The BALF-ATM-01E3 from STMicroelectronics is an integrated balun, which also integrates a matching network in a monolithic glass substrate. Matching impedance has been customized for the ATMEL chip. The device uses STMicroelectronics’ IPD technology on a non-conductive glass substrate to optimize RF performance.
- 2.4 – 2.5 GHz balun with integrated matching network
- Matching optimized for following chipsets: ATSAMR21E18
- Low insertion loss
- Low amplitude imbalance
- Low phase imbalance
- Coated CSP on glass bumpless
- Small footprint 2.5 mm²
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|Part Number||Marketing Status||Package||Grade||RoHS Compliance Grade||Material Declaration**|
|FLIP CHIP BUMPLESS CSPG||Industrial||Ecopack2|
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.