Side Driver family with SPI/Parallel control for use in Power Distribution Units and Body Control Modules. Additionally, an overview of ST’s new Silicon based fuse and relay replacement technology will be delivered.

L9963 – Battery Cell Monitoring and Balancing IC

4:30 – 5:10
Speaker: Lee Bell, STMicroelectronics

System suppliers are continuously working to maximize the capacity and lifetime of Li-Ion battery packs for rapidly growing applications such as electric vehicles, alternative energy, medical equipment, and others. ST’s new L9963 Cell Monitoring and Balancing IC assists with this by providing outstanding voltage measurement accuracy, on-chip cell balancing circuitry, battery pack current measurement with an integrated Coulomb Counter function, along with numerous inputs for temperature sensors and other signals. A full set of protection, diagnostic, and monitoring features ensure system integrity and safety. This presentation will highlight the key features of our new device and how it can enable development of high-performance energy storage systems.

Session 2 Abstracts

BLDC/PMSM Motor Fundamentals, Field-Oriented Control (FOC) and STSPIN32 Motor Control System-in-Package Family

9:45 – 10:25
Speaker: Cheng Peng, STMicroelectronics

3-phase BLDC/PMSM motors are being adopted by more and more home appliances and industrial applications including power tools, drones, E-bikes, E-scooters, pumps and compressors. This session will introduce attendees to the fundamentals and theory of BLDC/PMSM motor, Field-oriented control (FOC) algorithm, PWM driving and current sensing schemes. ST has recently added four new devices to the STSPIN32F0 motor-control system-in-package family. The new four members are 250 V STSPIN32F0251/STSPIN32F0252, and 600 V STSPIN32F0601/STSPIN32F0602 which combine three-phase gate drivers and an STM32F0 Arm® Cortex®-M0 microcontroller to simplify high-voltage BLDC/PMSM motor drive design. Various BLDC/PMSM motor control application examples based on the STSPIN32F0 family are provided in this session.

Understanding Operational Amplifier Parameters and Accuracy Measurements

10:45 – 11:25
Speaker: Gregory Gosciniak, STMicroelectronics

Sensors in today’s world are extensively used to measure weight, read temperature, evaluate gas concentration, identify VOC, control speed and more. Even though we live in an increasingly digital world, many sensors today are bound to operate in the analog domain. And most of them provide an extremely small signal that needs to be amplified, before being converted into bits of digital information for processing and visualization. Precision operational amplifiers are the primary link between these analog sensors and the digital world.

In this presentation, the theoretical foundations of precision in operational amplifiers will be explored, the fundamentals of the four underlying parameters affecting precision will be presented, and the theoretical and practical explanation of a gas sensor operation with ST’s TSZ121 zero drift operation amplifier will be presented.

Understanding LDO architectures and their impact on noise sensitive applications

11:30 – 12:10
Speaker: Allan Soriano, STMicroelectronics

Whether standalone or integrated inside PMICs, LDOs are the basic building block in most power supplies. In electronic systems that are susceptible to noise, as in RF transceivers with high sensitivity, data converters, and precision signal processing, a constant voltage supply free from unwanted disturbance is required for optimal performance. While the primary purpose of an LDO is to accurately generate a constant supply voltage to power an electronic circuit, the way LDOs operate also makes them very effective at filtering out upstream power supply noise, preventing disruptive electronic signals from affecting those noise-sensitive loads. This presentation will explore the most commonly used LDO architectures and explain how the dynamic characteristics of LDOs translate into a "clean" power supply voltage. The presentation will also address LDO thermal design and its control loop stability, in an effort to clear out common misunderstandings and avoid costly PCB design mistakes.

Introduction to Microsoft Azure IoT Services for the Intelligent Edge

1:15 – 1:55
Speaker: Jennifer Skinner-Grey, Microsoft

Microsoft is leading in IoT because we’re passionate about simplifying IoT so any company can benefit from it quickly and securely. IoT is transforming every business on the planet, and that transformation is accelerating. Companies are harnessing billions of IoT devices to help them find valuable insights into critical parts of their business that were previously not connected. Join us to learn more about the Azure IoT Services built for the Intelligent Edge.

Demonstrations will include Azure RTOS coupled with the foundational Azure IoT components connecting to the Azure IoT Hub Service on the STM32L4 Discovery kit IoT node, as well as the Azure IoT Edge Runtime with the STM32MP1 connected to Azure IoT Hub. Additionally, we will introduce new Azure IoT services planned for future releases.

A Breakthrough Innovation in MEMS Sensors: Smart Inertial Measurement Units (IMU) with a Machine Learning Core for Ultra-Low-Power Edge Nodes

2:00 – 2:40
Speaker: Simon Calleweart, STMicroelectronics

Machine Learning Core is a unique, revolutionary approach ST IMUs are offering. Machine Learning algorithms allow to build predictive models from large amount of training data. The Machine Learning Core enables running such predictive models, and specifically decision trees, inside an optimized core hosted in the IMU. This processing capability allows moving some algorithms from the host processor to the IMU. For typical tasks the IMU would consume less than one hundredth of the MCU power for the same task. This is a key enabler for ultralow-power edge-computing with the additional positive effect of reducing the amount of data to be transmitted to the cloud and will enable a new wave of consumer, Industrial or IoT applications.

Predictive Maintenance: Use of Advanced Sensors in Smart Industry Applications

3:00 – 3:40
Speaker: Simon Callewaert, STMicroelectronics

In this session we’ll discuss the use of various sensing technologies applied to Condition Monitoring of an asset: vibration analysis, environmental sensing, use of ultrasound. We’ll present the development kits available from ST and a development path from Condition Monitoring to Predictive Maintenance using an end to end platform Sensors to Cloud.

Jump start your IOT Design with BlueNRG Bluetooth Low Energy Modules

3:45 – 4:25
Speaker: Julio Sanchez, STMicroelectronics

Learn how STMicroelectronics' new Bluetooth Low Energy modules can allow you to boost your IoT product time-to-market. The new BlueNRG modules are all based on the BlueNRG SoC series and come with the same suite of easy-to-use hardware and software that have made BlueNRG an award-winning series. In addition, we will also review the ST Bluetooth Mesh SDK that allows the expansion of your network made up of BlueNRG modules.

You will learn:

  • The fundamentals of the Bluetooth Low Energy BlueNRG SoC’s
  • The product range of the new BlueNRG modules
  • How to take advantage of the easy-to-use BlueNRG SDK
  • How to get started with Bluetooth mesh onto the new BlueNRG modules
  • Where to find the associated resources

Ultrasound for Real Life Applications

4:30 – 5:10
Speaker: Steffen Grahlmann, STMicroelectronics

Advances in semiconductor process technology in recent years have made it possible to dramatically miniaturize the key components of systems that generate and analyze ultrasound waves. This miniaturization and consequent cost reduction created a host of new application fields for ultrasound systems beyond the traditional focus of medical imaging.

In this talk we will cover the physics of ultrasound waves, the components of a typical ultrasound system and discuss concrete application examples for distance measurement, flow rate measurement, presence and obstacle detection as well as structural integrity testing (NDT). The presentation will also provide an overview of ST’s application specific standard products and the relevant eval tools that make application development simple.

Session 3 Abstracts

Simplifying Wireless IoT application Development using the SensorTile.Box kit – Hands-on Workshop

9:30 – 12:15
Speaker: Edoardo Gallizio & the STMicroelectronics team

Looking to develop applications that use Motion and Environmental MEMS sensors? This workshop will show you how to use the STEVAL-MKSBOX1V1 (SensorTile.Box), a ready-to-use kit for wireless IoT applications.

The SensorTile.Box features ST newest sensors including LSM6DSOX – IMU with Finite State Machine and Machine Learning Core, LIS2DW12 – ultra low-power Accelerometer, LIS3DHH ultra low-noise Accelerometer, LIS2MDL – wide dynamic range Magnetometer, LPS22HH – improved accuracy barometric Pressure sensor, HTS221 – Relative Humidity and ambient Temperature sensor, STTS751 – on-board Temperature sensor to support temperature compensation, and MP23ABS1 – high performance analog Microphone. The ultra low-power Cortex-M4F STM32L4 provides all the processing capabilities that may be required by the application, while the Bluetooth low-energy module SPBTLE-1S provides the connectivity capabilities to interact with and stream to mobile phones.

The workshop will show how to use the SensorTile.Box out of the box (entry level mode) with many read-to-use applications to set up sensors, log sensor data, leverage embedded smart sensor functions (pedometer), and perform high-level processing (sensor fusion); the workshop will also show how to build a custom application (expert mode) using the GUI in the ST BLE Sensor app to build the data and control flow; and finally it will show how to develop a custom firmware (pro mode) starting from the examples available in the Function Pack FP-SNS-STBOX1. Join us and learn how the SensorTile.Box wireless IoT kit can simplify your next application development.

This a working session. For the training on the entry-level and expert mode, participants will need their mobile phone, Android or iOS, with the ST BLE Sensor app installed. For the training on pro mode, participants will need their own laptop running Windows 7 or later, or a MacBook running Windows (Parallels, VM Fusion, etc.); participants should have a basic understanding of the “C” programming language or equivalent. Note: Administrator rights are needed for software and driver installation. ST will provide the development kit and all software. You must stay for the training session to receive the free kit.

SPACE IS LIMITED FOR THIS SESSION – FIRST COME, FIRST SEATED. Must be present and stay for training to receive the free kit.

NFC Reader Design and Optimization

1:15 – 1:55
Speaker: Dan Merino, STMicroelectronics

This session will cover the basic principles of reader antenna matching network design including optimization for card emulation mode. The course will start with measuring antenna parameters, followed by using the antenna design tool and finally optimizing the design for read range vs current consumption. Product families and design tools available for customers will also be covered.

Explore the NFC technology in your Androids and iPhones

2:00 – 4:30
Speaker: John Tran & the STMicroelectronics Team

Pair, transfer data, change setting, update firmware and wakeup/power up the ST25DV-Discovery with Bluetooth + Wifi module. Also learn the physics behind NFC and design your own antennas.

SPACE IS LIMITED FOR THIS SESSION – FIRST COME, FIRST SEATED. Must be present and stay for training to receive the free kit.

Session 4 Abstracts

Introduction to the STM32MP1 Microprocessor Series

10:30 – 11:10
Speaker: Greg Davis, STMicroelectronics

Leveraging the unparalleled success of the STM32, ST recently announced the newest addition to the family, the STM32MP1. This general purpose multicore microprocessor series will facilitate development of high-performance solutions for Industrial, Consumer, Medical and Smart Home applications. This session will introduce attendees to the STM32MP1, its features and capabilities, the available tools, and the ecosystem around it.

System in Package: Simplifying Your STM32MP1 Designs

10:45 – 11:25
Speaker: Martin Burgos, Octavo

The future of device integration has arrived. System in Package leverages IC manufacturing processes to deliver smaller designs, faster and at a lower cost. Bringing this technology to the new STM32MP1, Octavo Systems has created a module that delivers the performance of the MP1 in a package that is up to 64% smaller and feels like a microcontroller. This talk will introduce you to System in Package technology and demonstrate how the OSD32MP15x System in Package module can simplify your design using the STM32MP1 microprocessor getting you to market faster.

Create High Performance UIs for Smart Devices from the STM32 Family

11:30 – 12:10
Speaker: Corey Pendleton, Field Application Engineer, The Qt Company

Optimizing the IoT experience is critical to success as users demand smartphone-like performance and seamlessness on traditionally dumb devices. Creating rich UIs while keeping costs low becomes crucial to success. Join us for a free kickstart to develop rich graphical applications for microcontrollers using Qt’s industry-leading tools and libraries that will work out-of-the-box with the STM32 family. For the past 25 years, Qt has been the leading independent technology used to develop millions of devices running on microprocessors. With the recently announced Qt for Microcontrollers (MCUs) product, you can now also design low cost projects without compromising on performance.

Accelerating the Human-Machine Interface (HMI) of Things with STM32 and TouchGFX

1:15 – 4:45
Speaker: The STMicroelectronics team

Attend this hands-on workshop to gain knowledge and practical experience with the STM32H7 microcontroller and the TouchGFX graphics framework. If you are an embedded developer interested in microcontroller-based graphics applications, this workshop will teach you how to advance your product’s HMI (Human-Machine Interface) to improve the user experience. There will be hands-on labs using TouchGFX Designer, STM32CubeMX, the new X-Cube-TouchGFX package, and STM32CubeIDE, along with the STM32H7B3I Discovery kit.

SPACE IS LIMITED FOR THIS SESSION – FIRST COME, FIRST SEATED. Must be present and stay for training to receive the free kit.



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