SL-PREDMNT-S2C

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Vibration, ultrasound and environmental sensor nodes for condition monitoring with Wi-Fi and cellular connectivity to cloud applications

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Solution Description

该状态监测和预测性维护框架将收集振动、超声波和环境数据的智能传感器节点与Wi-Fi或蜂窝连接结合到一个中央数据湖(如云服务)。

关键振动数据由一个STM32L4 +微控制器在本地进行处理 - 结合6kHz IIS3DWB振动传感器的3轴加速数据和MP23ABS1麦克风传感器的超声数据(可达80kHz) - 以便产生频率和时域分析(FFT、RM、以及峰值加速度)等信息。环境压力、温度和湿度数据也由节点上嵌入的LPS22HB和HTS221传感器采集。

MCU和传感器非常低的功率要求支持使用由STBC02电池充电器驱动的紧凑型电池供电节点。

STM32L4+微控制器支持通过附加Wi-Fi模块(如Inventek ISM43362.M3G-L44)或蜂窝调制解调器(如Quectel BG9,它支持通过塑料Micro-SIM(3FF)实现LTE Cat M1和NB-IoT连接)进行无线数据传输。

意法半导体提供基于AWS IoT核心和其他AWS服务的预测性维护仪表板应用程序,以提供节点、图示数据和配置触发器作为端到端解决方案的一部分

 

 

 

 

 

 

  • Key Product Benefits

    STM32L4R9ZI - Ultra-low power MCU plus high speed EEPROM

    Ultra-low-power microcontroller based on ultra-low power Arm Cortex-M4 32-bit RISC core with single-precision floating-point unit (FPU), digital signal processing (DSP) and memory protection (MPU) unit. This MCU allows high speed sensor data streaming at the maximum ODR, and the 2MB Flash can host machine learning algorithms for anomaly detection

    IIS3DWB -  Ultra-wide band vibration sensor

    Ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration sensor is highly suited to applications involving vibration analysis up to 6kHz, both in terms of performance and cost.

    LPS22HB and HTS221 - High accuracy environmental sensors

    The LPSSHB digital pressure and HTS221 relative humidity and temperature sensors complete the data requirements for a comprehensive condition monitoring scenario.

     

    MP23ABS1 - Wideband MEMS microphone

    The wideband analog MEMS microphone up to 80kHz allows vibration data collection and analysis well into the ultrasound frequency range.