产品概述
描述
The EVALSTGAP2HSCM is an isolated single gate driver.
The gate driver is characterized by 4 A current capability and rail-to-rail outputs, making the device suitable also for high power inverter applications such as motor drivers in industrial applications equipped with MOSFET / IGBT power switch.
The configuration featuring single output pin and Miller CLAMP function allows avoiding gate spikes during fast commutations in half-bridge topologies.
The device integrates protection functions: UVLO and thermal shutdown are included to easily design high reliability systems. Dual input pins allow choosing the control signal polarity and also implementing HW interlocking protection in order to avoid cross-conduction in case of controller's malfunction.
The device allows implementing negative gate driving, and the onboard isolated DC-DC converters allow working with optimized driving voltage for MOSFET/IGBT.
The EVALSTGAP2HSCM board allows evaluating all the STGAP2HSCM features while driving a half-bridge power stage with voltage rating up to 1200 V in TO-220 or TO-247 package.
The board allows easily selecting and modifying the values of relevant external components in order to ease driver performance evaluation under different applicative conditions and fine pre-tuning of the final application’s components.
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所有功能
- Board
- High voltage rail up to 1200 V
- Negative gate driving
- Onboard isolated DC-DC converters to supply high-side and low-side gate drivers, fed by VAUX = 5 V, with 5.2 kV maximum isolation
- 3.3 V VDD logic supply generated onboard or 5 V (externally applied)
- Easy jumper selection of driving voltage configuration: +15/0 V; +15/-3 V; +19/0 V; +19/-3 V;
- Device
- Driver current capability: 4 A source/sink @ 25°C
- 6000 V Galvanic isolation
- Short propagation delay: 75 ns
- UVLO function
- Gate driving voltage up to 26 V
- 3.3 V, 5 V TTL/CMOS inputs with hysteresis
- Temperature shutdown protection
- Standby function
- 4 A Miller CLAMP
- Board
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质量与可靠性
产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | WEEE Compliant | 材料声明** |
---|---|---|---|---|---|---|
EVALSTGAP2HSCM | 批量生产 | CARD | 工业 | Ecopack1 | - | |
EVALSTGAP2HSCM
Package:
CARDMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持。
样片和购买
产品型号 | Order from distributors | 从ST订购 | 核心产品 | 供货状态 | 供应商 | ECCN (US) | ECCN (EU) | Country of Origin | Budgetary Price (US$)*/Qty | |
---|---|---|---|---|---|---|---|---|---|---|
EVALSTGAP2HSCM | distributors 无法联系到经销商,请联系我们的销售办事处 | STGAP2HS | 批量生产 | ST | EAR99 | NEC | ITALY | |