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The LSM6DSO is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope boosting performance at 0.55 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.
The LSM6DSO supports main OS requirements, offering real, virtual and batch sensors with 9 kbytes for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DSO has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
The LSM6DSO fully supports EIS and OIS applications as the module includes a dedicated configurable signal processing path for OIS and auxiliary SPI, configurable for both the gyroscope and accelerometer.
High robustness to mechanical shock makes the LSM6DSO the preferred choice of system designers for the creation and manufacturing of reliable products.The LSM6DSO is available in a plastic land grid array (LGA) package.主要特性
- Power consumption: 0.55 mA in combo high-performance mode
- “Always-on" experience with low power consumption for both accelerometer and gyroscope
- Smart FIFO up to 9 kbyte
- Android compliant
- ±2/±4/±8/±16 g full scale
- ±125/±250/±500/±1000/±2000 dps full scale
- Analog supply voltage: 1.71 V to 3.6 V
- Independent IO supply (1.62 V)
- Compact footprint: 2.5 mm x 3 mm x 0.83 mm
- SPI / I²C & MIPI I3CSM serial interface with main processor data synchronization
- Auxiliary SPI for OIS data output for gyroscope and accelerometer
- Advanced pedometer, step detector and step counter
- Significant Motion Detection, Tilt detection
- Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click
- Programmable Finite State Machine: accelerometer, gyroscope and external sensors
- Embedded temperature sensor
- ECOPACK®, RoHS and “Green” compliant
样片和购买
| 产品型号 | 封装 | 包装类型 | 供货状态 | 预算价格(US$) | 数量 | ECCN (US) | Country of Origin | 从分销商订购 | 从ST订购 |
|---|---|---|---|---|---|---|---|---|---|
| LSM6DSOTR | VFLGA2.5X3X.86 14L P.5 L.475X.25 | Tape And Reel | 批量生产 | 1.99 | 1000 | EAR99 | PHILIPPINES | 查看供货情况 | 获取样片 |
| LSM6DSO | VFLGA2.5X3X.86 14L P.5 L.475X.25 | Tray | 评估 | - | - | EAR99 | - | 没有经销商，请联系我们的销售办事处 |
LSM6DSO
封装
VFLGA2.5X3X.86 14L P.5 L.475X.25包装类型
Tray单价(US$)
*精选 视频
LSM6DSOX IMU embeds a Machine Learning Core able to run with only 5 uA, to pre-process and classify information coming from its internal gyro and accelerometer plus up to 4 external sensors to save system-level power since the main MCU can be put in sleep mode for significant amount of time.
A bridge between the sensor on the motherboard and your laptop
生态系统
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Picture 产品型号 制造商 描述 AWS IoT Core AWS AWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices AZURE Cloud Microsoft Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks. Watson IoT Platform IBM IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices. 产品型号AWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices
Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.
IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.
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Picture 产品型号 制造商 描述 
X-NUCLEO-IKS01A3 ST Motion MEMS and environmental sensor expansion board for STM32 Nucleo 产品型号Motion MEMS and environmental sensor expansion board for STM32 Nucleo
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软件
评估工具
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Picture 产品型号 制造商 描述 
STEVAL-MKI196V1 ST LSM6DSO adapter board for a standard DIL24 socket 产品型号LSM6DSO adapter board for a standard DIL24 socket
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Picture 产品型号 制造商 描述 
STEVAL-BCN002V1B ST BlueTile - Bluetooth LE enabled sensor node development kit 产品型号BlueTile - Bluetooth LE enabled sensor node development kit
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支持和应用
| 产品型号 | 供货状态 | 封装 | 符合RoHS级别 | Material Declaration** |
|---|---|---|---|---|
| LSM6DSO | 评估 | VFLGA2.5X3X.86 14L P.5 L.475X.25 | Ecopack2 | |
| LSM6DSOTR | 批量生产 | VFLGA2.5X3X.86 14L P.5 L.475X.25 | Ecopack2 | |
LSM6DSO
Package:
VFLGA2.5X3X.86 14L P.5 L.475X.25Material Declaration**:
LSM6DSOTR
Package:
VFLGA2.5X3X.86 14L P.5 L.475X.25Material Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
