Product overview
描述
FP-IND-IODSNS1 is an STM32Cube function pack which lets you enable IO-Link communication between P-NUCLEO-IOD02A1 kit and an IO-Link master through the L6364Q transceiver mounted on the X-NUCLEO-IOD02A1. The function pack integrates an IO-Link demo-stack and the management of the industrial sensors mounted on the X-NUCLEO-IKS02A1.
FP-IND-IODSNS1 also includes the IODD file to be uploaded to your IO-Link master.
The software included in the package can be used in three integrated development environments (IDEs): IAR, KEIL and STM32CubeIDE.
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All features
- Complete firmware to build IO-Link device applications for STM32L452RE-based boards
- Middleware libraries featuring IO-Link device mini-stack for L6364Q and MEMS plus digital microphone management
- Ready-to-use binary for IO-Link device sensor data transmission
- Easy portability across different MCU families, thanks to STM32Cube
- Free, user-friendly license terms
获取软件
| 产品型号 | 一般描述 | Software Version | 供应商 | 下载 |
|---|---|---|---|---|
| FP-IND-IODSNS1 | STM32Cube function pack for P-NUCLEO-IOD02A1, with IO-Link stack v1.1, IODD and control software for industrial sensors | 1.0.0 | ST |
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许可协议接受BY INSTALLING COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF (AND THE RELATED DOCUMENTATION) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (STMICROELECTRONICS), THE RECIPIENT, ON BEHALF OF HIMSELF OR HERSELF, OR ON BEHALF OF ANY ENTITY BY WHICH SUCH RECIPIENT IS EMPLOYED AND/OR ENGAGED AGREES TO BE BOUND BY THIS SOFTWARE PACKAGE LICENSE AGREEMENT. Under STMicroelectronics’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in this software package and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the software package or any part thereof, with or without modification, are permitted provided that the following conditions are met:
THIS SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THIS SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY. |
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All resources
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许可协议 (1)
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