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The HSP053-4M5 is a 4 channel ESD array with a rail to rail architecture designed specifically for the protection of high speed differential lines.
The device is packaged in μQFN 1.3 mm x 0.8 mm with a 500 μm pitch.
主要特性
- Very compact 500 µm pitch package, for easy PCB layout
- Ultra-large bandwidth: 18 GHz
- Ultra-low capacitance: 0.15 pF (I/O to I/O) and 0.25 pF (I/O to GND)
- Low leakage current: < 1 nA
- Extended operating junction temperature range: -40 °C to 150 °C
- Thin package: 0.4 mm max.
- RoHS compliant
样片和购买
| 产品型号 | 供货状态 | Breakdown Voltage (V) (min) | Directionality | 封装 | 包装类型 | 预算价格(US$) | 数量 | ECCN (US) | Country of Origin | 更多信息 | 从分销商订购 | 从ST订购 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| HSP053-4M5 |
Active
|
5.3 | Uni-Directional | uDFN-5L | Tape And Reel | 0.063 | 1000 | EAR99 | CHINA | 查看供货情况 | 立即购买 |
(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
精选 视频
In this video, we explain why it is important to protect against electrostatic discharges. We give a quick demonstration to show exactly what happens when you shoot at a microcontroller with an ESD gun!
Introduction to surges – EOS and ESD – definition, standards, effects and root cause
设计工具
开发工具硬件
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Picture 产品型号 制造商 Description 
ST Protection Finder ST Protection product finder application for Android and iOS 产品型号Protection product finder application for Android and iOS
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(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
