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The enhanced embedded sensor topology of the STREF-MKI128V6 MEMS sensor module helps you save development time and effort for your applications. This compact board integrates the iNEMO inertial module (LSM6DSM) with 3D accelerometer and 3D gyroscope that is particularly suitable for smartphones with OIS/ EIS and AR/VR systems, a magnetometer (LIS2MDL), a dust-resistant full-mold absolute pressure sensor (LPS22HB), and a relative humidity and temperature sensor (HTS221).
主要特性
- The board integrates:
- iNEMO inertial module LSM6DSM
- Magnetometer LIS2MDL
- Pressor sensor LPS22HB
- Relative Humidity and temperature sensor HTS221
- WEEE compliant
- RoHS compliant
- The board integrates:
样片和购买
| 产品型号 | 核心产品 | 供货状态 | ECCN (US) | Country of Origin | Budgetary Price (US$)*/Qty | 从ST订购 | 从分销商订购 |
|---|---|---|---|---|---|---|---|
| STREF-MKI128V6 | LSM6DSM, LIS2MDL, LPS22HB, HTS221 | 批量生产 | - | - | 没有经销商，请联系我们的销售办事处 |
STREF-MKI128V6
核心产品
LSM6DSM, LIS2MDL, LPS22HB, HTS221供货状态
批⁠量⁠生⁠产Budgetary Price (US$)*/Qty
| 产品型号 | 供货状态 | 封装 | 等级规格 | 符合RoHS级别 | WEEE Compliant | 材料声明** |
|---|---|---|---|---|---|---|
| STREF-MKI128V6 | 批量生产 | CARD | Industrial | - | - | |
STREF-MKI128V6
Package:
CARDMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持 。
