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The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 GHz.
This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.
Key Features
- Very low profile
- High RF performance
- PCB space saving
- Efficient manufacturability
- LGA footprint compatible
- Low thickness ≤ 450 µm
Sample & Buy
| Part Number | Package | Packing Type | Minimum Sellable Quantity | Marketing Status | ECCN (US) | Country of Origin | Budgetary Price (US$)*/Qty | Order from ST | Order from Distributors |
|---|---|---|---|---|---|---|---|---|---|
| BAL-UWB-01E3 | FLIP CHIP BUMPLESS CSPG | Tape And Reel | 5000 | Active | EAR99 | CHINA | Check Availability |
BAL-UWB-01E3
Package
FLIP CHIP BUMPLESS CSPGPacking Type
Tape And ReelBudgetary Price (US$)*/Qty
(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
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| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| BAL-UWB-01E3 | Active | FLIP CHIP BUMPLESS CSPG | Industrial | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
