STMicroelectronics' BALF-CC26-05D3 is an ultra-miniature balun, integrating both matching network and harmonics filter.
Matching impedance has been customized for the TI CC26xx series 5x5 SimpleLink™ multistandard wireless MCU.
The device uses STMicroelectronics' IPD technology on a non-conductive glass substrate, which optimizes RF performance.
- 2.45 GHz balun with integrated matching network
- Matching optimized for CC26 series 5×5 external differential
- Low insertion loss
- Low amplitude imbalance
- Low phase imbalance
- Coated Flip-Chip on glass
- Small footprint < 1.5 mm²
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|Part Number||Marketing Status||Package||Grade||RoHS Compliance Grade||Material Declaration**|
|Chip Scale Package 0.4mm pitch||Industrial||Ecopack2|
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.