Product overview
描述
The HSP053-4M5 is a 4 channel ESD array with a rail to rail architecture designed specifically for the protection of high speed differential lines. The device is packaged in μQFN 1.3 mm x 0.8 mm with a 500 μm pitch.-
All features
- Very compact 500 µm pitch package, for easy PCB layout
- Ultra-large bandwidth: 18 GHz
- Ultra-low capacitance: 0.15 pF (I/O to I/O) and 0.25 pF (I/O to GND)
- Low leakage current: < 1 nA
- Extended operating junction temperature range: -40 °C to 150 °C
- Thin package: 0.4 mm max.
- RoHS compliant
精选 视频
All tools & software
All resources
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产品规格 (1)
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14 May 2018
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应用手册 (4)
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技术文档 (2)
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简报 (4)
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宣传册 (2)
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手册 (1)
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29 Jun 2020 |
29 Jun 2020
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EDA Symbols, Footprints and 3D Models
样片和购买
产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度(ºC) | Breakdown Voltage (V) (min) | Directionality | Country of Origin | Budgetary Price (US$)*/Qty | 更多信息 | ||
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最小值 | 最大值 | ||||||||||||||
HSP053-4M5 | 无法联系到经销商,请联系我们的销售办事处 |
批量生产
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EAR99 | NEC | Tape And Reel | uDFN-5L | - | - | 5.3 | Uni-Directional | CHINA | 0.052 / 1k |
供货状态
批量生产ECCN (US)
EAR99Budgetary Price (US$)*/Qty
0.052 / 1k