Product overview
Description
The STiD135 has been designed for Satellite Broadband applications, leveraging Ka-band and multi-spot beam technology carried by the latest high-throughput satellites (HTSs). The STiD135 has been designed to enable single-carrier usage of HTS transponders. The device implements two high-symbol-rate (HSR) demodulators compliant with Annex M of the DVB-S2/S2X specification, and provides full hardware support for network clock recovery (NCR) in order to enable external return-channel modulators.The STiD135 may be used in standard broadcast environments as an 8-channel DVB-S2/S2X receiver enabling multi-channel distribution and/or fast channel change scenarios.
Acknowledgement
(1)The HSR feature was designed in partnership with the CNES
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All features
- Two high-symbol-rate (HSR)(1)demodulators:
- Maximum baud rate 500 Msymbol/s
- Up to two slices each
- DVB-S2/S2X and Annex M compliant
- Up to 8 multi-standard demodulators:
- S/S2/S2X/DTV
- Four integrated full-band tuners and ADCs
- High-speed digital multiplexer to connect any tuner to any demodulator
- Network clock recovery (NCR) support
- Flexible transport stream processor:
- PID filtering, PCR re-stamping and re-labelling, GSE label filtering
- TS merger (multiplex)
- Channel bonding
- Low power consumption
- Wake-on-network PID or GSE label
- Fast auto scan
- Signal monitoring, spectral analysis, bit error rate test and reporting
- Interfaces:
- Crystal oscillator
- I2C serial bus interface, including private repeater for optional LNA
- Transport stream output: 8 serial, 2 parallel or multiplexed
- JTAG for boundary scan
- DiSEqC 1.x and DiSEqC2.x compatible receiver, 22-kHz
- FSK modem
- Flexible GPIOs and interrupts
- Technology:
- Single rail supply with inbuilt SMPSs
- Fine-grained power management
- VQFPN-mr 13x13 mm2 package, RoHS
- Temperature range -40 to +85 °C ambient
- Two high-symbol-rate (HSR)(1)demodulators:
All resources
| Resource title | Latest update |
|---|
Product Specifications (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 22 Jan 2018 | 22 Jan 2018 |
Flyers (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 03 Mar 2017 | 03 Mar 2017 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - STiD135
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Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| STID135-WB | Active | VQFPN-MR 13X13 160 | Industrial | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||
| STID135-WB | No availability of distributors reported, please contact our sales office | Active | 3A991A2 | NEC_E | Tray | VQFPN-MR 13X13 160 | - | - | CHINA | |||
Marketing Status
ActiveECCN (US)
3A991A2Budgetary Price (US$)*/Qty
(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
