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The enhanced embedded sensor topology of the STREF-MKI128V6 MEMS sensor module helps you save development time and effort for your applications. This compact board integrates the iNEMO inertial module (LSM6DSM) with 3D accelerometer and 3D gyroscope that is particularly suitable for smartphones with OIS/ EIS and AR/VR systems, a magnetometer (LIS2MDL), a dust-resistant full-mold absolute pressure sensor (LPS22HB), and a relative humidity and temperature sensor (HTS221).
主要特性
- The board integrates:
- iNEMO inertial module LSM6DSM
- Magnetometer LIS2MDL
- Pressor sensor LPS22HB
- Relative Humidity and temperature sensor HTS221
- WEEE compliant
- RoHS compliant
- The board integrates:
样片和购买
| 型号 | Core Product | Marketing Status | Budgetary Price (US$)* | Quantity | ECCN (US) | Country of Origin | Order from Distributors | Order from ST |
|---|---|---|---|---|---|---|---|---|
| STREF-MKI128V6 | LSM6DSM, LIS2MDL, LPS22HB, HTS221 |
Active
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- | - | - | - | No availability of distributors reported, please contact our sales office |
STREF-MKI128V6
Core Product
LSM6DSM, LIS2MDL, LPS22HB, HTS221Marketing Status
ActiveUnit Price (US$)
*(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
| 型号 | Marketing Status | Package | Grade | RoHS Compliance Grade | WEEE Compliant | Material Declaration** |
|---|---|---|---|---|---|---|
| STREF-MKI128V6 |
Active
|
CARD | 工业 | - | - |
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STREF-MKI128V6
Package:
CARDMaterial Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
