Product overview
Description
The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 GHz. This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.-
All features
- Very low profile
- High RF performance
- PCB space saving
- Efficient manufacturability
- LGA footprint compatible
- Low thickness ≤ 450 µm
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All resources
| Resource title | Latest update |
|---|
Product Specifications (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 23 Dec 2020 | 23 Dec 2020 |
Application Notes (3)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 13 Sep 2018 | 13 Sep 2018 | |||
| 13 Sep 2018 | 13 Sep 2018 | |||
| 22 Sep 2015 | 22 Sep 2015 |
Technical Notes & Articles (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 25 Aug 2020 | 25 Aug 2020 |
Flyers (2)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 05 Nov 2020 | 05 Nov 2020 | |||
| 25 Feb 2020 | 25 Feb 2020 |
Brochures (2)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 08 Apr 2021 | 08 Apr 2021 | |||
| 19 Sep 2019 | 19 Sep 2019 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - BAL-UWB-01E3
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
Quality and Reliability
| Part Number | Marketing Status | Package | Grade | RoHS Compliance Grade | Material Declaration** |
|---|---|---|---|---|---|
| BAL-UWB-01E3 | Active | FLIP CHIP BUMPLESS CSPG | Industrial | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
Sample & Buy
| Part Number | Order from Distributors | Order from ST | Marketing Status | ECCN (US) | ECCN (EU) | Packing Type | Package | Temperature (°C) | Minimum Sellable Quantity | Country of Origin | Budgetary Price (US$)*/Qty | More info | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| min | max | |||||||||||||
| BAL-UWB-01E3 | 3 distributors | Buy Direct | Active | EAR99 | NEC | Tape And Reel | FLIP CHIP BUMPLESS CSPG | -40 | 105 | 5000 | CHINA | |||
(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
