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The ISM330DLC is a system-in-package featuring a high-performance 3D digital accelerometer and 3D digital gyroscope tailored for Industry 4.0 applications.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
In the ISM330DLC the sensing element of the accelerometer and of the gyro are implemented on the same silicon die, thus guaranteeing superior stability and robustness.
The ISM330DLC has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
Delivering high accuracy and stability with ultra-low power consumption (0.75 mA in high-performance, combo mode) enables, also in the industrial domain, long-lasting battery-operated applications.
The ISM330DLC includes a dedicated configurable signal processing path with low latency, low noise and dedicated filtering specifically intended for control loop stability. Data from this dedicated signal path can be made available through an auxiliary SPI interface, configurable for both the gyroscope and accelerometer. High-performance, high-quality, small size and low power consumption together with high robustness to mechanical shock makes the ISM330DLC the preferred choice of system designers for the creation and manufacturing of versatile and reliable products.
The ISM330DLC is available in a plastic, land grid array (LGA) package.主要特性
- 3D accelerometer with selectable full scale: ±2/±4/±8/±16 g
- 3D gyroscope with selectable full scale: ±125/±250/±500/±1000/±2000 dps
- Analog supply voltage: 1.71 V to 3.6 V
- SPI & I²C serial interface with main processor data synchronization
- Dedicated gyroscope output chain with low latency, low noise and dedicated low-pass filters for control loop stability (OIS and other stabilization applications)
- Auxiliary SPI serial interface for independent, low-noise low-latency data output for gyroscope and accelerometer
- Ultra-low power consumption for both accelerometer and gyroscope enabling long-lasting battery-operated applications: 0.5 mA in combo normal mode and 0.75 mA in combo high-performance mode
- Smart FIFO up to 4 kbyte
- Smart embedded functions and interrupts: tilt detection, free-fall, wakeup, 6D/4D orientation, click and double-click
- Sensor hub feature to efficiently collect data from additional external sensors
- Embedded hard, soft ironing for external magnetic sensor corrections
- Embedded temperature sensor
- Embedded self-test both for gyroscope and accelerometer
- High shock survivability
- Extended operating temperature range (-40°C to +85°C)
- ECOPACK®, RoHS and “Green” compliant
样片和购买
| 型号 | Package | Packing Type | Marketing Status | Budgetary Price (US$)* | Quantity | ECCN (US) | Country of Origin | Order from Distributors | Order from ST |
|---|---|---|---|---|---|---|---|---|---|
| ISM330DLCTR | VFLGA2.5X3X.86 14L P.5 L.475X.25 | Tape And Reel |
Active
|
2.9 | 1000 | EAR99 | PHILIPPINES | Check Availability | Get sample |
(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
精选 视频
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生态系统
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Picture Part number 制造商 Description AWS IoT Core AWS AWS IoT Core is a managed cloud platform that lets connected devices easily and securely interact with cloud applications and other devices. AZURE Cloud Microsoft Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks. Watson IoT Platform IBM IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices. 型号AWS IoT Core is a managed cloud platform that lets connected devices easily and securely interact with cloud applications and other devices.
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IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.
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Picture Part number 制造商 Description 6DOF IMU 8 click MikroElektronika 6DOF IMU 8 click is an advanced 6-axis motion tracking Click board™, which utilizes the ISM330DLC, a high-performance System in Package (SiP), equipped with a 3-axis gyroscope, and a 3-axis accelerometer. 型号6DOF IMU 8 click is an advanced 6-axis motion tracking Click board™, which utilizes the ISM330DLC, a high-performance System in Package (SiP), equipped with a 3-axis gyroscope, and a 3-axis accelerometer.
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软件
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Picture Part number 制造商 Description AndroidHAL-IIO ST Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework) AndroidHALInput ST Android sensor HAL for MEMS motion and environmental sensors (Input framework) C-Driver-MEMS ST Standard C platform-independent drivers for MEMS motion and environmental sensors LinuxDriverIIO ST Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework) LinuxDriverInput ST Linux device drivers for MEMS motion and environmental sensors (Input framework) 型号Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)
Android sensor HAL for MEMS motion and environmental sensors (Input framework)
Standard C platform-independent drivers for MEMS motion and environmental sensors
Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework)
Linux device drivers for MEMS motion and environmental sensors (Input framework)
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评估工具
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Picture Part number 制造商 Description 
STEVAL-MKI182V1 ST ISM330DLC adapter board for a standard DIL24 socket 
STEVAL-MKI182V2 ST ISM330DLC adapter board for a standard DIL24 socket 型号ISM330DLC adapter board for a standard DIL24 socket
ISM330DLC adapter board for a standard DIL24 socket
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Picture Part number 制造商 Description 
STEVAL-BFA001V1B ST Predictive maintenance kit with sensors and IO-Link capability 型号Predictive maintenance kit with sensors and IO-Link capability
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支持和应用
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Picture Part number 制造商 Description SensorTile.box customization services FAE Technology Engineering services on theSensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing. 型号Engineering services on theSensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.
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| 型号 | Marketing Status | Package | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|
| ISM330DLCTR |
Active
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VFLGA2.5X3X.86 14L P.5 L.475X.25 | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
