- Low clamping voltage
- Easy layout and flexibility thanks to I/O topology
- High reduction of parasitic elements through integration and wafer level packaging.
- High reliability offered by monolithic integration
- SIM card EMI low-pass filter
- Very low PCB space consumption: 1.7 mm x 1.5 mm
- High efficiency in EMI filtering
- High efficiency in ESD suppression on external pins (IEC 61000-4-2 level 4).
- Lead free package
- Very thin package: 0.6 mm max
Smart Antenna Tuning with STMicroelectronics (all LTE bands)
Antenna desense medication with ECMF™ common-mode filters integrating ESD protection
STHVDAC, STPTIC: better sensitivity and longer battery life
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(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.