产品概述
描述
The TSV619x family of single and dual operational amplifiers offers low voltage, low power operation, and rail-to-rail input and output. The devices also feature an ultra-low input bias current as well as a low input offset voltage.The TSV619x have a gain bandwidth product of 450 kHz while consuming only 10 μA at 5 V. They must be used in a gain configuration (equal or above 4 or -3).
These features make the TSV619x family ideal for sensor interfaces, battery supplied and portable applications, as well as active filtering.
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所有功能
- Rail-to-rail input and output
- Low power consumption: 10 μA typ at 5 V
- Low supply voltage: 1.5 to 5.5 V
- Gain bandwidth product: 450 kHz typ
- Stable when used in gain configuration
- Low input offset voltage: 800 μV max (A version)
- Low input bias current: 1 pA typ
- Temperature range: -40 to 85 °C
All tools & software
All resources
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产品规格 (1)
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| 30 May 2017 |
30 May 2017
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技术文档 (1)
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| 19 Jul 2017 |
19 Jul 2017
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用户手册 (1)
| Resource title | Latest update | |||
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| 27 Jun 2017 |
27 Jun 2017
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Design Notes & Tips (1)
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|---|---|---|---|---|
| 13 Sep 2018 |
13 Sep 2018
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简报 (4)
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| 18 Jan 2017 |
18 Jan 2017
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| 23 Mar 2021 |
23 Mar 2021
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| 18 Jan 2017 |
18 Jan 2017
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| 29 May 2015 |
29 May 2015
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选型指南 (1)
| Resource title | Latest update | |||
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| 25 Oct 2016 |
25 Oct 2016
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手册 (3)
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| 19 Mar 2021 |
19 Mar 2021
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| 26 Aug 2019 |
26 Aug 2019
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| 08 Apr 2021 |
08 Apr 2021
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EDA Symbols, Footprints and 3D Models
STMicroelectronics - TSV6191
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
All resources
| Resource title | Latest update |
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SPICE models (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| ZIP | 18 May 2015 |
18 May 2015
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质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| TSV6191ICT |
批量生产
|
SC70-5 | 工业 | Ecopack3 |
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| TSV6191ILT |
批量生产
|
SOT23-5L | 工业 | Ecopack3 |
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TSV6191ICT
Package:
SC70-5Material Declaration**:
TSV6191ILT
Package:
SOT23-5LMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持 。
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| TSV6191ILT | 1 distributors | Free Sample Buy Direct |
批量生产
|
EAR99 | NEC | Tape And Reel | SOT23-5L | -40 | 85 | MALAYSIA | 0.3 / 1k | |
| TSV6191ICT | 无法联系到经销商，请联系我们的销售办事处 |
批量生产
|
EAR99 | NEC | Tape And Reel | SC70-5 | -40 | 85 | MALAYSIA | 0.3 / 1k | ||
供货状态
批量生产ECCN (US)
EAR99Budgetary Price (US$)*/Qty
0.3 / 1k