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The enhanced embedded sensor topology of the STREF-MKI128V6 MEMS sensor module helps you save development time and effort for your applications. This compact board integrates the iNEMO inertial module (LSM6DSM) with 3D accelerometer and 3D gyroscope that is particularly suitable for smartphones with OIS/ EIS and AR/VR systems, a magnetometer (LIS2MDL), a dust-resistant full-mold absolute pressure sensor (LPS22HB), and a relative humidity and temperature sensor (HTS221).
主要特性
- The board integrates:
- iNEMO inertial module LSM6DSM
- Magnetometer LIS2MDL
- Pressor sensor LPS22HB
- Relative Humidity and temperature sensor HTS221
- WEEE compliant
- RoHS compliant
- The board integrates:
样片和购买
| 产品型号 | 核心产品 | 供货状态 | 预算价格(US$) | 数量 | ECCN (US) | Country of Origin | 从分销商订购 | 从ST订购 |
|---|---|---|---|---|---|---|---|---|
| STREF-MKI128V6 | LSM6DSM, LIS2MDL, LPS22HB, HTS221 |
Active
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- | - | - | - | No availability of distributors reported, please contact our sales office |
STREF-MKI128V6
核心产品
LSM6DSM, LIS2MDL, LPS22HB, HTS221供货状态
批量生产Unit Price (US$)
*(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
| 产品型号 | 供货状态 | 封装 | 等级规格 | 符合RoHS级别 | WEEE Compliant | 材料声明** |
|---|---|---|---|---|---|---|
| STREF-MKI128V6 |
Active
|
CARD | 工业 | - | - |
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STREF-MKI128V6
Package:
CARDMaterial Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
