The LSM6DSOX is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope boosting performance at 0.55 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.
The LSM6DSOX supports main OS requirements, offering real, virtual and batch sensors with 9 kbytes for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DSOX has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
The LSM6DSOX fully supports EIS and OIS applications as the module includes a dedicated configurable signal processing path for OIS and auxiliary SPI, configurable for both the gyroscope and accelerometer. The LSM6DSOX OIS can be configured from the Auxiliary SPI and primary interface (SPI / I²C & MIPI I3CSM).
High robustness to mechanical shock makes the LSM6DSOX the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DSOX is available in a plastic land grid array (LGA) package.
|DS12814: iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope||3.0||3.12 MB|
|AN5273: LSM6DSOX: Finite State Machine||2.0||1.5 MB|
|AN5259: LSM6DSOX: Machine Learning Core||1.0||2.13 MB|
|AN5272: LSM6DSOX: always-on 3D accelerometer and 3D gyroscope||1.0||1.66 MB|
|TN0018: LGA 封装中MEMS 传感器的表面贴装指南||1.0||251.2 KB|
|DT0105: 1-point or 3-point tumble sensor calibration||1.0||148.7 KB|
|DT0064: MEMS 传感器中的噪声分析和识别，Allan，时间，Hadamard，重叠，修正，总体方差||1.0||673.72 KB|
|DT0106: Residual linear acceleration by gravity subtraction to enable dead-reckoning||1.0||192.08 KB|
|MEMS和传感器 智能运动追踪、IoT和增强用户体验||1.0||11.08 MB|
|Sensor & motion algorithm software pack for STM32Cube||1.0||544.58 KB|
|AWS IoT Core||AWS||AWS IoT Core is a managed cloud platform that lets connected devices easily and securely interact with cloud applications and other devices.|
|AZURE Cloud||Microsoft||Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.|
|Watson IoT Platform||IBM||IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.|
|C-Driver-MEMS||ST||Standard C platform-independent drivers for MEMS motion and environmental sensors|
|STEVAL-MKI197V1||ST||LSM6DSOX adapter board for a standard DIL24 socket|
|型号||Package||Packing Type||Marketing Status||Unit Price (US$) *||Quantity||ECCN (US)||Country of Origin||More info||Order from ST||Order from Distributors|
|LSM6DSOX||VFLGA2.5X3X.86 14L P.5 L.475X.25||Tray||Active : Product is in volume production||-||-||EAR99||-||MORE INFO||No availability reported, please contact our Sales office|
|LSM6DSOXTR||VFLGA2.5X3X.86 14L P.5 L.475X.25||Tape And Reel||Active : Product is in volume production||2.5||1000||EAR99||-||MORE INFO||Free Sample Add to cart||DISTRIBUTOR AVAILABILITY|
|型号||Marketing Status||Package||RoHS Compliance Grade||Material Declaration**|
|LSM6DSOX||Active||VFLGA2.5X3X.86 14L P.5 L.475X.25||Ecopack2|
|LSM6DSOXTR||Active||VFLGA2.5X3X.86 14L P.5 L.475X.25||Ecopack2|
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.