iNEMO 6DoF inertial measurement unit (IMU), for consumer electronics

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  • The LSM6DS3 is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope performing at 1.25 mA (up to 1.6 kHz ODR) in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.

    The LSM6DS3 supports main OS requirements, offering real, virtual and batch sensors with 8 kbyte for dynamic data batching.
    ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
    The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
    The LSM6DS3 has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
    High robustness to mechanical shock makes the LSM6DS3 the preferred choice of system designers for the creation and manufacturing of reliable products.
    The LSM6DS3 is available in a plastic land grid array (LGA) package.

    主要特性

    • Power consumption: 0.9 mA in combo normal mode and 1.25 mA in combo high-performance mode up to 1.6 kHz.
    • “Always-on” experience with low power consumption for both accelerometer and gyroscope
    • Smart FIFO up to 8 kbyte based on features set
    • Compliant with Android K and L
    • Hard, soft ironing for external magnetic sensor corrections
    • ±2/±4/±8/±16 g full scale
    • ±125/±250/±500/±1000/±2000 dps full scale
    • Analog supply voltage: 1.71 V to 3.6 V
    • Independent IOs supply (1.62 V)
    • Compact footprint, 2.5 mm x 3 mm x 0.83 mm
    • SPI/I2C serial interface with main processor data synchronization feature
    • Embedded temperature sensor
    • ECOPACK®, RoHS and “Green” compliant

样片和购买

产品型号
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包装类型
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LSM6DS3TR VFLGA 2.5X3X0.86 14L Tape And Reel
批量生产
1.771 1000 EAR99 - 查看供货情况

Distributor availability ofLSM6DS3TR

代理商名称
地区 库存 最小订购量 Third party link
RS COMPONENTS EUROPE 2714 2 Order Now
ARROW EUROPE 20098 0 Order Now
ARROW AMERICA 42338 5000 Order Now
P&S ASIA/PACIFIC 433 1 Order Now

代理商库存报告日期: 2019-12-08

代理商名称

RS COMPONENTS

库存

2714

Min.Order

2

地区

EUROPE Order Now

ARROW

库存

20098

Min.Order

0

地区

EUROPE Order Now

ARROW

库存

42338

Min.Order

5000

地区

AMERICA Order Now

P&S

库存

433

Min.Order

1

地区

ASIA/PACIFIC Order Now

代理商库存报告日期: 2019-12-08

LSM6DS3 VFLGA 2.5X3X0.86 14L Tray
预览
- - EAR99 - 没有经销商,请联系我们的销售办事处

LSM6DS3TR

封装

VFLGA 2.5X3X0.86 14L

包装类型

Tape And Reel

单价(US$)

1.771*

Distributor availability ofLSM6DS3TR

代理商名称
地区 库存 最小订购量 Third party link
RS COMPONENTS EUROPE 2714 2 Order Now
ARROW EUROPE 20098 0 Order Now
ARROW AMERICA 42338 5000 Order Now
P&S ASIA/PACIFIC 433 1 Order Now

代理商库存报告日期: 2019-12-08

代理商名称

RS COMPONENTS

库存

2714

Min.Order

2

地区

EUROPE Order Now

ARROW

库存

20098

Min.Order

0

地区

EUROPE Order Now

ARROW

库存

42338

Min.Order

5000

地区

AMERICA Order Now

P&S

库存

433

Min.Order

1

地区

ASIA/PACIFIC Order Now

代理商库存报告日期: 2019-12-08

供货状态

批量生产

单价(US$)

1.771

数量

1000

ECCN (US)

EAR99

Country of Origin

-

LSM6DS3

封装

VFLGA 2.5X3X0.86 14L

包装类型

Tray

单价(US$)

*

供货状态

预览

单价(US$)

-

数量

-

ECCN (US)

EAR99

Country of Origin

-

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商

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生态系统

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软件

    • 产品型号

      Sensor and DSP algorithm software expansion for STM32Cube

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    • 产品型号

      Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)

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      Standard C platform-independent drivers for MEMS motion and environmental sensors

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      Linux device drivers for MEMS motion and environmental sensors (Input framework)

评估工具

    • 产品型号

      LSM6DS3 adapter board for standard DIL24 socket

    • 产品型号

      Wearable sensor unit reference design for fast time to market

支持和应用

    • 产品型号

      Engineering services on theSensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.

00 选择要下载的文档

技术文档

    • 描述 版本 文档大小 操作
      DS10591
      iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope
      10.0
      1.42 MB
      PDF
      DS10591

      iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope

    • 描述 版本 文档大小 操作
      AN4650
      LSM6DS3:始终开启的3D 加速度计和3D 陀螺仪
      1.0
      1.71 MB
      PDF
      AN4650

      LSM6DS3:始终开启的3D 加速度计和3D 陀螺仪

    • 描述 版本 文档大小 操作
      TN0018
      LGA 封装中MEMS 传感器的表面贴装指南
      1.0
      251.2 KB
      PDF
      TN0018

      LGA 封装中MEMS 传感器的表面贴装指南

    • 描述 版本 文档大小 操作
      DT0105
      1-point or 3-point tumble sensor calibration
      1.0
      148.7 KB
      PDF
      DT0053
      6-point tumble sensor calibration
      1.0
      464.9 KB
      PDF
      DT0060
      利用陀螺仪更新倾斜测量和电子罗盘
      1.0
      155.73 KB
      PDF
      DT0047
      How to install and run the osxMotionAR Activity Recognition library
      1.3
      275.96 KB
      PDF
      DT0064
      MEMS 传感器中的噪声分析和识别,Allan,时间,Hadamard,重叠,修正,总体方差
      1.0
      673.72 KB
      PDF
      DT0106
      Residual linear acceleration by gravity subtraction to enable dead-reckoning
      1.0
      192.08 KB
      PDF
      DT0105

      1-point or 3-point tumble sensor calibration

      DT0053

      6-point tumble sensor calibration

      DT0060

      利用陀螺仪更新倾斜测量和电子罗盘

      DT0047

      How to install and run the osxMotionAR Activity Recognition library

      DT0064

      MEMS 传感器中的噪声分析和识别,Allan,时间,Hadamard,重叠,修正,总体方差

      DT0106

      Residual linear acceleration by gravity subtraction to enable dead-reckoning

    • 描述 版本 文档大小 操作
      AN5353
      How to use a sensor on a DIL 24 socket in X-CUBE-MEMS1 package applications
      1.0
      981.19 KB
      PDF
      AN5353

      How to use a sensor on a DIL 24 socket in X-CUBE-MEMS1 package applications

出版刊物和宣传资料

    • 描述 版本 文档大小 操作
      LSM6DSOX iNEMO 6-axis inertial module with Machine Learning core 1.0
      1.05 MB
      PDF
      iNEMO® always-on 6-axis inertial module 1.0
      648.67 KB
      PDF

      LSM6DSOX iNEMO 6-axis inertial module with Machine Learning core

      iNEMO® always-on 6-axis inertial module

    • 描述 版本 文档大小 操作
      MEMS Sensors for automotive applications 1.0
      3.33 MB
      PDF
      MEMS和传感器 智能运动追踪、IoT和增强用户体验 1.0
      11.08 MB
      PDF
      Sensor & motion algorithm software pack for STM32Cube 1.0
      544.58 KB
      PDF

      MEMS Sensors for automotive applications

      MEMS和传感器 智能运动追踪、IoT和增强用户体验

      Sensor & motion algorithm software pack for STM32Cube

产品型号 供货状态 封装 符合RoHS级别 Material Declaration**
LSM6DS3
预览
VFLGA 2.5X3X0.86 14L Ecopack2
LSM6DS3TR
批量生产
VFLGA 2.5X3X0.86 14L Ecopack2

LSM6DS3

Package:

VFLGA 2.5X3X0.86 14L

Material Declaration**:

Marketing Status

预览

Package

VFLGA 2.5X3X0.86 14L

RoHS Compliance Grade

Ecopack2

LSM6DS3TR

Package:

VFLGA 2.5X3X0.86 14L

Material Declaration**:

Marketing Status

批量生产

Package

VFLGA 2.5X3X0.86 14L

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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