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The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 GHz.
This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.
Key Features
- Very low profile
- High RF performance
- PCB space saving
- Efficient manufacturability
- LGA footprint compatible
- Low thickness ≤ 450 µm
Sample & Buy
| Part Number | Package | Packing Type | Minimum Sellable Quantity | Marketing Status | Budgetary Price (US$)* | Quantity | ECCN (US) | Country of Origin | Order from Distributors | Order from ST |
|---|---|---|---|---|---|---|---|---|---|---|
| BAL-UWB-01E3 | FLIP CHIP BUMPLESS CSPG | Tape And Reel | 5000 |
Active
|
0.2135 | 500 | EAR99 | CHINA | Check Availability | Buy now |
(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
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| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| BAL-UWB-01E3 |
Active
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FLIP CHIP BUMPLESS CSPG | Industrial | Ecopack2 |
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BAL-UWB-01E3
Package:
FLIP CHIP BUMPLESS CSPGMaterial Declaration**:
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
