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  • This device is an ultra-miniature matched balun. Matching impedance has been optimized for the ATMEL SmartConnect WILC1000 Wireless Link Controller. It is using STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance.

    Key Features

    • 2.45 GHz Balun with integrated matching network
    • Matching optimized for ATMEL WILC1000
    • Low insertion loss
    • Low amplitude imbalance
    • Coated Flip-Chip on glass
    • Small footprint < 0.90 mm²

Sample & Buy

Part Number
Package
Packing Type
Minimum Sellable Quantity
Marketing Status
ECCN (US)
Country of Origin
Budgetary Price (US$)*/Qty
Order from ST
Order from Distributors
BAL-WILC10-01D3 Chip Scale Package 0.4mm pitch Tape And Reel 5000
Active
EAR99 FRANCE No availability of distributors reported, please contact our sales office

BAL-WILC10-01D3

Package

Chip Scale Package 0.4mm pitch

Packing Type

Tape And Reel

Budgetary Price (US$)*/Qty

Minimum Sellable Quantity

5000

Marketing Status

Active

Budgetary Price (US$)* / Qty

ECCN (US)

EAR99

Country of Origin

FRANCE

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

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00 Files selected for download

Technical Documentation

    • Description Version Size Action
      DS12060
      50 Ω / conjugate match to WILC1000 transformer Balun
      1.0
      635.52 KB
      PDF
      DS12060

      50 Ω / conjugate match to WILC1000 transformer Balun

    • Description Version Size Action
      AN4315
      BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers
      2.2
      687.23 KB
      PDF
      AN2348
      IPAD™ 400 µm Flip Chip: package description and recommendations for use
      5.0
      261.7 KB
      PDF
      AN1235
      IPAD™ 500 µm Flip Chip: package description and recommendations for use
      8.0
      251.82 KB
      PDF
      AN4315

      BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers

      AN2348

      IPAD™ 400 µm Flip Chip: package description and recommendations for use

      AN1235

      IPAD™ 500 µm Flip Chip: package description and recommendations for use

    • Description Version Size Action
      TN1173
      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches
      7.0
      433.12 KB
      PDF
      TN1173

      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches

HW Model, CAD Libraries & SVD

    • Description Version Size Action
      bal-wilc10-01d3 OrCad Symbol and Footprint files 1.2
      12.18 KB
      ZIP

      bal-wilc10-01d3 OrCad Symbol and Footprint files

Publications and Collaterals

    • Description Version Size Action
      Tiniest Matched Baluns for Wifi, Bluetooth & Sub-GHz 1.0
      951.55 KB
      PDF

      Tiniest Matched Baluns for Wifi, Bluetooth & Sub-GHz

    • Description Version Size Action
      Products and solutions for Smart industry 3.0
      2.99 MB
      PDF
      Semiconductor solutions for healthcare applications 1.0
      665.18 KB
      PDF

      Products and solutions for Smart industry

      Semiconductor solutions for healthcare applications

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
BAL-WILC10-01D3
Active
Chip Scale Package 0.4mm pitch Industrial Ecopack2

BAL-WILC10-01D3

Package:

Chip Scale Package 0.4mm pitch

Material Declaration**:

PDF XML

Marketing Status

Active

Package

Chip Scale Package 0.4mm pitch

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.