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The X-CUBE-PERF-H7 Expansion Package aims to demonstrate the performance of the STM32H74x and STM32H75x architecture with its Cortex®-M7 able to run at up to 480 MHz, and its instruction and data caches that unleash core performance with 0-wait-state-like execution from different memories, either internal or external, scattered across different domains (D1, D2, and D3) and accessed by the core either through the TCM buses or the AXIM bus.
The Expansion Package is provided with several project configurations for the STM32H743I-EVAL Evaluation board. Each project allows the execution of application code and data storage in different memory locations such as internal memories as well as external memories located in different domains (D1, D2 and D3). Firmware results demonstrate that performance is almost the same when internal memories or external memories or different domains are used for code execution or data storage. An FFT use case (provided by the CMSIS library) is proposed as an example with several toolchains: Keil® (MDK-ARM), IAR™ (EWARM), and System Workbench (SW4STM32). It can be ported easily to any other toolchain and any STM32H7xx single-core device.
主要特性
- STM32H74x and STM32H75x performance demonstrator
- Code execution and data storage in different memory locations
- Cortex®-M7
- Instruction cache (I-Cache)
- Data cache (D-Cache)
- D1, D2, and D3 domains
- AXI and AHB bus matrices
获取软件
| 产品型号 | 一般描述 | Software Version | 供应商 | GitHub link | 下载 |
|---|---|---|---|---|---|
| X-CUBE-PERF-H7 | STM32H7 performance software expansion for STM32Cube (AN4891) | 1.0.0 | ST | - | x 许可协议接受Please indicate your acceptance or NON-acceptance by selecting “I ACCEPT” or “I DO NOT ACCEPT” as indicated below in the media. BY INSTALLING COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF (AND THE RELATED DOCUMENTATION) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (STMICROELECTRONICS), THE RECIPIENT, ON BEHALF OF HIMSELF OR HERSELF, OR ON BEHALF OF ANY ENTITY BY WHICH SUCH RECIPIENT IS EMPLOYED AND/OR ENGAGED AGREES TO BE BOUND BY THIS SOFTWARE PACKAGE LICENSE AGREEMENT. Under STMicroelectronics’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in this software package and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the software package or any part thereof, with or without modification, are permitted provided that the following conditions are met:
THIS SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THIS SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY. |
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