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The IMP34DT05 is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC interface.
The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to producing audio sensors.
The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format.
The IMP34DT05 is a low-distortion digital microphone with a 64 dB signal-to-noise ratio and –26 dBFS ±3 dB sensitivity.
The IMP34DT05 is available in a top-port, SMD-compliant, EMI-shielded package and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.主要特性
- Single supply voltage
- Low power consumption
- AOP = 122.5 dBSPL
- 64 dB signal-to-noise ratio
- Omnidirectional sensitivity
- –26 dBFS ±3 dB sensitivity
- PDM output
- HCLGA package
- Top-port design
- SMD-compliant
- EMI-shielded
- ECOPACK, RoHS, and “Green” compliant
样片和购买
| 产品型号 | 封装 | 包装类型 | 供货状态 | ECCN (US) | Country of Origin | Budgetary Price (US$)*/Qty | 从ST订购 | 从分销商订购 |
|---|---|---|---|---|---|---|---|---|
| IMP34DT05 | HCLGA 4MM X 3 MM X 1.00 MM MICRO | Tray | 预览 | EAR99 | PHILIPPINES | 没有经销商，请联系我们的销售办事处 | ||
| IMP34DT05TR | HCLGA 4MM X 3 MM X 1.00 MM MICRO | Tape And Reel | 批量生产 | EAR99 | PHILIPPINES | 1.4 / 1k | 获取样片 | 查看供货情况 |
IMP34DT05
封装
HCLGA 4MM X 3 MM X 1.00 MM MICRO包装类型
TrayBudgetary Price (US$)*/Qty
精选 视频
This video on the SensorTile.box Pro Mode shows you how to use this IoT and wearable sensor development kit to create customized wireless applications using an STM32Cube function pack. Use-case on a Human Activity Recognition algorithm included.
Watch this short tutorial on the Expert mode of the SensorTile.box to learn how to use a graphical wizard to build programs without having to write any code.
The first video in the SensorTile.box series of short tutorials will guide you through the pre-recorded examples in the device firmware to help you use IoT and wearable sensor applications.
生态系统
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图片 产品型号 制造商 描述 AWS IoT Core AWS AWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices AZURE Cloud Microsoft Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks. Watson IoT Platform IBM IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices. 产品型号AWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices
Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.
IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.
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图片 产品型号 制造商 描述 SensiBLE 2.0 SensiEDGE SensiBLE 2.0 SoM integrates a rechargeable Li-Ion battery, a variety of sensors, and a low power Cortex M0 core that executes Bluetooth protocols. 产品型号SensiBLE 2.0 SoM integrates a rechargeable Li-Ion battery, a variety of sensors, and a low power Cortex M0 core that executes Bluetooth protocols.
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图片 产品型号 制造商 描述 
X-NUCLEO-IKS02A1 ST Motion MEMS and microphone MEMS expansion board for STM32 Nucleo 产品型号Motion MEMS and microphone MEMS expansion board for STM32 Nucleo
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评估工具
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图片 产品型号 制造商 描述 
STEVAL-MIC003V1 ST Microphone coupon board based on the IMP34DT05 digital MEMS 产品型号Microphone coupon board based on the IMP34DT05 digital MEMS
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支持和应用
| 产品型号 | 供货状态 | 封装 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|
| IMP34DT05 | 预览 | HCLGA 4MM X 3 MM X 1.00 MM MICRO | Ecopack2 | |
| IMP34DT05TR | 批量生产 | HCLGA 4MM X 3 MM X 1.00 MM MICRO | Ecopack2 |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持 。
