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The TSV6290 and the TSV6291 are single operational amplifiers with a high bandwidth which consume only 29 µA. They must be used in a gain configuration (G < -3, G > 4).
With a very low input bias current and low offset voltage (800 µV maximum for the A version), the TSV629x family of devices is ideal for applications requiring precision. The devices can operate at a power supply ranging from 1.5 to 5.5 V, and therefore suit battery-powered devices, extending battery life.
The TSV6290 comes with a shutdown function.
The TSV6290 and TSV6291 present a high tolerance to ESD, sustaining 4 kV for the human body model.
The TSV6290 and TSV6291 are offered in SOT23-5/6 and SC70-5/6 micropackages, with extended temperature ranges from -40 °C to 125 °C.
All these features make the TSV629x ideal for sensor interfaces, battery-supplied and portable applications, as well as active filtering.主要特性
- Low supply voltage: 1.5 V – 5.5 V
- Rail-to-rail input and output
- Low input offset voltage: 800 µV max (A version)
- Low power consumption: 29 µA typical
- Gain bandwidth product: 1.3 MHz typical
- Stable when used in gain configuration
- Micropackages: SOT23-5/6, SC70-5/6
- Low input bias current: 1 pA typical
- Extended temperature range: -40 to 125 °C
- 4 kV human body model
All tools & software
All resources
产品规格 (1)
| Resource title | Latest update | |||
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| 25 Sep 2020 |
25 Sep 2020
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技术文档 (1)
| Resource title | Latest update | |||
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| 19 Jul 2017 |
19 Jul 2017
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用户手册 (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 27 Jun 2017 |
27 Jun 2017
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Design Notes & Tips (1)
| Resource title | Latest update | |||
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| 13 Sep 2018 |
13 Sep 2018
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简报 (4)
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| 18 Jan 2017 |
18 Jan 2017
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| 29 May 2015 |
29 May 2015
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选型指南 (1)
| Resource title | Latest update | |||
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| 25 Oct 2016 |
25 Oct 2016
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手册 (4)
| Resource title | Latest update | |||
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| 05 Jun 2020 |
05 Jun 2020
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26 Aug 2019
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| 19 Sep 2019 |
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EDA Symbols, Footprints and 3D Models
STMicroelectronics - TSV6291
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
All resources
硬件型号、CAD库及SVD (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| ZIP | 14 Mar 2016 |
14 Mar 2016
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质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| TSV6291ICT |
批量生产
|
SC70-5 | 工业 | Ecopack3 |
|
| TSV6291ILT |
批量生产
|
SOT23-5L | 工业 | Ecopack3 |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持 。
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| TSV6291ICT | 2 distributors | Buy Direct |
批量生产
|
EAR99 | NEC | Tape And Reel | SC70-5 | -40 | 125 | MALAYSIA | 0.3 / 1k | |
| TSV6291ILT | 2 distributors | Buy Direct |
批量生产
|
EAR99 | NEC | Tape And Reel | SOT23-5L | -40 | 125 | MALAYSIA | 0.3 / 1k | |
