ST Authorized Partners offer different levels of integrated hardware based on ST components, ensuring fast development and an optimized BOM for your final product.
Hardware integrated devices may include:
Optimized hardware modules including system-on-module (SOM) and system-in-package (SiP) solutions that can be integrated in final hardware platforms
Product accelerators : form factor hardware platforms that support dedicated use-cases and can be customized to fit final product needs
Standalone hardware available for a larger variety of platforms that can be used in final products
The ST Partner Program connects customers to a network of Authorized Partners, chosen through an exacting and rigorous selection process, that provide technical support to help you find the best solution to drive innovation.
These Authorized companies offer specific expertise with complementary services and products to reduce development time and cost and shorten customers time-to-market for higher market share, revenue and create new business opportunities.
- YouTransactor STM32 LP452 Core Secure Chip for connected objects
- neqto: Bridge LTE LTE module ready to be quickly packaged with mass produced products
- TnL-FIR103 TapNLink BLE/NFC module connects STM32 designs to mobiles for off-board Human-Machine Interfaces (HMI)
- Modular IoT Gateway DRC (Din Rail Controller) 模块化物联网网关实现传感器、物联网模块和智能设备之间的互连和/或云连接
- TnL-FIW103 TapNLink Wi-Fi, BLE, NFC module connects STM32 designs to mobiles for off-board Human-Machine Interfaces (HMI) or to the Cloud
- SensiSUB 将低功耗SUB 1GHZ RF收发器连接到云，具有完全可定制的传感器、ARM® 32位Cortex®-M4 CPU和纽扣电池。
- RC-SPIRIT2-XXX ULP sub 1GHz Xchannels Radio Transceiver module
- Outdoor positionning module The module is a GNSS receiver module with dead recognition
- SPC5-L9177A-K02 Reference Design Small Engine Application reference design
- SENSORIIS Collects environmental data and transfers it to the Cloud through selected IoT networks
- Dual IO-Link Communication protocol for industrial sensors and actuators
- rapidM2M M230 RapidM2M模块M230是一款高性能智能GSM模块，用于记录、处理和传输设备信息
- WS2119-A0 World's first SigFox-certified BLE+SigFox dual mode modules
- EPS technology SK202 GigE非接触式连接。
- TnP-NSR103 TapNPass Nomad BLE/NFC wireless adapters connect mobiles to electronic systems for off-board Human Machine Interfaces (HMI)
- RC-WLE5-868 LP radio module with a high-perf. processing unit
- TnP-FSR103 TapNPass Fixed BLE/NFC wireless adapters connect mobiles to electronic systems for off-boarding Human-Machine Interfaces (HMI)
- SIGFOX-MOD1-C / -E SIGFOX-MOD1是一种超低功耗模块，专为安装了芯片天线的传感器节点应用而设计。
- OSD32MP15x System-in-Package Module 系统级封装将STM32MP1、STPMIC1A、至多1GB DDR3、2个MEMS振荡器、EEPROM和无源器件集成到一个18mm X 18mm 302引脚BGA中（间距1mm）。
- SensiBLE 2.0 SensiBLE 2.0 SoM集成了可充电锂离子电池、各种传感器和执行蓝牙协议的低功耗Cortex M0核心。
- OBC42-1 On-Board Charger with 22kW SiC-power
- WB2072-00 BLE Module with MCU
- WS2116-A0 Sigfox global roaming "Monarch" + BLE
- SPEEDY BOARD Professional 3D Printer Controller 3D printer controller for FFF/FDM printer for robotics
- LS53L0X ToF Module Programmable, plug&play and accurate compact solution to measure a distance
- Sigfox Monarch roaming module SRM100A Sigfox roaming module/ ST LIB+Sigfox LIB+Wisol F/W / Sigfox
- Grove LoRa E5 Easy-to-use wireless radio module, supporting LoRaWAN protocol (Seeed Grove Ecosystem)
- LSM100A LoRa and Sigfox module 面向Sigfox(RC1) + LoRaWAN的混合模块
- SIGFOX-MOD2-C / -E Ultra LP Uplink-Only modules for sensor node apps
- UONE 用于安全物联网连接的隔离密码模块
- QSMP-1530 QSMP-1530 System-on-Modules:100-pin QFN Solder-down
- MUSE Multi Sensor Cutting-edge multisensor embedded platform
- QSMP-1510 QSMP-1510 System-on-Modules:100-pin QFN Solder-down
- emSTAMP-Argon STM32MP1 module for a powerful embedded solution with Linux or Android
- emSTAMP-Neon-CM4 Solder-on module with Cortex-M4 STM32F4
- DHCOM STM32MP1 Pluggable computer module series (SODIMM-200)
- EMB1061 EMB1061是使用ST BlueNRG-132的低功耗蓝牙模块
- DHCOR STM32MP1 Solderable computer module series (29x29mm²)
- WPAN (BLE) module 基于意法半导体技术的BLE独立模块
- ThinTrack 基于4G/5G和GPS通信的超薄、紧凑型资产跟踪解决方案
- SPARK SR1010/SR1020 Ultra-Wideband Radio Modules Wireless transceiver modules to bring UWB ST SensorTile
- EDT Smart Embedded Display Modules enables user to add High End Graphics to any product in a very short time
- AcSiP ST50H ST50H集成式STM32WL微控制器，支持多种调制，支持LPWAN物联网应用
- FSM-9 High performance Fully calibrated 9-axis IMU / AHRS module
- TXMP-1570 TXMP-1570 System on Module: 200-pin SODIMM plug-in
- TXMP-1530 TXMP-1530 System on Module: 200-pin SODIMM plug-in
- IMU383ZA High-performance inertial platform
- CCSoM IoTecha's Combo Charger System (CCS) on Module
- PRoC-A Low-power bluetooth module for IoT applications
- LoRa FMLR RF module LoRaWAN sensor transceiver and gateway card
- CM-150 CM-150 controller is used with ROBOTIS DREAM
- iMCP HT32SX System-in-package with low power transceiver & power amplifier as ready-to-use Sigfox connectivity solution for IoT
- MAMWLExx LP无线电模块配备高性能处理单元
- Twilio Electric Imp imp003 Highly integrated IoT module with WiFi
- SWAN2 采用电池供电的壁装式或杆装式网关
- Twilio Electric Imp imp004 Highly integrated IoT module with WiFi /BT/MCU
- RF Modules Sub GigaHz和蓝牙的RF模块。
- LS53LX-S-L0 ToF Module Breakout board with VL53L0X & independent LED & level shifter on all pins
- SOM-STM32MP1 Emcraft STM32MP1单板模块组合了STM32MP157多核微处理器与最高1GB DDR3L、最高64GB eMMC和1Gb以太网PHY。
- LoRAWAN module 意法半导体出品的LoRAWAN独立式模块
- Nextent Tag Collective Physical Distancing System using BlueNRG-M2
- JPE 61850 Apis 高级硬件模块支持在IEC 61850网络中运行的IED与不支持本标准的其他设备之间进行通信
- Nextent Tego Personal Physical Distancing Device using ToF VL53L1X
- Precision GNSS Module mPCIe精密GNSS接收器，配ST Teseo V GNSS芯片组与ASM330LHH IMU
- RC-S2LP-XXX-HA 超低功耗sub-1GHz多通道无线电收发器模块，基于工作频率为868Mhz和915Mhz并具有立体螺旋天线的ST S2-LP收发器
- STM32F4 System-on-Module (SOM-STM32F4) STM32F4 SOM将180 MHz Arm Cortex-M4 STM32F429微控制器与32 MB SDRAM、16 MB NOR Flash和以太网PHY缓冲器组合到一块板中。
- STM32F7 System-on-Module (SOM-STM32F7) STM32F7 SOM将216 MHz 32位Arm Cortex-M7处理器核心与最高64 MB SDRAM、16 MB NOR Flash和以太网PHY组合到一块板中。
- LS53LX-S-L1 ToF Module Breakout board with Saber Sensor VL53L1CB
- Rosenberger Proximity Connector (RoProxCon) 预配置的传输模块，用于为客户电子设备配备全双工传输，以实现全旋转应用
- Talaria TWO Modules INP1010/INP1011 Ultra-Low Power WiFi + BLE Module
- Maja AirData AV1 AV-1是用于自主系统数据回传的专利型通信模块
- Maja AirData RL 荣获专利的60GHz mmW模块，配备SPL60天线
- LS53LX-S-L3 ToF Module Breakout board with Saber Sensor VL53L3CX
- Vallarta Sub 1-GHz通信SOM（基于STM32WL55）
- PA193 PA193是一种外形超紧凑的产品加速器，用于IoT应用。
- TeraRanger Hub Connect up to 8 TeraRanger distance sensors
- emSTAMP-Neon-CM7 Solder-on module with Cortex-M7 STM32F7
- BlackMoon Sub 1-GHz通信SOM面向Sigfox和6loWPAN
- TeraRanger Evo LED rangefinder for robotics automation and smart city
- TeraRanger Multiflex Modular sensor kit for short range distance apps
- PA192 PA192是用于音频分析的产品加速器，特别适合在小巧的纽扣形外形中提供传感器、处理和无线传输的语音识别和语音辅助应用。
- SensiBLE 即用型BLE模块上系统包含了传感器、低功耗ARM® 32位Cortex®-M4 CPU和纽扣电池。立即行动，加快IoT产品开发速度！
- LoRa E5 Module Module featuring ARM Cortex-M4 and SX126x embedded, supports LoRaWAN on EU868 & US915
- PAN 3012 Designed for Environmental applications
- PAN 3013 Designed for Smart Industry robotics applications
- PAN 3011 Designed for Voice Command applications
- MultiTech xDot 安全的CE/FCC认证低功耗RF模块提供与传感器、工业设备和远程电气用具之间的长距离低比特率连接。
- phyCORE-STM32MP1 模块上系统提供安全启动、多协议吉比特工业通信、3D图形处理单元和功能安全特性。
- SensorTile.box Evaluation kit IoT node made up of an electronics board, a lithium rechargeble battery, a plastic housing and APP
- SensiBLE 2.1 低功耗单核心（SOC）片上系统采用32MHz 32位ARM® Cortex®-M0 MCU、认证的蓝牙低功耗（BLE）v5.2
- MultiTech mDot 经济实惠的LoRaWAN RF模块，超过10英里的双向通信，具有出色的抗噪性，并能穿透建筑物。
- System on Module: byteENGINE STM32MP1 基于STM32MP1 MPU系列的模块上系统
- LOM202A00 LoRa module Most compact size module for South Korea 920-923MH
- Octave Smart Modules Octave支持LPWA/LTE-M连接和2G回退，适用于世界上任何蜂窝网络
- PHOENIX-W / PHOENIX-M Wireless M-Bus/ OMS radio module
- MultiTech Dragonfly 这些蜂窝SoM是经过完全认证/MNO批准的模块，提供了具有板载蜂窝无线电的可编程计算平台。
- MicroGEA STM32MP1 基于STM32MP157的微型SOM
- i.Core STM32MP1 基于STM32MP157的SODIMM式SOM
- RC-SPIRIT1-868 超低功耗sub-1GHz多通道无线电收发器模块，基于工作频率为868Mhz的ST Spirit1收发器
- OpenRTK330LI High performance GNSS receiver with sensors
- RC-S2LP-XXX 超低功耗sub-1GHz多通道无线电收发器模块，基于工作频率为434Mhz的ST S2-LP收发器
- QSMP-SV57 QSMP-SV57 System-on-Modules:100-pin QFN Solder-down
- QSMP-1570 QSMP-1570 System-on-Modules: 100-pin QFN Solder-down
- DRACONAV DRACONAV是一种完全集成且安全的多GNSS模块，用于提高计算位置、速度和时间的可靠性和弹性。
- VisionSOM-STM32MP1 基于STM32MP157处理器的SODIMM200外形嵌入式计算机。
- Digi ConnectCore MP157 SOM 联网的智能、安全嵌入式系统化模块，基于STM32MP157C
- DAVE ETRA SOM Low power consumption module based on ARM Dual Cortex-A7 architecture
- MAIA 868 MHz射频模块，用于无线M-Bus和OMS应用
- SensiGFOX 2.0 可穿戴Sigfox传感器即插即用SoM
- SensiLoRa 2.0 可穿戴LoRa传感器即插即用SoM
- STACKFORCE wM-Bus-to-LPWAN Bridge Bridge for receiving telegrams sent by devices
- DAVE ETRA SBC Module ready to use for industrial application based on ARM Dual Cortex-A7 architecture
- JPE 61850 Papilio Module allowing integration of IoT devices and IEDs to the grid
- TnL-FIT203 TapNLink NFC module connects STM32 designs to mobiles for off-board Human-Machine Interfaces (HMI)
- Riverdi STM32 Displays 高亮度IPS显示器系列采用STM32板件