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The LSM6DSOX is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope boosting performance at 0.55 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.
The LSM6DSOX supports main OS requirements, offering real, virtual and batch sensors with 9 kbytes for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DSOX has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
The LSM6DSOX fully supports EIS and OIS applications as the module includes a dedicated configurable signal processing path for OIS and auxiliary SPI, configurable for both the gyroscope and accelerometer. The LSM6DSOX OIS can be configured from the Auxiliary SPI and primary interface (SPI / I²C & MIPI I3CSM).
High robustness to mechanical shock makes the LSM6DSOX the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DSOX is available in a plastic land grid array (LGA) package.主要特性
- Power consumption: 0.55 mA in combo high-performance mode
- “Always-on" experience with low power consumption for both accelerometer and gyroscope
- Smart FIFO up to 9 kbyte
- Android compliant
- ±2/±4/±8/±16 g full scale
- ±125/±250/±500/±1000/±2000 dps full scale
- Analog supply voltage: 1.71 V to 3.6 V
- Independent IO supply (1.62 V)
- Compact footprint: 2.5 mm x 3 mm x 0.83 mm
- SPI / I²C & MIPI I3CSM serial interface with main processor data synchronization
- Auxiliary SPI for OIS data output for gyroscope and accelerometer
- OIS configurable from Aux SPI, primary interface (SPI / I²C & MIPI I3CSM)
- Advanced pedometer, step detector and step counter
- Significant Motion Detection, Tilt detection
- Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click
- Programmable finite state machine: accelerometer, gyroscope and external sensors
- Machine Learning Core
- S4S data synchronization
- Embedded temperature sensor
- ECOPACK®, RoHS and “Green” compliant
精选 视频
This video tutorial shows how to easily configure a silicon-embedded advanced pedometer feature, using ST’s new generation of iNEMO™ Inertial Measurement Units (IMU).
This video on the SensorTile.box Pro Mode shows you how to use this IoT and wearable sensor development kit to create customized wireless applications using an STM32Cube function pack. Use-case on a Human Activity Recognition algorithm included.
Watch this short tutorial on the Expert mode of the SensorTile.box to learn how to use a graphical wizard to build programs without having to write any code.
生态系统
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图片 产品型号 制造商 描述 AWS IoT Core AWS AWS IoT Core是托管的云服务，使连接的设备能够轻松并安全地与云应用和其他设备交互。 AZURE Cloud Microsoft Microsoft Azure是一组不断扩展的云服务，可帮助您的公司解决业务方面的挑战。您可以使用您喜爱的工具和框架，在巨大的全球网络上自由地构建、管理和部署应用。 Watson IoT Platform IBM IBM Watson IoT平台是一种云托管服务，用于简化从物联网设备获取值的过程。 产品型号AWS IoT Core是托管的云服务，使连接的设备能够轻松并安全地与云应用和其他设备交互。
Microsoft Azure是一组不断扩展的云服务，可帮助您的公司解决业务方面的挑战。您可以使用您喜爱的工具和框架，在巨大的全球网络上自由地构建、管理和部署应用。
IBM Watson IoT平台是一种云托管服务，用于简化从物联网设备获取值的过程。
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软件
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图片 产品型号 制造商 描述 
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X-CUBE-ALGOBUILD ST AlgoBuilder firmware template generator expansion for STM32Cube 
X-CUBE-MEMS1 ST STM32Cube的传感器和运动算法软件扩展 产品型号具有基于声音和运动感应的人工智能（AI）应用的超低功耗IoT节点的STM32Cube功能包
SensorTile.box无线多传感器开发套件专业模式的STM32Cube功能包
AlgoBuilder firmware template generator expansion for STM32Cube
STM32Cube的传感器和运动算法软件扩展
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图片 产品型号 制造商 描述 AlgoBuilder ST 算法的图形化设计应用 C-Driver-MEMS ST 独立于标准C平台的驱动，用于MEMS运动和环境传感器 FSM-Examples ST 嵌入式有限状态机功能的配置示例 MLC-Examples ST 嵌入式机器学习核心功能的配置示例 产品型号算法的图形化设计应用
独立于标准C平台的驱动，用于MEMS运动和环境传感器
嵌入式有限状态机功能的配置示例
嵌入式机器学习核心功能的配置示例
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图片 产品型号 制造商 描述 
STBLESensor ST 用于安卓和iOS的BLE传感器应用 产品型号用于安卓和iOS的BLE传感器应用
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评估工具
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图片 产品型号 制造商 描述 
NUCLEO-F401RE ST 采用STM32F401RE MCU的STM32 Nucleo-64开发板，支持Arduino和ST morpho连接 
NUCLEO-L073RZ ST 采用STM32L073RZ MCU的STM32 Nucleo-64开发板，支持Arduino和ST morpho连接 
NUCLEO-L152RE ST 采用STM32L152RE MCU的STM32 Nucleo-64开发板，支持Arduino和ST morpho连接 
NUCLEO-L476RG ST 采用STM32L476RG MCU的STM32 Nucleo-64开发板，支持Arduino和ST morpho连接 
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STEVAL-MKI197V1 ST 面向标准DIL24插座的LSM6DSOX适配器板 STEVAL-MKIT01V2 ST MEMS sensor sample kit 
STEVAL-MKSBOX1V1 ST SensorTile.box无线多传感器开发套件，具有用于IoT和可穿戴传感器应用的用户友好型应用 产品型号采用STM32F401RE MCU的STM32 Nucleo-64开发板，支持Arduino和ST morpho连接
采用STM32L073RZ MCU的STM32 Nucleo-64开发板，支持Arduino和ST morpho连接
采用STM32L152RE MCU的STM32 Nucleo-64开发板，支持Arduino和ST morpho连接
采用STM32L476RG MCU的STM32 Nucleo-64开发板，支持Arduino和ST morpho连接
专业MEMS工具：基于STM32F401VE并与所有ST MEMS适配器兼容的ST MEMS适配器主板
面向标准DIL24插座的LSM6DSOX适配器板
MEMS sensor sample kit
SensorTile.box无线多传感器开发套件，具有用于IoT和可穿戴传感器应用的用户友好型应用
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支持和应用
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 封装 | 包装类型 | 供货状态 | ECCN (US) | Country of Origin | Budgetary Price (US$)*/Qty | |
|---|---|---|---|---|---|---|---|---|---|
| LSM6DSOXTR | 3 distributors | 获取样片 | VFLGA2.5X3X.86 14L P.5 L.475X.25 | Tape And Reel | 批量生产 | EAR99 | PHILIPPINES | 2.5 / 1k |
