产品概述
描述
The STM32MP157A-DK1 and STM32MP157C-DK2 Discovery kits leverage the capabilities of STM32MP1 Series microprocessors to allow users easily develop applications using STM32 MPU OpenSTLinux Distribution software for the main processor and STM32CubeMP1 software for the co-processor. They include an ST-LINK embedded debug tool, LEDs, push-buttons, one Ethernet 1-Gbps connector, one USB Type-CTM OTG connector, four USB Type-A Host connectors, one HDMI® transceiver, one stereo headset jack with analog microphone, and one microSDTM connector.To expand the functionality of the STM32MP157A-DK1 and STM32MP157C-DK2 Discovery kits, two GPIO expansion connectors are also available for ARDUINO® and Raspberry Pi® shields.
Additionally, the STM32MP157C-DK2 Discovery kit features an LCD display with a touch panel, and Wi-Fi® and Bluetooth® Low Energy capability.
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所有功能
- Common features
- STM32MP157 Arm®-based dual Cortex®-A7 32 bits + Cortex®-M4 32 bits MPU in TFBGA361 package
- ST PMIC STPMIC1
- 4-Gbit DDR3L, 16 bits, 533 MHz
- 1-Gbps Ethernet (RGMII) compliant with IEEE-802.3ab
- USB OTG HS
- Audio codec
- 4 user LEDs
- 2 user and reset push-buttons, 1 wake-up button
- 5 V / 3 A USB Type-CTM power supply input (not provided)
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Board connectors:
Ethernet RJ45 4 × USB Host Type-A USB Type-CTM DRP MIPI DSISM HDMI® Stereo headset jack including analog microphone input microSDTM card GPIO expansion connector (Raspberry Pi® shields capability) ARDUINO® Uno V3 expansion connectors - On-board ST-LINK/V2-1 debugger/programmer with USB re-enumeration capability: Virtual COM port and debug port
- STM32CubeMP1 and full mainline open-source Linux® STM32 MPU OpenSTLinux Distribution (such as STM32MP1Starter) software and examples
- Support of a wide choice of Integrated Development Environments (IDEs) including IARTM, Keil®, GCC-based IDEs
- Board-specific features
- 4" TFT 480×800 pixels with LED backlight, MIPI DSISM interface, and capacitive touch panel
- Wi-Fi® 802.11b/g/n
- Bluetooth® Low Energy 4.1
- Common features
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产品规格 (1)
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26 Aug 2019
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技术文档 (1)
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21 Nov 2019
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用户手册 (1)
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26 Mar 2019
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简报 (2)
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宣传册 (1)
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14 Apr 2020
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许可协议 (1)
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21 Sep 2016
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Evaluation Board Terms of Use (1)
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All resources
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Board Manufacturing Specifications (2)
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25 Jan 2019
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25 Jan 2019
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物料清单 (1)
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ZIP | 25 Jan 2019 |
25 Jan 2019
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Schematic Pack (1)
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06 Feb 2019
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质量与可靠性
产品型号 | Marketing Status | 符合RoHS级别 | 材料声明** |
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STM32MP157A-DK1 |
NRND
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Ecopack1 |
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STM32MP157A-DK1
Package:
Ecopack1Material Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持 。
样片和购买
产品型号 | 从分销商订购 | 从ST订购 | 核心产品 | 供货状态 | 供应商 | ECCN (US) | ECCN (EU) | Specific features | Country of Origin | WEEE Compliant | Budgetary Price (US$)*/Qty | |
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STM32MP157A-DK1 | 5 distributors | STM32MP157AAC3 |
NRND
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ST | 3A991A2 | NEC | - | CHINA | true | 69.0 / 1 |
核心产品
STM32MP157AAC3供货状态
NRNDBudgetary Price (US$)*/Qty
69.0 / 1