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BAL-WILC10-01D3

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50 Ω / Conjugate match to WILC1000 Transformer Balun

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Product overview

Description

This device is an ultra-miniature matched balun. Matching impedance has been optimized for the ATMEL SmartConnect WILC1000 Wireless Link Controller.
It is using STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance.

  • All features

    • 2.45 GHz Balun with integrated matching network
    • Matching optimized for ATMEL WILC1000
    • Low insertion loss
    • Low amplitude imbalance
    • Coated Flip-Chip on glass
    • Small footprint < 0.90 mm²
    • Benefits
      • Very low profile
      • High RF performance
      • PCB space saving versus discrete solution
      • BOM count reduction
      • Efficient manufacturability
    Read more Read less

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Related Applications

Industrial

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Product Specifications (1)

Resource title
Latest update
DS12060 50 Ω / conjugate match to WILC1000 transformer Balun 2.0
04 Dec 2020
04 Dec 2020
DS12060 50 Ω / conjugate match to WILC1000 transformer Balun 2.0

Application Notes (3)

Resource title
Latest update
AN4315 BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers 2.2
13 Sep 2018
13 Sep 2018
AN4315 BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers 2.2
AN2348 IPAD™ 400 µm Flip Chip: package description and recommendations for use 5.0
13 Sep 2018
13 Sep 2018
AN2348 IPAD™ 400 µm Flip Chip: package description and recommendations for use 5.0
AN1235 IPAD™ 500 µm Flip Chip: package description and recommendations for use 8.0
22 Sep 2015
22 Sep 2015
AN1235 IPAD™ 500 µm Flip Chip: package description and recommendations for use 8.0

Technical Notes & Articles (1)

Resource title
Latest update
TN1173 Packing information for IPAD, protection, rectifiers, thyristors and AC Switches 8.0
25 Aug 2020
25 Aug 2020
TN1173 Packing information for IPAD, protection, rectifiers, thyristors and AC Switches 8.0

Flyers (2)

Resource title
Latest update
TINIEST MATCHED BALUNS for WiFi, Bluetooth & Sub-GHz 1.0
05 Nov 2020
05 Nov 2020
TINIEST MATCHED BALUNS for WiFi, Bluetooth & Sub-GHz 1.0
Tiniest Matched Baluns for Wifi, Bluetooth & Sub-GHz 1.0
25 Feb 2020
25 Feb 2020
Tiniest Matched Baluns for Wifi, Bluetooth & Sub-GHz 1.0

Brochures (2)

Resource title
Latest update
Products and solutions for Smart industry 04.21
08 Apr 2021
08 Apr 2021
Products and solutions for Smart industry 04.21
Semiconductor solutions for healthcare applications 1.0
19 Sep 2019
19 Sep 2019
Semiconductor solutions for healthcare applications 1.0

EDA Symbols, Footprints and 3D Models

STMicroelectronics - BAL-WILC10-01D3

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

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CAD Symbol & Footprint models (1)

Resource title
Latest update
bal-wilc10-01d3 OrCad Symbol and Footprint files 1.2
18 Mar 2020
18 Mar 2020
bal-wilc10-01d3 OrCad Symbol and Footprint files 1.2

Quality and Reliability

Part Number Marketing Status Package Grade RoHS Compliance Grade Material Declaration**
BAL-WILC10-01D3
Active
Chip Scale Package 0.4mm pitch Industrial Ecopack2

BAL-WILC10-01D3

Package:

Chip Scale Package 0.4mm pitch

Material Declaration**:

PDF XML
More Info

Marketing Status

Active

Package

Chip Scale Package 0.4mm pitch

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

Sample & Buy

Part Number
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Order from ST
Marketing Status
ECCN (US)
ECCN (EU)
Packing Type
Package
Temperature (°C) Minimum Sellable Quantity
Budgetary Price (US$)*/Qty
More info
min
max
BAL-WILC10-01D3 No availability of distributors reported, please contact our sales office
Active
EAR99 NEC Tape And Reel Chip Scale Package 0.4mm pitch - - 5000
MORE INFO

Unit Price (US$):

-

Country of Origin:

FRANCE

BAL-WILC10-01D3

Marketing Status

Active

ECCN (US)

EAR99
More Info

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

Packing Type

Tape And Reel

Package

Chip Scale Package 0.4mm pitch

Operating Temperature (°C)

(min)

-

(max)

-

Minimum Sellable Quantity

5000

Budgetary Price (US$)* / Qty

Country of Origin

FRANCE

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

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